Testing Of Interposer Based 25d Integrated Circuits

Download Testing Of Interposer Based 25d Integrated Circuits full books in PDF, epub, and Kindle. Read online Testing Of Interposer Based 25d Integrated Circuits ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!

Testing of Interposer-Based 2.5D Integrated Circuits

Author : Ran Wang
Publisher : Springer
ISBN 13 : 3319547143
Total Pages : 182 pages
Book Rating : 4.3/5 (195 download)

DOWNLOAD NOW!

Book Synopsis Testing of Interposer-Based 2.5D Integrated Circuits by : Ran Wang

Download or read book Testing of Interposer-Based 2.5D Integrated Circuits written by Ran Wang and published by Springer. This book was released on 2017-03-20 with total page 182 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.

Test and Design-for-Testability in Mixed-Signal Integrated Circuits

Author : Jose Luis Huertas Díaz
Publisher : Springer Science & Business Media
ISBN 13 : 0387235213
Total Pages : 310 pages
Book Rating : 4.3/5 (872 download)

DOWNLOAD NOW!

Book Synopsis Test and Design-for-Testability in Mixed-Signal Integrated Circuits by : Jose Luis Huertas Díaz

Download or read book Test and Design-for-Testability in Mixed-Signal Integrated Circuits written by Jose Luis Huertas Díaz and published by Springer Science & Business Media. This book was released on 2010-02-23 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: Test and Design-for-Testability in Mixed-Signal Integrated Circuits deals with test and design for test of analog and mixed-signal integrated circuits. Especially in System-on-Chip (SoC), where different technologies are intertwined (analog, digital, sensors, RF); test is becoming a true bottleneck of present and future IC projects. Linking design and test in these heterogeneous systems will have a tremendous impact in terms of test time, cost and proficiency. Although it is recognized as a key issue for developing complex ICs, there is still a lack of structured references presenting the major topics in this area. The aim of this book is to present basic concepts and new ideas in a manner understandable for both professionals and students. Since this is an active research field, a comprehensive state-of-the-art overview is very valuable, introducing the main problems as well as the ways of solution that seem promising, emphasizing their basis, strengths and weaknesses. In essence, several topics are presented in detail. First of all, techniques for the efficient use of DSP-based test and CAD test tools. Standardization is another topic considered in the book, with focus on the IEEE 1149.4. Also addressed in depth is the connecting design and test by means of using high-level (behavioural) description techniques, specific examples are given. Another issue is related to test techniques for well-defined classes of integrated blocks, like data converters and phase-locked-loops. Besides these specification-driven testing techniques, fault-driven approaches are described as they offer potential solutions which are more similar to digital test methods. Finally, in Design-for-Testability and Built-In-Self-Test, two other concepts that were taken from digital design, are introduced in an analog context and illustrated for the case of integrated filters. In summary, the purpose of this book is to provide a glimpse on recent research results in the area of testing mixed-signal integrated circuits, specifically in the topics mentioned above. Much of the work reported herein has been performed within cooperative European Research Projects, in which the authors of the different chapters have actively collaborated. It is a representative snapshot of the current state-of-the-art in this emergent field.

Wafer-Level Testing and Test During Burn-In for Integrated Circuits

Author : Sudarshan Bahukudumbi
Publisher : Artech House
ISBN 13 : 1596939907
Total Pages : 198 pages
Book Rating : 4.5/5 (969 download)

DOWNLOAD NOW!

Book Synopsis Wafer-Level Testing and Test During Burn-In for Integrated Circuits by : Sudarshan Bahukudumbi

Download or read book Wafer-Level Testing and Test During Burn-In for Integrated Circuits written by Sudarshan Bahukudumbi and published by Artech House. This book was released on 2010 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This hands-on resource provides a comprehensive analysis of these methods, showing how wafer-level testing during burn-in (WLTBI) helps lower product cost in semiconductor manufacturing. Engineers learn how to implement the testing of integrated circuits at the wafer-level under various resource constraints. Moreover, this unique book helps practitioners address the issue of enabling next generation products with previous generation testers. Practitioners also find expert insights on current industry trends in WLTBI test solutions.

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Author : Brandon Noia
Publisher : Springer
ISBN 13 : 9783319345345
Total Pages : 0 pages
Book Rating : 4.3/5 (453 download)

DOWNLOAD NOW!

