CMOS Past, Present and Future

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Author :
Publisher : Woodhead Publishing
ISBN 13 : 0081021402
Total Pages : 278 pages
Book Rating : 4.0/5 (81 download)

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Book Synopsis CMOS Past, Present and Future by : Henry Radamson

Download or read book CMOS Past, Present and Future written by Henry Radamson and published by Woodhead Publishing. This book was released on 2018-04-03 with total page 278 pages. Available in PDF, EPUB and Kindle. Book excerpt: CMOS Past, Present and Future provides insight from the basics, to the state-of-the-art of CMOS processing and electrical characterization, including the integration of Group IV semiconductors-based photonics. The book goes into the pitfalls and opportunities associated with the use of hetero-epitaxy on silicon with strain engineering and the integration of photonics and high-mobility channels on a silicon platform. It begins with the basic definitions and equations, but extends to present technologies and challenges, creating a roadmap on the origins of the technology and its evolution to the present, along with a vision for future trends. The book examines the challenges and opportunities that materials beyond silicon provide, including a close look at high-k materials and metal gate, strain engineering, channel material and mobility, and contacts. The book's key approach is on characterizations, device processing and electrical measurements. Addresses challenges and opportunities for the use of CMOS Covers the latest methods of strain engineering, materials integration to increase mobility, nano-scaled transistor processing, and integration of CMOS with photonic components Provides a look at the evolution of CMOS technology, including the origins of the technology, current status and future possibilities

Securitization: Past, Present and Future

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Author :
Publisher : Springer
ISBN 13 : 3319601288
Total Pages : 177 pages
Book Rating : 4.3/5 (196 download)

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Book Synopsis Securitization: Past, Present and Future by : Solomon Y Deku

Download or read book Securitization: Past, Present and Future written by Solomon Y Deku and published by Springer. This book was released on 2017-08-04 with total page 177 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to explore if and how securitization changed financial intermediation and lending behaviour by reviewing the pre- and post-financial crisis theoretical and empirical literature. The book’s distinctive feature is bringing the growing post-crisis empirical evidence to the attention of a wider audience by critically appraising it against pre-crisis arguments. With its thought-provoking insights, this book is of particular interest for students, practitioners and academics.

Complementary Metal Oxide Semiconductor

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Author :
Publisher : BoD – Books on Demand
ISBN 13 : 1789234964
Total Pages : 162 pages
Book Rating : 4.7/5 (892 download)

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Book Synopsis Complementary Metal Oxide Semiconductor by : Kim Ho Yeap

Download or read book Complementary Metal Oxide Semiconductor written by Kim Ho Yeap and published by BoD – Books on Demand. This book was released on 2018-08-01 with total page 162 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this book, Complementary Metal Oxide Semiconductor ( CMOS ) devices are extensively discussed. The topics encompass the technology advancement in the fabrication process of metal oxide semiconductor field effect transistors or MOSFETs (which are the fundamental building blocks of CMOS devices) and the applications of transistors in the present and future eras. The book is intended to provide information on the latest technology development of CMOS to researchers, physicists, as well as engineers working in the field of semiconductor transistor manufacturing and design.

FinFET Devices for VLSI Circuits and Systems

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Author :
Publisher : CRC Press
ISBN 13 : 0429998090
Total Pages : 318 pages
Book Rating : 4.4/5 (299 download)

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Book Synopsis FinFET Devices for VLSI Circuits and Systems by : Samar K. Saha

Download or read book FinFET Devices for VLSI Circuits and Systems written by Samar K. Saha and published by CRC Press. This book was released on 2020-07-15 with total page 318 pages. Available in PDF, EPUB and Kindle. Book excerpt: To surmount the continuous scaling challenges of MOSFET devices, FinFETs have emerged as the real alternative for use as the next generation device for IC fabrication technology. The objective of this book is to provide the basic theory and operating principles of FinFET devices and technology, an overview of FinFET device architecture and manufacturing processes, and detailed formulation of FinFET electrostatic and dynamic device characteristics for IC design and manufacturing. Thus, this book caters to practicing engineers transitioning to FinFET technology and prepares the next generation of device engineers and academic experts on mainstream device technology at the nanometer-nodes.

