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Chemical Mechanical Planarization Of Semiconductor Materials
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Book Synopsis Chemical-Mechanical Planarization of Semiconductor Materials by : M.R. Oliver
Download or read book Chemical-Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer Science & Business Media. This book was released on 2004-01-26 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Book Synopsis Chemical-Mechanical Planarization of Semiconductor Materials by : M.R. Oliver
Download or read book Chemical-Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer Science & Business Media. This book was released on 2013-03-14 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Book Synopsis Chemical Mechanical Planarization of Microelectronic Materials by : Joseph M. Steigerwald
Download or read book Chemical Mechanical Planarization of Microelectronic Materials written by Joseph M. Steigerwald and published by John Wiley & Sons. This book was released on 2008-09-26 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.
Book Synopsis Advances in Chemical Mechanical Planarization (CMP) by : Babu Suryadevara
Download or read book Advances in Chemical Mechanical Planarization (CMP) written by Babu Suryadevara and published by Woodhead Publishing. This book was released on 2021-09-10 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP
Book Synopsis Chemical-Mechanical Planarization of Semiconductor Materials by : M. R. Oliver
Download or read book Chemical-Mechanical Planarization of Semiconductor Materials written by M. R. Oliver and published by . This book was released on 2014-01-15 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication by : Jianfeng Luo
Download or read book Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication written by Jianfeng Luo and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 327 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.
Book Synopsis Advances in CMP Polishing Technologies by : Toshiro Doi
Download or read book Advances in CMP Polishing Technologies written by Toshiro Doi and published by William Andrew. This book was released on 2011-12-06 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan
Book Synopsis Chemical Mechanical Planarization in IC Device Manufacturing III by : Robert Leon Opila
Download or read book Chemical Mechanical Planarization in IC Device Manufacturing III written by Robert Leon Opila and published by The Electrochemical Society. This book was released on 2000 with total page 664 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume contains the proceedings of the third international symposium on Chemical Mechanical Planarization integrated circuit device manufacturing held at the 196th Meeting of the Electrochemical Society in Honolulu, Hawaii. ( October 20 -22 1999).
Book Synopsis Semiconductor Manufacturing Handbook by : Hwaiyu Geng
Download or read book Semiconductor Manufacturing Handbook written by Hwaiyu Geng and published by McGraw Hill Professional. This book was released on 2005-05-18 with total page 915 pages. Available in PDF, EPUB and Kindle. Book excerpt: WORLD-CLASS SEMICONDUCTOR MANUFACTURING EXPERTISE AT YOUR FINGERTIPS This is a comprehensive reference to the semiconductor manufacturing process and ancillary facilities -- from raw material preparation to packaging and testing, applying basics to emerging technologies. Readers charged with optimizing the design and performance of manufacturing processes will find all the information necessary to produce the highest quality chips at the lowest price in the shortest time possible. The Semiconductor Manufacturing Handbook provides leading-edge information on semiconductor wafer processes, MEMS, nanotechnology, and FPD, plus the latest manufacturing and automation technologies, including: Yield Management Automated Material Handling System Fab and Cleanroom Design and Operation Gas Abatement and Waste Treatment Management And much more Written by 60 international experts, and peer reviewed by a seasoned advisory board, this handbook covers the fundamentals of relevant technology and its real-life application and operational considerations for planning, implementing, and controlling manufacturing processes. It includes hundreds of detailed illustrations and a list of relevant books, technical papers, and websites for further research. This inclusive, wide-ranging coverage makes the Semiconductor Manufacturing Handbook the most comprehensive single-volume reference ever published in the field. STATE-OF-THE-ART SEMICONDUCTOR TECHNOLOGIES AND MANUFACTURING PROCESSES: SEMICONDUCTOR FUNDAMENTALS How Chips Are Designed and Made * Substrates * Copper and Low-k Dielectrics * Silicide Formation * Plasma * Vacuum * Photomask WAFER PROCESSING TECHNOLOGIES Microlithography * Ion Implantation * Etch * PVD/ALD * CVD * ECD * Epitaxy * CMP * Wet Cleaning FINAL MANUFACTURING Packaging * Grinding, Stress Relief, Dicing * Inspection, Measurement, and Testing NANOTECHNOLOGY, MEMS, AND FPD GAS AND CHEMICALS Specialty Gas System and DCA * Gas Abatement Systems * Chemical and Slurries Delivery System * Ultra Pure Water FAB YIELD, OPERATIONS, AND FACILITIES Yield Management * Automated Materials Handling System * Metrology * Six Sigma * Advanced Process Control * EHS * Fab Design and Construction * Cleanroom * Vibration and Acoustic Control * ESD * Airborne Molecular Control * Particle Monitoring * Wastewater Neutralization Systems
Book Synopsis Run-to-Run Control in Semiconductor Manufacturing by : James Moyne
Download or read book Run-to-Run Control in Semiconductor Manufacturing written by James Moyne and published by CRC Press. This book was released on 2018-10-08 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Run-to-run (R2R) control is cutting-edge technology that allows modification of a product recipe between machine "runs," thereby minimizing process drift, shift, and variability-and with them, costs. Its effectiveness has been demonstrated in a variety of processes, such as vapor phase epitaxy, lithography, and chemical mechanical planarization. The only barrier to the semiconductor industry's widespread adoption of this highly effective process control is a lack of understanding of the technology. Run to Run Control in Semiconductor Manufacturing overcomes that barrier by offering in-depth analyses of R2R control.
Book Synopsis Electronic Properties of Semiconductor Interfaces by : Winfried Mönch
Download or read book Electronic Properties of Semiconductor Interfaces written by Winfried Mönch and published by Springer Science & Business Media. This book was released on 2013-04-17 with total page 269 pages. Available in PDF, EPUB and Kindle. Book excerpt: Using the continuum of interface-induced gap states (IFIGS) as a unifying theme, Mönch explains the band-structure lineup at all types of semiconductor interfaces. These intrinsic IFIGS are the wave-function tails of electron states, which overlap a semiconductor band-gap exactly at the interface, so they originate from the quantum-mechanical tunnel effect. He shows that a more chemical view relates the IFIGS to the partial ionic character of the covalent interface-bonds and that the charge transfer across the interface may be modeled by generalizing Pauling?s electronegativity concept. The IFIGS-and-electronegativity theory is used to quantitatively explain the barrier heights and band offsets of well-characterized Schottky contacts and semiconductor heterostructures, respectively.
Book Synopsis Microelectronic Applications of Chemical Mechanical Planarization by : Yuzhuo Li
Download or read book Microelectronic Applications of Chemical Mechanical Planarization written by Yuzhuo Li and published by John Wiley & Sons. This book was released on 2007-10-19 with total page 764 pages. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Book Synopsis Surface Analysis of Polymers by XPS and Static SIMS by : D. Briggs
Download or read book Surface Analysis of Polymers by XPS and Static SIMS written by D. Briggs and published by Cambridge University Press. This book was released on 1998-04-02 with total page 215 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an in-depth treatment of the instrumentation, physical bases and applications of X-ray photoelectron spectroscopy (XPS) and static secondary ion mass spectroscopy (SSIMS) with a specific focus on the subject of polymeric materials. XPS and SSIMS are widely accepted as the two most powerful techniques for polymer surface chemical analysis, particularly in the context of industrial research and problem solving. In this book, the techniques of XPS and SSIMS are described and in each case the author explains what type of information may be obtained. The book also includes details of case studies emphasising the complementary and joint application of XPS and SSIMS in the investigation of polymer surface structure and its relationship to the properties of the material. This book will be of value to academic and industrial researchers interested in polymer surfaces and surface analysis.
Book Synopsis Near-field Nano/Atom Optics and Technology by : Motoichi Ohtsu
Download or read book Near-field Nano/Atom Optics and Technology written by Motoichi Ohtsu and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 309 pages. Available in PDF, EPUB and Kindle. Book excerpt: Intrinsic features of the optical near field open a new frontier in optical science and technology by finally overcoming the diffraction limit to reach nanometric dimensions. But this book goes beyond near-field optical microscopy to cover local spectroscopy, nanoscale optical processing and storage, quantum near-field optics, and atom manipulation. Near-Field Nano/Atom Optics and Technology provides the first complete and systematically compiled account of the science and technology required to generate the near field, and features applications including imaging of biological specimens and diagnostics for semiconductor nanomaterials and devices. This monograph will be invaluable to researchers who want to implement near-field technology in their own work, and it can also be used as a textbook for graduate or undergraduate students.
Book Synopsis Mechanical Tribology by : George E. Totten
Download or read book Mechanical Tribology written by George E. Totten and published by CRC Press. This book was released on 2004-04-22 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Studying the morphology, defects, and wear behavior of a variety of material surfaces, Mechanical Tribology examines popular and emerging surface characterization techniques for assessment of the physical, mechanical, and chemical properties of various modified surfaces, thin films, and coatings. Its chapters explore a wide range of tribolo
Book Synopsis Viscoelastic Behavior of Rubbery Materials by : C. Michael Roland
Download or read book Viscoelastic Behavior of Rubbery Materials written by C. Michael Roland and published by OUP Oxford. This book was released on 2011-06-30 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: The enormous size of polymer molecules causes their molecular motions to span a broad range of length scales and give rise to viscoelastic behaviour. This rate-dependence of the properties is a predominant characteristic of soft materials (rubbers, biopolymers, lubricants, adhesives, etc.). Improving the performance and developing new applications for soft materials require an understanding of the basic principles of how molecular motions underlie physical properties. This text is intended to provide grounding in fundamental aspects of the dynamic behavior of rubbery materials, adopting a molecular perspective in its treatment to emphasize how microscopic processes are connected to the observed macroscopic behavior. The latest discoveries and advances in the science and technology of rubbery materials are described and critically analyzed.
Book Synopsis Mechanical Behavior of Materials by : Marc André Meyers
Download or read book Mechanical Behavior of Materials written by Marc André Meyers and published by Cambridge University Press. This book was released on 2008-11-06 with total page 1455 pages. Available in PDF, EPUB and Kindle. Book excerpt: A balanced mechanics-materials approach and coverage of the latest developments in biomaterials and electronic materials, the new edition of this popular text is the most thorough and modern book available for upper-level undergraduate courses on the mechanical behavior of materials. To ensure that the student gains a thorough understanding the authors present the fundamental mechanisms that operate at micro- and nano-meter level across a wide-range of materials, in a way that is mathematically simple and requires no extensive knowledge of materials. This integrated approach provides a conceptual presentation that shows how the microstructure of a material controls its mechanical behavior, and this is reinforced through extensive use of micrographs and illustrations. New worked examples and exercises help the student test their understanding. Further resources for this title, including lecture slides of select illustrations and solutions for exercises, are available online at www.cambridge.org/97800521866758.