Book Synopsis Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs by : Brandon Noia

Download or read book Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs written by Brandon Noia and published by Springer. This book was released on 2016-08-23 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.

Testability Concepts for Digital ICs

Author : Frans Beenker
Publisher : Springer
ISBN 13 : 9781461360049
Total Pages : 212 pages
Book Rating : 4.3/5 (6 download)

DOWNLOAD NOW!

Book Synopsis Testability Concepts for Digital ICs by : Frans Beenker

Download or read book Testability Concepts for Digital ICs written by Frans Beenker and published by Springer. This book was released on 2012-10-04 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt: Preface Testing Integrated Circuits for manufacturing defects includes four basic disciplines. First of all an understanding of the origin and behaviour of defects. Secondly, knowledge of IC design and IC design styles. Thirdly, knowledge of how to create a test program for an IC which is targeted on detecting these defects, and finally, understanding of the hardware, Automatic Test Equipment, to run the test on. All four items have to be treated, managed, and to a great extent integrated before the term 'IC quality' gets a certain meaning and a test a certain measurable value. The contents of this book reflects our activities on testability concepts for complex digital ICs as performed at Philips Research Laboratories in Eindhoven, The Netherlands. Based on the statements above, we have worked along a long term plan, which was based on four pillars. 1. The definition of a test methodology suitable for 'future' IC design styles, 2. capable of handling improved defect models, 3. supported by software tools, and 4. providing an easy link to Automatic Test Equipment. The reasoning we have followed was continuously focused on IC qUality. Quality expressed in terms of the ability of delivering a customer a device with no residual manufacturing defects. Bad devices should not escape a test. The basis of IC quality is a thorough understanding of defects and defect models.

EDA for IC System Design, Verification, and Testing

Author : Lou Scheffer
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (31 download)

DOWNLOAD NOW!

Book Synopsis EDA for IC System Design, Verification, and Testing by : Lou Scheffer

Download or read book EDA for IC System Design, Verification, and Testing written by Lou Scheffer and published by . This book was released on 2005 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Optical Network Design and Modeling

Author : Anna Tzanakaki
Publisher : Springer Nature
ISBN 13 : 3030380858
Total Pages : 661 pages
Book Rating : 4.0/5 (33 download)

DOWNLOAD NOW!

Book Synopsis Optical Network Design and Modeling by : Anna Tzanakaki

Download or read book Optical Network Design and Modeling written by Anna Tzanakaki and published by Springer Nature. This book was released on 2020-02-15 with total page 661 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 23rd International IFIP conference on Optical Network Design and Modeling, ONDM 2019, held in Athens, Greece, in May 2019. The 39 revised full papers were carefully reviewed and selected from 87 submissions. The papers focus on cutting-edge research in established areas of optical networking as well as their adoption in support of a wide variety of new services and applications. This involves the most recent trends in networking including 5G and beyond, big data and network data analytics, cloud/edge computing, autonomic networking, artificial intelligence assisted networks, secure and resilient networks, that drive the need for increased capacity, efficiency, exibility and adaptability in the functions that the network can perform. In this context new disaggregated optical network architectures were discussed, exploiting and integrating novel multidimensional photonic technology solutions as well as adopting open hardware and software platforms relying on software defined networking (SDN), and network function virtualization (NFV) to allow support of new business models and opportunities.

Advances in Memristors, Memristive Devices and Systems

Author : Sundarapandian Vaidyanathan
Publisher : Springer
ISBN 13 : 3319517244
Total Pages : 511 pages
Book Rating : 4.3/5 (195 download)

DOWNLOAD NOW!

Book Synopsis Advances in Memristors, Memristive Devices and Systems by : Sundarapandian Vaidyanathan

Download or read book Advances in Memristors, Memristive Devices and Systems written by Sundarapandian Vaidyanathan and published by Springer. This book was released on 2017-02-15 with total page 511 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book reports on the latest advances in and applications of memristors, memristive devices and systems. It gathers 20 contributed chapters by subject experts, including pioneers in the field such as Leon Chua (UC Berkeley, USA) and R.S. Williams (HP Labs, USA), who are specialized in the various topics addressed in this book, and covers broad areas of memristors and memristive devices such as: memristor emulators, oscillators, chaotic and hyperchaotic memristive systems, control of memristive systems, memristor-based min-max circuits, canonic memristors, memristive-based neuromorphic applications, implementation of memristor-based chaotic oscillators, inverse memristors, linear memristor devices, delayed memristive systems, flux-controlled memristive emulators, etc. Throughout the book, special emphasis is given to papers offering practical solutions and design, modeling, and implementation insights to address current research problems in memristors, memristive devices and systems. As such, it offers a valuable reference book on memristors and memristive devices for graduate students and researchers with a basic knowledge of electrical and control systems engineering.

