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Materials For Advanced Packaging
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Book Synopsis Materials for Advanced Packaging by : Daniel Lu
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 969 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Book Synopsis Advanced Materials for Thermal Management of Electronic Packaging by : Xingcun Colin Tong
Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Book Synopsis Semiconductor Advanced Packaging by : John H. Lau
Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Book Synopsis Bio-based Materials for Food Packaging by : Shakeel Ahmed
Download or read book Bio-based Materials for Food Packaging written by Shakeel Ahmed and published by Springer. This book was released on 2018-11-05 with total page 303 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an overview of the lastest developments in biobased materials and their applications in food packaging. Written by experts in their respective research domain, its thirteen chapters discuss in detail fundamental knowledge on bio based materials. It is intended as a reference book for researchers, students, research scholars, academicians and scientists seeking biobased materials for food packaging applications.
Book Synopsis Semiconductor Packaging by : Andrea Chen
Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Book Synopsis Advanced Flip Chip Packaging by : Ho-Ming Tong
Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Book Synopsis Advanced Electronic Packaging by : Richard K. Ulrich
Download or read book Advanced Electronic Packaging written by Richard K. Ulrich and published by John Wiley & Sons. This book was released on 2006-02-24 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Book Synopsis Advances in Embedded and Fan-Out Wafer Level Packaging Technologies by : Beth Keser
Download or read book Advances in Embedded and Fan-Out Wafer Level Packaging Technologies written by Beth Keser and published by John Wiley & Sons. This book was released on 2019-02-12 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Book Synopsis Food Packaging by : Sanjay Mavinkere Rangappa
Download or read book Food Packaging written by Sanjay Mavinkere Rangappa and published by CRC Press. This book was released on 2020-10-20 with total page 413 pages. Available in PDF, EPUB and Kindle. Book excerpt: Food Packaging: Advanced Materials, Technologies, and Innovations is a one-stop reference for packaging materials researchers working across various industries. With chapters written by leading international researchers from industry, academia, government, and private research institutions, this book offers a broad view of important developments in food packaging. Presents an extensive survey of food packaging materials and modern technologies Demonstrates the potential of various materials for use in demanding applications Discusses the use of polymers, composites, nanotechnology, hybrid materials, coatings, wood-based, and other materials in packaging Describes biodegradable packaging, antimicrobial studies, and environmental issues related to packaging materials Offers current status, trends, opportunities, and future directions Aimed at advanced students, research scholars, and professionals in food packaging development, this application-oriented book will help expand the reader’s knowledge of advanced materials and their use of innovation in food packaging.
Book Synopsis Packaging Materials and Processing for Food, Pharmaceuticals and Cosmetics by : Kata Galic
Download or read book Packaging Materials and Processing for Food, Pharmaceuticals and Cosmetics written by Kata Galic and published by John Wiley & Sons. This book was released on 2021-03-31 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides valuable information on a range of food packaging topics. It serves as a source for students, professionals and packaging engineers who need to know more about the characteristics, applications and consequences of different packaging materials in food-packaging interactions. This book is divided into 13 chapters and focuses on the agro-food, cosmetics and pharmaceutical sectors. The first four chapters cover traditional packaging materials: wood, paper and cardboard, glass and metal. The next two deal, respectively, with plastics and laminates. Biobased materials are then covered, followed by a presentation of active and smart packaging. Some chapters are also dedicated to providing information on caps and closures as well as auxiliary materials. Different food packaging methods are presented, followed by an investigation into the design and labelling of packaging. The book ends with a chapter presenting information on how the choice of packaging material is dependent on the characteristics of the food products to be packaged.
Book Synopsis Advanced Printing and Packaging Materials and Technologies by : Yun Ouyang
Download or read book Advanced Printing and Packaging Materials and Technologies written by Yun Ouyang and published by Trans Tech Publications Ltd. This book was released on 2015-01-29 with total page 612 pages. Available in PDF, EPUB and Kindle. Book excerpt: Collection of selected, peer reviewed papers from the 2014 3rd China Academic Conference on Printing and Packaging, October 24-25, 2014, Beijing, China. The 118 papers are grouped as follows: Chapter 1: Color and Optical Science and Technology; Chapter 2: Image Processing Technology; Chapter 3: Applied Information Technologies in Digital Publishing; Chapter 4: Printing Engineering Technology; Chapter 5: Packaging Engineering Technology; Chapter 6: Food Packaging and Preservation; Chapter 7: Printing and Packaging Equipment; Chapter 8: Paper and Related Material Technology; Chapter 9: Ink and Related Material Technology; Chapter 10: Polymer-Based Materials and Related Technology
Book Synopsis Advanced Thermal Management Materials by : Guosheng Jiang
Download or read book Advanced Thermal Management Materials written by Guosheng Jiang and published by Springer Science & Business Media. This book was released on 2012-09-13 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.