Advanced Nanoscale MOSFET Architectures

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Author :
Publisher : John Wiley & Sons
ISBN 13 : 1394188943
Total Pages : 340 pages
Book Rating : 4.3/5 (941 download)

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Book Synopsis Advanced Nanoscale MOSFET Architectures by : Kalyan Biswas

Download or read book Advanced Nanoscale MOSFET Architectures written by Kalyan Biswas and published by John Wiley & Sons. This book was released on 2024-07-03 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: Comprehensive reference on the fundamental principles and basic physics dictating metal–oxide–semiconductor field-effect transistor (MOSFET) operation Advanced Nanoscale MOSFET Architectures provides an in-depth review of modern metal–oxide–semiconductor field-effect transistor (MOSFET) device technologies and advancements, with information on their operation, various architectures, fabrication, materials, modeling and simulation methods, circuit applications, and other aspects related to nanoscale MOSFET technology. The text begins with an introduction to the foundational technology before moving on to describe challenges associated with the scaling of nanoscale devices. Other topics covered include device physics and operation, strain engineering for highly scaled MOSFETs, tunnel FET, graphene based field effect transistors, and more. The text also compares silicon bulk and devices, nanosheet transistors and introduces low-power circuit design using advanced MOSFETs. Additional topics covered include: High-k gate dielectrics and metal gate electrodes for multi-gate MOSFETs, covering gate stack processing and metal gate modification Strain engineering in 3D complementary metal-oxide semiconductors (CMOS) and its scaling impact, and strain engineering in silicon–germanium (SiGe) FinFET and its challenges and future perspectives TCAD simulation of multi-gate MOSFET, covering model calibration and device performance for analog and RF applications Description of the design of an analog amplifier circuit using digital CMOS technology of SCL for ultra-low power VLSI applications Advanced Nanoscale MOSFET Architectures helps readers understand device physics and design of new structures and material compositions, making it an important resource for the researchers and professionals who are carrying out research in the field, along with students in related programs of study.

Photonics and Electronics with Germanium

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Author :
Publisher : John Wiley & Sons
ISBN 13 : 3527650229
Total Pages : 336 pages
Book Rating : 4.5/5 (276 download)

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Book Synopsis Photonics and Electronics with Germanium by : Kazumi Wada

Download or read book Photonics and Electronics with Germanium written by Kazumi Wada and published by John Wiley & Sons. This book was released on 2015-05-06 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Representing a further step towards enabling the convergence of computing and communication, this handbook and reference treats germanium electronics and optics on an equal footing. Renowned experts paint the big picture, combining both introductory material and the latest results. The first part of the book introduces readers to the fundamental properties of germanium, such as band offsets, impurities, defects and surface structures, which determine the performance of germanium-based devices in conjunction with conventional silicon technology. The second part covers methods of preparing and processing germanium structures, including chemical and physical vapor deposition, condensation approaches and chemical etching. The third and largest part gives a broad overview of the applications of integrated germanium technology: waveguides, photodetectors, modulators, ring resonators, transistors and, prominently, light-emitting devices. An invaluable one-stop resource for both researchers and developers.

CMOS Processors and Memories

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 9048192161
Total Pages : 382 pages
Book Rating : 4.0/5 (481 download)

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Book Synopsis CMOS Processors and Memories by : Krzysztof Iniewski