Optical Interconnects for Data Centers

Author : Tolga Tekin
Publisher : Woodhead Publishing
ISBN 13 : 008100513X
Total Pages : 428 pages
Book Rating : 4.0/5 (81 download)

DOWNLOAD NOW!

Book Synopsis Optical Interconnects for Data Centers by : Tolga Tekin

Download or read book Optical Interconnects for Data Centers written by Tolga Tekin and published by Woodhead Publishing. This book was released on 2016-11-01 with total page 428 pages. Available in PDF, EPUB and Kindle. Book excerpt: Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. Summarizes the state-of-the-art in this emerging field Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration Contains contributions that are drawn from leading international experts on the topic

Chemical-Mechanical Planarization of Semiconductor Materials

Author : M.R. Oliver
Publisher : Springer Science & Business Media
ISBN 13 : 9783540431817
Total Pages : 444 pages
Book Rating : 4.4/5 (318 download)

DOWNLOAD NOW!

Book Synopsis Chemical-Mechanical Planarization of Semiconductor Materials by : M.R. Oliver

Download or read book Chemical-Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer Science & Business Media. This book was released on 2004-01-26 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Integrated Interconnect Technologies for 3D Nanoelectronic Systems

Author : Muhannad S. Bakir
Publisher : Artech House
ISBN 13 : 1596932473
Total Pages : 551 pages
Book Rating : 4.5/5 (969 download)

DOWNLOAD NOW!

Book Synopsis Integrated Interconnect Technologies for 3D Nanoelectronic Systems by : Muhannad S. Bakir

Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.

Electrical Design of Through Silicon Via

Author : Manho Lee
Publisher : Springer
ISBN 13 : 9789401779494
Total Pages : 0 pages
Book Rating : 4.7/5 (794 download)

DOWNLOAD NOW!

Book Synopsis Electrical Design of Through Silicon Via by : Manho Lee

Download or read book Electrical Design of Through Silicon Via written by Manho Lee and published by Springer. This book was released on 2016-09-27 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

Materials for Advanced Packaging

Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 969 pages
Book Rating : 4.3/5 (194 download)

DOWNLOAD NOW!

Book Synopsis Materials for Advanced Packaging by : Daniel Lu

Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 969 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Multi-Objective Machine Learning

Author : Yaochu Jin
Publisher : Springer Science & Business Media
ISBN 13 : 3540330194
Total Pages : 657 pages
Book Rating : 4.5/5 (43 download)

DOWNLOAD NOW!

Book Synopsis Multi-Objective Machine Learning by : Yaochu Jin

Download or read book Multi-Objective Machine Learning written by Yaochu Jin and published by Springer Science & Business Media. This book was released on 2007-06-10 with total page 657 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recently, increasing interest has been shown in applying the concept of Pareto-optimality to machine learning, particularly inspired by the successful developments in evolutionary multi-objective optimization. It has been shown that the multi-objective approach to machine learning is particularly successful to improve the performance of the traditional single objective machine learning methods, to generate highly diverse multiple Pareto-optimal models for constructing ensembles models and, and to achieve a desired trade-off between accuracy and interpretability of neural networks or fuzzy systems. This monograph presents a selected collection of research work on multi-objective approach to machine learning, including multi-objective feature selection, multi-objective model selection in training multi-layer perceptrons, radial-basis-function networks, support vector machines, decision trees, and intelligent systems.

Quantum Circuit Simulation

Author : George F. Viamontes
Publisher : Springer Science & Business Media
ISBN 13 : 9048130654
Total Pages : 193 pages
Book Rating : 4.0/5 (481 download)

DOWNLOAD NOW!