Book Synopsis Packaging Technology and Engineering by : Dipak Kumar Sarkar
Download or read book Packaging Technology and Engineering written by Dipak Kumar Sarkar and published by John Wiley & Sons. This book was released on 2020-09-08 with total page 539 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covers chemistry, physics, engineering, and therapeutic aspects of packaging—universal to pharmaceutical, medical, and food applications This book covers the chemistry, physics, materials science, engineering, and therapeutic aspects of many different types of packaging materials, emphasizing throughout the applicability of various aspects of packaging science and technology. It also provides a simultaneous discussion of interrelated fields, and addresses the universal issues within these fields’ application areas. Intended as a technical reference and as a study aid, it is relevant to anyone who studies or uses packaging or packaging materials. Packaging Technology and Engineering: Pharmaceutical, Medical and Food Applications begins with an overview of the history of the topic. It then offers chapters on the methods of obtaining raw materials, the chemistry of polymeric and non-polymeric packaging materials, physico-chemical quality parameters, and the manufacturing of packaging. Other topics look at: additives, use, suppliers, safety and environmental concerns, regulation, anti-fraud activities, new trends, and the future of packaging technology. The book also features numerous problems and worked solutions to aid student comprehension. Covers packaging and packaging materials, their properties and technologies Addresses the chemical engineering, physics, and chemistry of packaging materials, and the individual requirements for food, pharmaceutical, and medical device packaging Includes current issues such as environmental concerns and sustainability, recycling and after-use, anti-counterfeiting technology, and packaging regulations and guidelines Packaging Technology and Engineering: Pharmaceutical, Medical and Food Applications will appeal to all packaging technologists, scientists, and engineers in industry, and in regulatory agencies. It is also an excellent book for advanced students studying packaging courses, within pharmacy, pharmaceutical sciences, chemical sciences, biomedical sciences, medical sciences, engineering, product design and technology, and food science/technology.
Book Synopsis Bio-Based Packaging by : Salit Mohd Sapuan
Download or read book Bio-Based Packaging written by Salit Mohd Sapuan and published by John Wiley & Sons. This book was released on 2021-03-29 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: Bio-Based Packaging Bio-Based Packaging An authoritative and up-to-date review of sustainable packaging development and applications Bio-Based Packaging explores using renewable and biodegradable materials as sustainable alternatives to non-renewable, petroleum-based packaging. This comprehensive volume surveys the properties of biopolymers, the environmental and economic impact of bio-based packaging, and new and emerging technologies that are increasing the number of potential applications of green materials in the packaging industry. Contributions address the advantages and challenges of bio-based packaging, discuss new materials to be used for food packaging, and highlight cutting-edge research on polymers such as starch, protein, polylactic acid (PLA), pectin, nanocellulose, and their nanocomposites. In-depth yet accessible chapters provide balanced coverage of a broad range of practical topics, including life cycle assessment (LCA) of bio-based packaging products, consumer perceptions and preferences, supply chains, business strategies and markets in biodegradable food packaging, manufacturing of bio-based packaging materials, and regulations for food packaging materials. Detailed discussions provide valuable insight into the opportunities for biopolymers in end-use sectors, the barriers to biopolymer-based concepts in the packaging market, recent advances made in the field of biopolymeric composite materials, the future of bio-plastics in commercial food packaging, and more. This book: Provides deep coverage of the bio-based packaging development, characterization, regulations and environmental and socio-economic impact Contains real-world case studies of bio-based packaging applications Includes an overview of recent advances and emerging aspects of nanotechnology for development of sustainable composites for packaging Discusses renewable sources for packaging material and the reuse and recycling of bio-based packaging products Bio-Based Packaging is essential reading for academics, researchers, and industry professionals working in packaging materials, renewable resources, sustainability, polymerization technology, food technology, material engineering, and related fields. For more information on the Wiley Series in Renewable Resources, visit www.wiley.com/go/rrs
Book Synopsis Antenna-in-Package Technology and Applications by : Duixian Liu
Download or read book Antenna-in-Package Technology and Applications written by Duixian Liu and published by John Wiley & Sons. This book was released on 2020-03-31 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Book Synopsis Advanced MEMS Packaging by : John Lau
Download or read book Advanced MEMS Packaging written by John Lau and published by McGraw Hill Professional. This book was released on 2009-10-22 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging. This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal designs as well as materials, processes, manufacturing, testing, and reliability. Among the topics explored: Advanced IC and MEMS packaging trends MEMS devices, commercial applications, and markets More than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and handling Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding techniques Actuation mechanisms and integrated micromachining Bubble switch, optical switch, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging
Download or read book MEMS/MOEM Packaging written by Ken Gilleo and published by McGraw Hill Professional. This book was released on 2005-08-01 with total page 239 pages. Available in PDF, EPUB and Kindle. Book excerpt: While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