Download or read book CMOS Processors and Memories written by Krzysztof Iniewski and published by Springer Science & Business Media. This book was released on 2010-08-09 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt: CMOS Processors and Memories addresses the-state-of-the-art in integrated circuit design in the context of emerging computing systems. New design opportunities in memories and processor are discussed. Emerging materials that can take system performance beyond standard CMOS, like carbon nanotubes, graphene, ferroelectrics and tunnel junctions are explored. CMOS Processors and Memories is divided into two parts: processors and memories. In the first part we start with high performance, low power processor design, followed by a chapter on multi-core processing. They both represent state-of-the-art concepts in current computing industry. The third chapter deals with asynchronous design that still carries lots of promise for future computing needs. At the end we present a “hardware design space exploration” methodology for implementing and analyzing the hardware for the Bayesian inference framework. This particular methodology involves: analyzing the computational cost and exploring candidate hardware components, proposing various custom architectures using both traditional CMOS and hybrid nanotechnology CMOL. The first part concludes with hybrid CMOS-Nano architectures. The second, memory part covers state-of-the-art SRAM, DRAM, and flash memories as well as emerging device concepts. Semiconductor memory is a good example of the full custom design that applies various analog and logic circuits to utilize the memory cell’s device physics. Critical physical effects that include tunneling, hot electron injection, charge trapping (Flash memory) are discussed in detail. Emerging memories like FRAM, PRAM and ReRAM that depend on magnetization, electron spin alignment, ferroelectric effect, built-in potential well, quantum effects, and thermal melting are also described. CMOS Processors and Memories is a must for anyone serious about circuit design for future computing technologies. The book is written by top notch international experts in industry and academia. It can be used in graduate course curriculum.

On-Wafer Microwave Measurements and De-embedding

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Author :
Publisher : Artech House
ISBN 13 : 1630813710
Total Pages : 251 pages
Book Rating : 4.6/5 (38 download)

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Book Synopsis On-Wafer Microwave Measurements and De-embedding by : Errikos Lourandakis

Download or read book On-Wafer Microwave Measurements and De-embedding written by Errikos Lourandakis and published by Artech House. This book was released on 2016-07-31 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: This new authoritative resource presents the basics of network analyzer measurement equipment and troubleshooting errors involved in the on-wafer microwave measurement process. This book bridges the gap between theoretical and practical information using real-world practices that address all aspects of on-wafer passive device characterization in the microwave frequency range up to 60GHz. Readers find data and measurements from silicon integrated passive devices fabricated and tested in advance CMOS technologies. Basic circuit equations, terms and fundamentals of time and frequency domain analysis are covered. This book also explores the basics of vector network analyzers (VNA), two port S-parameter measurement routines, signal flow graphs, network theory, error models and VNA calibrations with the use of calibration standards.

SiGe, Ge, and Related Compounds 4: Materials, Processing, and Devices

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Author :
Publisher : The Electrochemical Society
ISBN 13 : 1566778255
Total Pages : 1066 pages
Book Rating : 4.5/5 (667 download)

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Book Synopsis SiGe, Ge, and Related Compounds 4: Materials, Processing, and Devices by : D. Harame

Download or read book SiGe, Ge, and Related Compounds 4: Materials, Processing, and Devices written by D. Harame and published by The Electrochemical Society. This book was released on 2010-10 with total page 1066 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds has become a key component in the arsenal in improving semiconductor performance. This symposium discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.

Stress and Strain Engineering at Nanoscale in Semiconductor Devices

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Author :
Publisher : CRC Press
ISBN 13 : 1000404935
Total Pages : 275 pages
Book Rating : 4.0/5 (4 download)

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Book Synopsis Stress and Strain Engineering at Nanoscale in Semiconductor Devices by : Chinmay K. Maiti

Download or read book Stress and Strain Engineering at Nanoscale in Semiconductor Devices written by Chinmay K. Maiti and published by CRC Press. This book was released on 2021-06-29 with total page 275 pages. Available in PDF, EPUB and Kindle. Book excerpt: Anticipating a limit to the continuous miniaturization (More-Moore), intense research efforts are being made to co-integrate various functionalities (More-than-Moore) in a single chip. Currently, strain engineering is the main technique used to enhance the performance of advanced semiconductor devices. Written from an engineering applications standpoint, this book encompasses broad areas of semiconductor devices involving the design, simulation, and analysis of Si, heterostructure silicongermanium (SiGe), and III-N compound semiconductor devices. The book provides the background and physical insight needed to understand the new and future developments in the technology CAD (TCAD) design at the nanoscale. Features Covers stressstrain engineering in semiconductor devices, such as FinFETs and III-V Nitride-based devices Includes comprehensive mobility model for strained substrates in global and local strain techniques and their implementation in device simulations Explains the development of strain/stress relationships and their effects on the band structures of strained substrates Uses design of experiments to find the optimum process conditions Illustrates the use of TCAD for modeling strain-engineered FinFETs for DC and AC performance predictions This book is for graduate students and researchers studying solid-state devices and materials, microelectronics, systems and controls, power electronics, nanomaterials, and electronic materials and devices.

Silicon Photonics

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Publisher : John Wiley & Sons
ISBN 13 : 0470994525
Total Pages : 354 pages
Book Rating : 4.4/5 (79 download)

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Book Synopsis Silicon Photonics by : Graham T. Reed

Download or read book Silicon Photonics written by Graham T. Reed and published by John Wiley & Sons. This book was released on 2008-05-23 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon photonics is currently a very active and progressive area of research, as silicon optical circuits have emerged as the replacement technology for copper-based circuits in communication and broadband networks. The demand for ever improving communications and computing performance continues, and this in turn means that photonic circuits are finding ever increasing application areas. This text provides an important and timely overview of the ‘hot topics’ in the field, covering the various aspects of the technology that form the research area of silicon photonics. With contributions from some of the world’s leading researchers in silicon photonics, this book collates the latest advances in the technology. Silicon Photonics: the State of the Art opens with a highly informative foreword, and continues to feature: the integrated photonic circuit; silicon photonic waveguides; photonic bandgap waveguides; mechanisms for optical modulation in silicon; silicon based light sources; optical detection technologies for silicon photonics; passive silicon photonic devices; photonic and electronic integration approaches; applications in communications and sensors. Silicon Photonics: the State of the Art covers the essential elements of the entire field that is silicon photonics and is therefore an invaluable text for photonics engineers and professionals working in the fields of optical networks, optical communications, and semiconductor electronics. It is also an informative reference for graduate students studying for PhD in fibre optics, integrated optics, optical networking, microelectronics, or telecommunications.

Encyclopedia of Automotive Engineering

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Publisher : John Wiley & Sons
ISBN 13 : 0470974028
Total Pages : 3888 pages
Book Rating : 4.4/5 (79 download)

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Book Synopsis Encyclopedia of Automotive Engineering by : David Crolla

Download or read book Encyclopedia of Automotive Engineering written by David Crolla and published by John Wiley & Sons. This book was released on 2015-03-23 with total page 3888 pages. Available in PDF, EPUB and Kindle. Book excerpt: A Choice Oustanding Academic Title The Encyclopedia of Automotive Engineering provides for the first time a large, unified knowledge base laying the foundation for advanced study and in-depth research. Through extensive cross-referencing and search functionality it provides a gateway to detailed but scattered information on best industry practice, engendering a better understanding of interrelated concepts and techniques that cut across specialized areas of engineering. Beyond traditional automotive subjects the Encyclopedia addresses green technologies, the shift from mechanics to electronics, and the means to produce safer, more efficient vehicles within varying economic restraints worldwide. The work comprises nine main parts: (1) Engines: Fundamentals (2) Engines: Design (3) Hybrid and Electric Powertrains (4) Transmission and Driveline (5) Chassis Systems (6) Electrical and Electronic Systems (7) Body Design (8) Materials and Manufacturing (9) Telematics. Offers authoritative coverage of the wide-ranging specialist topics encompassed by automotive engineering An accessible point of reference for entry level engineers and students who require an understanding of the fundamentals of technologies outside of their own expertise or training Provides invaluable guidance to more detailed texts and research findings in the technical literature Developed in conjunction with FISITA, the umbrella organisation for the national automotive societies in 37 countries around the world and representing more than 185,000 automotive engineers 6 Volumes www.automotive-reference.com An essential resource for libraries and information centres in industry, research and training organizations, professional societies, government departments, and all relevant engineering departments in the academic sector.

3D and Circuit Integration of MEMS

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Publisher : John Wiley & Sons
ISBN 13 : 3527823255
Total Pages : 528 pages
Book Rating : 4.5/5 (278 download)

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Book Synopsis 3D and Circuit Integration of MEMS by : Masayoshi Esashi

Download or read book 3D and Circuit Integration of MEMS written by Masayoshi Esashi and published by John Wiley & Sons. This book was released on 2021-03-16 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.

Silicon Heterostructure Handbook

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Author :
Publisher : CRC Press
ISBN 13 : 1420026585
Total Pages : 1248 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Silicon Heterostructure Handbook by : John D. Cressler

Download or read book Silicon Heterostructure Handbook written by John D. Cressler and published by CRC Press. This book was released on 2018-10-03 with total page 1248 pages. Available in PDF, EPUB and Kindle. Book excerpt: An extraordinary combination of material science, manufacturing processes, and innovative thinking spurred the development of SiGe heterojunction devices that offer a wide array of functions, unprecedented levels of performance, and low manufacturing costs. While there are many books on specific aspects of Si heterostructures, the Silicon Heterostructure Handbook: Materials, Fabrication, Devices, Circuits, and Applications of SiGe and Si Strained-Layer Epitaxy is the first book to bring all aspects together in a single source. Featuring broad, comprehensive, and in-depth discussion, this handbook distills the current state of the field in areas ranging from materials to fabrication, devices, CAD, circuits, and applications. The editor includes "snapshots" of the industrial state-of-the-art for devices and circuits, presenting a novel perspective for comparing the present status with future directions in the field. With each chapter contributed by expert authors from leading industrial and research institutions worldwide, the book is unequalled not only in breadth of scope, but also in depth of coverage, timeliness of results, and authority of references. It also includes a foreword by Dr. Bernard S. Meyerson, a pioneer in SiGe technology. Containing nearly 1000 figures along with valuable appendices, the Silicon Heterostructure Handbook authoritatively surveys materials, fabrication, device physics, transistor optimization, optoelectronics components, measurement, compact modeling, circuit design, and device simulation.

Fundamentals of Photonics

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Publisher : John Wiley & Sons
ISBN 13 : 1118770099
Total Pages : 1520 pages
Book Rating : 4.1/5 (187 download)

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Book Synopsis Fundamentals of Photonics by : Bahaa E. A. Saleh

Download or read book Fundamentals of Photonics written by Bahaa E. A. Saleh and published by John Wiley & Sons. This book was released on 2019-02-27 with total page 1520 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fundamentals of Photonics A complete, thoroughly updated, full-color third edition Fundamentals of Photonics, Third Edition is a self-contained and up-to-date introductory-level textbook that thoroughly surveys this rapidly expanding area of engineering and applied physics. Featuring a blend of theory and applications, coverage includes detailed accounts of the primary theories of light, including ray optics, wave optics, electromagnetic optics, and photon optics, as well as the interaction of light and matter. Presented at increasing levels of complexity, preliminary sections build toward more advanced topics, such as Fourier optics and holography, photonic-crystal optics, guided-wave and fiber optics, LEDs and lasers, acousto-optic and electro-optic devices, nonlinear optical devices, ultrafast optics, optical interconnects and switches, and optical fiber communications. The third edition features an entirely new chapter on the optics of metals and plasmonic devices. Each chapter contains highlighted equations, exercises, problems, summaries, and selected reading lists. Examples of real systems are included to emphasize the concepts governing applications of current interest. Each of the twenty-four chapters of the second edition has been thoroughly updated.

Advanced Flip Chip Packaging

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 1441957685
Total Pages : 560 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Advanced Flip Chip Packaging by : Ho-Ming Tong

Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Integration of 2D Materials for Electronics Applications

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Author :
Publisher : MDPI
ISBN 13 : 3038976067
Total Pages : 265 pages
Book Rating : 4.0/5 (389 download)

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Book Synopsis Integration of 2D Materials for Electronics Applications by : Filippo Giannazzo

Download or read book Integration of 2D Materials for Electronics Applications written by Filippo Giannazzo and published by MDPI. This book was released on 2019-02-13 with total page 265 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a printed edition of the Special Issue "Integration of 2D Materials for Electronics Applications" that was published in Crystals