Book Synopsis Quantum Circuit Simulation by : George F. Viamontes

Download or read book Quantum Circuit Simulation written by George F. Viamontes and published by Springer Science & Business Media. This book was released on 2009-08-04 with total page 193 pages. Available in PDF, EPUB and Kindle. Book excerpt: Quantum Circuit Simulation covers the fundamentals of linear algebra and introduces basic concepts of quantum physics needed to understand quantum circuits and algorithms. It requires only basic familiarity with algebra, graph algorithms and computer engineering. After introducing necessary background, the authors describe key simulation techniques that have so far been scattered throughout the research literature in physics, computer science, and computer engineering. Quantum Circuit Simulation also illustrates the development of software for quantum simulation by example of the QuIDDPro package, which is freely available and can be used by students of quantum information as a "quantum calculator."

Handbook of Microwave Component Measurements

Author : Joel P. Dunsmore
Publisher : John Wiley & Sons
ISBN 13 : 1119477131
Total Pages : 852 pages
Book Rating : 4.1/5 (194 download)

DOWNLOAD NOW!

Book Synopsis Handbook of Microwave Component Measurements by : Joel P. Dunsmore

Download or read book Handbook of Microwave Component Measurements written by Joel P. Dunsmore and published by John Wiley & Sons. This book was released on 2020-06-29 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Microwave Component Measurements Second Edition is a fully updated, complete reference to this topic, focusing on the modern measurement tools, such as a Vector Network Analyzer (VNA), gathering in one place all the concepts, formulas, and best practices of measurement science. It includes basic concepts in each chapter as well as appendices which provide all the detail needed to understand the science behind microwave measurements. The book offers an insight into the best practices for ascertaining the true nature of the device-under-test (DUT), optimizing the time to setup and measure, and to the greatest extent possible, remove the effects of the measuring equipment from that result. Furthermore, the author writes with a simplicity that is easily accessible to the student or new engineer, yet is thorough enough to provide details of measurement science for even the most advanced applications and researchers. This welcome new edition brings forward the most modern techniques used in industry today, and recognizes that more new techniques have developed since the first edition published in 2012. Whilst still focusing on the VNA, these techniques are also compatible with other vendor's advanced equipment, providing a comprehensive industry reference.

VLSI Physical Design: From Graph Partitioning to Timing Closure

Author : Andrew B. Kahng
Publisher : Springer Nature
ISBN 13 : 3030964159
Total Pages : 329 pages
Book Rating : 4.0/5 (39 download)

DOWNLOAD NOW!

Book Synopsis VLSI Physical Design: From Graph Partitioning to Timing Closure by : Andrew B. Kahng

Download or read book VLSI Physical Design: From Graph Partitioning to Timing Closure written by Andrew B. Kahng and published by Springer Nature. This book was released on 2022-06-14 with total page 329 pages. Available in PDF, EPUB and Kindle. Book excerpt: The complexity of modern chip design requires extensive use of specialized software throughout the process. To achieve the best results, a user of this software needs a high-level understanding of the underlying mathematical models and algorithms. In addition, a developer of such software must have a keen understanding of relevant computer science aspects, including algorithmic performance bottlenecks and how various algorithms operate and interact. This book introduces and compares the fundamental algorithms that are used during the IC physical design phase, wherein a geometric chip layout is produced starting from an abstract circuit design. This updated second edition includes recent advancements in the state-of-the-art of physical design, and builds upon foundational coverage of essential and fundamental techniques. Numerous examples and tasks with solutions increase the clarity of presentation and facilitate deeper understanding. A comprehensive set of slides is available on the Internet for each chapter, simplifying use of the book in instructional settings. “This improved, second edition of the book will continue to serve the EDA and design community well. It is a foundational text and reference for the next generation of professionals who will be called on to continue the advancement of our chip design tools and design the most advanced micro-electronics.” Dr. Leon Stok, Vice President, Electronic Design Automation, IBM Systems Group “This is the book I wish I had when I taught EDA in the past, and the one I’m using from now on.” Dr. Louis K. Scheffer, Howard Hughes Medical Institute “I would happily use this book when teaching Physical Design. I know of no other work that’s as comprehensive and up-to-date, with algorithmic focus and clear pseudocode for the key algorithms. The book is beautifully designed!” Prof. John P. Hayes, University of Michigan “The entire field of electronic design automation owes the authors a great debt for providing a single coherent source on physical design that is clear and tutorial in nature, while providing details on key state-of-the-art topics such as timing closure.” Prof. Kurt Keutzer, University of California, Berkeley “An excellent balance of the basics and more advanced concepts, presented by top experts in the field.” Prof. Sachin Sapatnekar, University of Minnesota