Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II

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Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566773904
Total Pages : 290 pages
Book Rating : 4.7/5 (739 download)

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Book Synopsis Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II by : G. S. Mathad

Download or read book Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2003 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics

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Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566773799
Total Pages : 364 pages
Book Rating : 4.7/5 (737 download)

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Book Synopsis Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics by :

Download or read book Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics written by and published by The Electrochemical Society. This book was released on 2003 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics

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Author :
Publisher : The Electrochemical Society
ISBN 13 : 1566776937
Total Pages : 71 pages
Book Rating : 4.5/5 (667 download)

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Book Synopsis Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics by : G. Mathad

Download or read book Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics written by G. Mathad and published by The Electrochemical Society. This book was released on 2009-03 with total page 71 pages. Available in PDF, EPUB and Kindle. Book excerpt: The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Low k Inter-Level Metal Dielectrics and New Contact and Barrier Metallurgies/Structures¿, held during the PRiME 2008 joint international meeting of The Electrochemical Society and The Electrochemical Society of Japan, with the technical cosponsorship of the Japan Society of Applied Physics, the Korean Electrochemical Society, the Electrochemistry Division of the Royal Australian Chemical Institute, and the Chinese Society of Electrochemistry. This meeting was held in Honolulu, Hawaii, from October 12 to 17, 2008.

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

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Publisher : Springer Science & Business Media
ISBN 13 : 0387958681
Total Pages : 545 pages
Book Rating : 4.3/5 (879 download)

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Book Synopsis Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications by : Yosi Shacham-Diamand

Download or read book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics

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Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566772945
Total Pages : 262 pages
Book Rating : 4.7/5 (729 download)

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Book Synopsis Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics by : G. S. Mathad

Download or read book Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2001 with total page 262 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Chemical Mechanical Planarization IV

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Publisher : The Electrochemical Society
ISBN 13 : 9781566772938
Total Pages : 350 pages
Book Rating : 4.7/5 (729 download)

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Book Synopsis Chemical Mechanical Planarization IV by : R. L. Opila

Download or read book Chemical Mechanical Planarization IV written by R. L. Opila and published by The Electrochemical Society. This book was released on 2001 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Cleaning Technology in Semiconductor Device Manufacturing VIII

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Publisher : The Electrochemical Society
ISBN 13 : 9781566774116
Total Pages : 452 pages
Book Rating : 4.7/5 (741 download)

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Book Synopsis Cleaning Technology in Semiconductor Device Manufacturing VIII by : Jerzy Rużyłło

Download or read book Cleaning Technology in Semiconductor Device Manufacturing VIII written by Jerzy Rużyłło and published by The Electrochemical Society. This book was released on 2004 with total page 452 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Cleaning Technology in Semiconductor Device Manufacturing ...

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Publisher :
ISBN 13 :
Total Pages : 458 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Cleaning Technology in Semiconductor Device Manufacturing ... by :

Download or read book Cleaning Technology in Semiconductor Device Manufacturing ... written by and published by . This book was released on 2003 with total page 458 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Electrochemical Processes in ULSI and MEMS

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Publisher : The Electrochemical Society
ISBN 13 : 9781566774727
Total Pages : 494 pages
Book Rating : 4.7/5 (747 download)

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Book Synopsis Electrochemical Processes in ULSI and MEMS by : Hariklia Deligianni

Download or read book Electrochemical Processes in ULSI and MEMS written by Hariklia Deligianni and published by The Electrochemical Society. This book was released on 2005 with total page 494 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Meeting Abstracts

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Publisher :
ISBN 13 :
Total Pages : 1020 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Meeting Abstracts by : Electrochemical Society

Download or read book Meeting Abstracts written by Electrochemical Society and published by . This book was released on 2002 with total page 1020 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Electrochemical Surface Modification

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Publisher : John Wiley & Sons
ISBN 13 : 3527625313
Total Pages : 360 pages
Book Rating : 4.5/5 (276 download)

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Book Synopsis Electrochemical Surface Modification by : Richard C. Alkire

Download or read book Electrochemical Surface Modification written by Richard C. Alkire and published by John Wiley & Sons. This book was released on 2008-11-21 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this topical volume, the authors provide in-depth coverage of the vital relationship between electrochemistry and the morphology of thin films and surfaces. Clearly divided into four major sections, the book covers nanoscale dielectric films for electronic devices, superconformal film growth, electrocatalytic properties of transition metal macrocycles, and the use of synchrotron techniques in electrochemistry. All the chapters offer a concise introduction to the relevant topic, as well as supplying numerous references for easy access to further reading and the original literature. The result is must-have reading for electrochemists, physical and surface chemists and physicists, as well as materials scientists and engineers active in the field of spectroscopic methods in electrochemistry.

Advanced Metallization Conference in ...

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Publisher :
ISBN 13 :
Total Pages : 936 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Advanced Metallization Conference in ... by :

Download or read book Advanced Metallization Conference in ... written by and published by . This book was released on 2005 with total page 936 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Index of Conference Proceedings

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Publisher :
ISBN 13 :
Total Pages : 870 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Index of Conference Proceedings by : British Library. Document Supply Centre

Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2003 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt:

CMOS Past, Present and Future

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Publisher : Woodhead Publishing
ISBN 13 : 0081021402
Total Pages : 280 pages
Book Rating : 4.0/5 (81 download)

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Book Synopsis CMOS Past, Present and Future by : Henry Radamson

Download or read book CMOS Past, Present and Future written by Henry Radamson and published by Woodhead Publishing. This book was released on 2018-04-03 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: CMOS Past, Present and Future provides insight from the basics, to the state-of-the-art of CMOS processing and electrical characterization, including the integration of Group IV semiconductors-based photonics. The book goes into the pitfalls and opportunities associated with the use of hetero-epitaxy on silicon with strain engineering and the integration of photonics and high-mobility channels on a silicon platform. It begins with the basic definitions and equations, but extends to present technologies and challenges, creating a roadmap on the origins of the technology and its evolution to the present, along with a vision for future trends. The book examines the challenges and opportunities that materials beyond silicon provide, including a close look at high-k materials and metal gate, strain engineering, channel material and mobility, and contacts. The book's key approach is on characterizations, device processing and electrical measurements. - Addresses challenges and opportunities for the use of CMOS - Covers the latest methods of strain engineering, materials integration to increase mobility, nano-scaled transistor processing, and integration of CMOS with photonic components - Provides a look at the evolution of CMOS technology, including the origins of the technology, current status and future possibilities

Handbook of Semiconductor Manufacturing Technology

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Author :
Publisher : CRC Press
ISBN 13 : 9780824787837
Total Pages : 1186 pages
Book Rating : 4.7/5 (878 download)

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Book Synopsis Handbook of Semiconductor Manufacturing Technology by : Yoshio Nishi

Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2000-08-09 with total page 1186 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."

Journal of the Electrochemical Society

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Publisher :
ISBN 13 :
Total Pages : 1020 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Journal of the Electrochemical Society by :

Download or read book Journal of the Electrochemical Society written by and published by . This book was released on 2009 with total page 1020 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Recrystallization and Grain Growth : SF2M

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Publisher :
ISBN 13 :
Total Pages : 772 pages
Book Rating : 4.X/5 (4 download)

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Download or read book Recrystallization and Grain Growth : SF2M written by and published by . This book was released on 2004 with total page 772 pages. Available in PDF, EPUB and Kindle. Book excerpt: