Advanced Interconnects For Ulsi Technology

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Advanced Interconnects for ULSI Technology

Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 1119966868
Total Pages : 616 pages
Book Rating : 4.1/5 (199 download)

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Book Synopsis Advanced Interconnects for ULSI Technology by : Mikhail Baklanov

Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-02-17 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Advanced Interconnects for ULSI Technology

Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 0470662549
Total Pages : 616 pages
Book Rating : 4.4/5 (76 download)

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Book Synopsis Advanced Interconnects for ULSI Technology by : Mikhail Baklanov

Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-04-02 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

Author : Yosi Shacham-Diamand
Publisher : Springer Science & Business Media
ISBN 13 : 0387958681
Total Pages : 552 pages
Book Rating : 4.3/5 (879 download)

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Book Synopsis Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications by : Yosi Shacham-Diamand

Download or read book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

Copper Interconnect Technology

Author : Tapan Gupta
Publisher : Springer Science & Business Media
ISBN 13 : 1441900764
Total Pages : 423 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Copper Interconnect Technology by : Tapan Gupta

Download or read book Copper Interconnect Technology written by Tapan Gupta and published by Springer Science & Business Media. This book was released on 2010-01-22 with total page 423 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.

Advanced Interconnects and Contacts: Volume 564

Author : Daniel C. Edelstein
Publisher :
ISBN 13 :
Total Pages : 606 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Advanced Interconnects and Contacts: Volume 564 by : Daniel C. Edelstein

Download or read book Advanced Interconnects and Contacts: Volume 564 written by Daniel C. Edelstein and published by . This book was released on 1999-10-07 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Electromigration in ULSI Interconnections

Author : Cher Ming Tan
Publisher : World Scientific
ISBN 13 : 9814273333
Total Pages : 312 pages
Book Rating : 4.8/5 (142 download)

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Book Synopsis Electromigration in ULSI Interconnections by : Cher Ming Tan

Download or read book Electromigration in ULSI Interconnections written by Cher Ming Tan and published by World Scientific. This book was released on 2010 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electromigration in ULSI Interconnections provides a comprehensive description of the electro migration in integrated circuits. It is intended for both beginner and advanced readers on electro migration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electro migration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electro migration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electro migration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electro migration are presented in a concise and rigorous manner.Methods of numerical modeling for the interconnect electro migration and their applications to the understanding of electro migration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electro migration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electro migration are outlined and discussed.

ULSI Semiconductor Technology Atlas

Author : Chih-Hang Tung
Publisher : John Wiley & Sons
ISBN 13 : 9780471457725
Total Pages : 688 pages
Book Rating : 4.4/5 (577 download)

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Book Synopsis ULSI Semiconductor Technology Atlas by : Chih-Hang Tung

Download or read book ULSI Semiconductor Technology Atlas written by Chih-Hang Tung and published by John Wiley & Sons. This book was released on 2003-10-06 with total page 688 pages. Available in PDF, EPUB and Kindle. Book excerpt: More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems. The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts: * Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation * Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization * Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development * Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with: * More than 1,100 TEM images to illustrate the science of ULSI * A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues * Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs

1998 5th International Conference on Solid-State and Integrated Circuit Technology

Author : Min Zhang
Publisher :
ISBN 13 :
Total Pages : 1016 pages
Book Rating : 4.E/5 ( download)

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Book Synopsis 1998 5th International Conference on Solid-State and Integrated Circuit Technology by : Min Zhang

Download or read book 1998 5th International Conference on Solid-State and Integrated Circuit Technology written by Min Zhang and published by . This book was released on 1998 with total page 1016 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics

Author :
Publisher :
ISBN 13 :
Total Pages : 440 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics by :

Download or read book Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics written by and published by . This book was released on 2004 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Multilevel Interconnect Technology

Author :
Publisher :
ISBN 13 :
Total Pages : 244 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Multilevel Interconnect Technology by :

Download or read book Multilevel Interconnect Technology written by and published by . This book was released on 1998 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Metals Abstracts

Author :
Publisher :
ISBN 13 :
Total Pages : 1014 pages
Book Rating : 4.E/5 ( download)

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Book Synopsis Metals Abstracts by :

Download or read book Metals Abstracts written by and published by . This book was released on 1999 with total page 1014 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics: Volume 1249

Author : J. W. Bartha
Publisher :
ISBN 13 :
Total Pages : 366 pages
Book Rating : 4.:/5 (31 download)

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Book Synopsis Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics: Volume 1249 by : J. W. Bartha

Download or read book Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics: Volume 1249 written by J. W. Bartha and published by . This book was released on 2010-10-05 with total page 366 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Low-dielectric Constant Materials

Author :
Publisher :
ISBN 13 :
Total Pages : 330 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Low-dielectric Constant Materials by :

Download or read book Low-dielectric Constant Materials written by and published by . This book was released on 1999 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Materials for Information Technology

Author : Ehrenfried Zschech
Publisher : Springer Science & Business Media
ISBN 13 : 1846282357
Total Pages : 498 pages
Book Rating : 4.8/5 (462 download)

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Book Synopsis Materials for Information Technology by : Ehrenfried Zschech

Download or read book Materials for Information Technology written by Ehrenfried Zschech and published by Springer Science & Business Media. This book was released on 2006-07-02 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.

Electromigration in ULSI Interconnections

Author :
Publisher :
ISBN 13 : 9814467936
Total Pages : pages
Book Rating : 4.8/5 (144 download)

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Book Synopsis Electromigration in ULSI Interconnections by :

Download or read book Electromigration in ULSI Interconnections written by and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Extended Abstracts

Author : Electrochemical Society
Publisher :
ISBN 13 :
Total Pages : 994 pages
Book Rating : 4.0/5 ( download)

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Book Synopsis Extended Abstracts by : Electrochemical Society

Download or read book Extended Abstracts written by Electrochemical Society and published by . This book was released on 1989 with total page 994 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Fundamentals of Electromigration-Aware Integrated Circuit Design

Author : Jens Lienig
Publisher : Springer
ISBN 13 : 3319735586
Total Pages : 159 pages
Book Rating : 4.3/5 (197 download)

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Book Synopsis Fundamentals of Electromigration-Aware Integrated Circuit Design by : Jens Lienig

Download or read book Fundamentals of Electromigration-Aware Integrated Circuit Design written by Jens Lienig and published by Springer. This book was released on 2018-02-23 with total page 159 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.