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Author :
Publisher :
ISBN 13 :
Total Pages : 440 pages
Book Rating : 4.3/5 (91 download)
Download or read book Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics written by and published by . This book was released on 2004 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : G. S. Oehrlein
Publisher : Cambridge University Press
ISBN 13 : 9781107413153
Total Pages : 614 pages
Book Rating : 4.4/5 (131 download)
Download or read book Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: written by G. S. Oehrlein and published by Cambridge University Press. This book was released on 2014-06-05 with total page 614 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.
Author : R. J. Carter
Publisher :
ISBN 13 :
Total Pages : 432 pages
Book Rating : 4.:/5 (318 download)
Download or read book Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics - 2004 written by R. J. Carter and published by . This book was released on 2004-09 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Author :
Publisher :
ISBN 13 : 9781558996502
Total Pages : 107 pages
Book Rating : 4.9/5 (965 download)
Download or read book Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics II written by and published by . This book was released on 2001 with total page 107 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Materials Research Society. Meeting
Publisher :
ISBN 13 :
Total Pages : 544 pages
Book Rating : 4.:/5 (318 download)
Download or read book Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics, 2003 written by Materials Research Society. Meeting and published by . This book was released on 2003 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Paul R. Besser
Publisher : Cambridge University Press
ISBN 13 : 9781107408982
Total Pages : 430 pages
Book Rating : 4.4/5 (89 download)
Download or read book Materials, Technology and Reliability for Advanced Interconnects 2005: written by Paul R. Besser and published by Cambridge University Press. This book was released on 2014-06-05 with total page 430 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, first published in 2005, brings together leading modelers and experimentalists to discuss the plethora of process and reliability issues associated with depositing, characterizing and integrating novel and existing barriers, metals and ultralow-k dielectrics into reliable high-performance interconnects that can be robustly packaged. Section I focuses on low-k dielectric integration. Manuscripts highlight the importance of interface integrity and adhesion, the issue of process-induced dielectric damage and the need for pore sealing methods for low-k films. Channel cracking is addressed by several contributions. Cu metallization and barrier challenges are discussed in a section on metallization. Mechanical stress is highlighted in a reliability section. Contributions here provide a fundamental understanding of the issues of stress and stress relaxation in Cu films and lines encapsulated in low-k dielectrics. Presentations on electromigration, leakage and time-dependent dielectric breakdown, as well as thermal and mechanical fatigue, are also featured.
Author : Tapan Gupta
Publisher : Springer Science & Business Media
ISBN 13 : 1441900764
Total Pages : 423 pages
Book Rating : 4.4/5 (419 download)
Download or read book Copper Interconnect Technology written by Tapan Gupta and published by Springer Science & Business Media. This book was released on 2010-01-22 with total page 423 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Author :
Publisher :
ISBN 13 :
Total Pages : 624 pages
Book Rating : 4.:/5 (318 download)
Download or read book Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics written by and published by . This book was released on 2001 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Paul S. Ho
Publisher : Springer Science & Business Media
ISBN 13 : 3642559085
Total Pages : 310 pages
Book Rating : 4.6/5 (425 download)
Download or read book Low Dielectric Constant Materials for IC Applications written by Paul S. Ho and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for
Author : Ting Y. Tsui
Publisher :
ISBN 13 :
Total Pages : 498 pages
Book Rating : 4.3/5 (91 download)
Download or read book Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects written by Ting Y. Tsui and published by . This book was released on 2006 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 1119966868
Total Pages : 616 pages
Book Rating : 4.1/5 (199 download)
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-02-17 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566774178
Total Pages : 508 pages
Book Rating : 4.7/5 (741 download)
Download or read book Dielectrics for Nanosystems written by and published by The Electrochemical Society. This book was released on 2004 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 0470065419
Total Pages : 508 pages
Book Rating : 4.4/5 (7 download)
Download or read book Dielectric Films for Advanced Microelectronics written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2007-04-04 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Author : G. S. Mathad
Publisher : The Electrochemical Society
ISBN 13 : 9781566772945
Total Pages : 262 pages
Book Rating : 4.7/5 (729 download)
Download or read book Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2001 with total page 262 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Krishna Seshan
Publisher : William Andrew
ISBN 13 : 0128123125
Total Pages : 470 pages
Book Rating : 4.1/5 (281 download)
Download or read book Handbook of Thin Film Deposition written by Krishna Seshan and published by William Andrew. This book was released on 2018-02-23 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries Features a new chapter discussing Gates Dielectrics
Author : Sarhan M. Musa
Publisher : CRC Press
ISBN 13 : 135183259X
Total Pages : 647 pages
Book Rating : 4.3/5 (518 download)
Download or read book Computational Finite Element Methods in Nanotechnology written by Sarhan M. Musa and published by CRC Press. This book was released on 2017-12-19 with total page 647 pages. Available in PDF, EPUB and Kindle. Book excerpt: Computational Finite Element Methods in Nanotechnology demonstrates the capabilities of finite element methods in nanotechnology for a range of fields. Bringing together contributions from researchers around the world, it covers key concepts as well as cutting-edge research and applications to inspire new developments and future interdisciplinary research. In particular, it emphasizes the importance of finite element methods (FEMs) for computational tools in the development of efficient nanoscale systems. The book explores a variety of topics, including: A novel FE-based thermo-electrical-mechanical-coupled model to study mechanical stress, temperature, and electric fields in nano- and microelectronics The integration of distributed element, lumped element, and system-level methods for the design, modeling, and simulation of nano- and micro-electromechanical systems (N/MEMS) Challenges in the simulation of nanorobotic systems and macro-dimensions The simulation of structures and processes such as dislocations, growth of epitaxial films, and precipitation Modeling of self-positioning nanostructures, nanocomposites, and carbon nanotubes and their composites Progress in using FEM to analyze the electric field formed in needleless electrospinning How molecular dynamic (MD) simulations can be integrated into the FEM Applications of finite element analysis in nanomaterials and systems used in medicine, dentistry, biotechnology, and other areas The book includes numerous examples and case studies, as well as recent applications of microscale and nanoscale modeling systems with FEMs using COMSOL Multiphysics® and MATLAB®. A one-stop reference for professionals, researchers, and students, this is also an accessible introduction to computational FEMs in nanotechnology for those new to the field.
Author : Rajendra Singh
Publisher : The Electrochemical Society
ISBN 13 : 9781566772297
Total Pages : 242 pages
Book Rating : 4.7/5 (722 download)
Download or read book Low and High Dielectric Constant Materials written by Rajendra Singh and published by The Electrochemical Society. This book was released on 2000 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt:
