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Application Of Fracture Mechanics In Electronic Packaging And Materials
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Book Synopsis Application of Fracture Mechanics in Electronic Packaging by : William T. Chen
Download or read book Application of Fracture Mechanics in Electronic Packaging written by William T. Chen and published by . This book was released on 1997 with total page 206 pages. Available in PDF, EPUB and Kindle. Book excerpt: Twenty-three technical papers from the November 1997 symposium show how applications of the mechanics of fracture help to maintain the reliability of modern electronic components even while they become faster, smaller, and cheaper.
Book Synopsis Application of Fracture Mechanics in Electronic Packaging and Materials by : Tien Y. Wu
Download or read book Application of Fracture Mechanics in Electronic Packaging and Materials written by Tien Y. Wu and published by . This book was released on 1995 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thirty-one technical papers representing a balance between university research and industrial practice, the results of which advance the quality and reliability of electronic products through fracture mechanics. Among the range of topics discussed at the symposium were: analytical and numerical anal
Book Synopsis Modeling and Simulation for Microelectronic Packaging Assembly by : Shen Liu
Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-08-24 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Book Synopsis Manufacturing Challenges in Electronic Packaging by : Y.C. Lee
Download or read book Manufacturing Challenges in Electronic Packaging written by Y.C. Lee and published by Springer Science & Business Media. This book was released on 1997-12-31 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.
Book Synopsis Fracture Mechanics: Applications and Challenges by : M. Fuentes
Download or read book Fracture Mechanics: Applications and Challenges written by M. Fuentes and published by Elsevier. This book was released on 2000-09-13 with total page 275 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains 15 fully peer-reviewed Invited Papers which were presented at the 13th Biennial European Conference on Fracture and is a companion to the CD-ROM http://www.elsevier.com/locate/isbn/008043701xProceedings. The organisers of the ECF 13 opted from the very beginning for an application-orientated conference, and consequently, this book contributes to the understanding of fracture phenomena, and disseminates fracture concepts and their application to the solution of engineering problems to practitioners in a wide range of fields. The fields covered in this book can be broadly classified into: elastic-plastic fracture mechanics, fracture dynamics, fatigue and interactive processes, failure, structural integrity, coatings and materials, with applications to the following industrial sectors: transport, aerospace engineering, civil engineering, pipelines and automotive engineering.
Book Synopsis Basic Fracture Mechanics and its Applications by : Ashok Saxena
Download or read book Basic Fracture Mechanics and its Applications written by Ashok Saxena and published by CRC Press. This book was released on 2022-12-27 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt: This textbook provides a comprehensive guide to fracture mechanics and its applications, providing an in-depth discussion of linear elastic fracture mechanics and a brief introduction to nonlinear fracture mechanics. It is an essential companion to the study of several disciplines such as aerospace, biomedical, civil, materials and mechanical engineering. This interdisciplinary textbook is also useful for professionals in several industries dealing with design and manufacturing of engineering materials and structures. Beginning with four foundational chapters, discussing the theory in depth, the book also presents specific aspects of how fracture mechanics is used to address fatigue crack growth, environment assisted cracking, and creep and creep-fatigue crack growth. Other topics include mixed-mode fracture and materials testing and selection for damage tolerant design, alongside in-depth discussions of ensuring structural integrity of components through real-world examples. There is a strong focus throughout the book on the practical applications of fracture mechanics. It provides a clear description of the theoretical aspects of fracture mechanics and also its limitations. Appendices provide additional background to ensure a comprehensive understanding and every chapter includes solved example problems and unsolved end of chapter problems. Additional instructor support materials are also available.
Book Synopsis The Electronic Packaging Handbook by : Glenn R. Blackwell
Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Book Synopsis Benefiting from Thermal and Mechanical Simulation in Micro-Electronics by : G.Q. Zhang
Download or read book Benefiting from Thermal and Mechanical Simulation in Micro-Electronics written by G.Q. Zhang and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 195 pages. Available in PDF, EPUB and Kindle. Book excerpt: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- LIST type="5" The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
Book Synopsis Fracture Mechanics Of Electromagnetic Materials: Nonlinear Field Theory And Applications by : Xiaohong Chen
Download or read book Fracture Mechanics Of Electromagnetic Materials: Nonlinear Field Theory And Applications written by Xiaohong Chen and published by World Scientific. This book was released on 2012-09-28 with total page 326 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fracture Mechanics of Electromagnetic Materials provides a comprehensive overview of fracture mechanics of conservative and dissipative materials, as well as a general formulation of nonlinear field theory of fracture mechanics and a rigorous treatment of dynamic crack problems involving coupled magnetic, electric, thermal and mechanical field quantities.Thorough emphasis is placed on the physical interpretation of fundamental concepts, development of theoretical models and exploration of their applications to fracture characterization in the presence of magneto-electro-thermo-mechanical coupling and dissipative effects. Mechanical, aeronautical, civil, biomedical, electrical and electronic engineers interested in application of the principles of fracture mechanics to design analysis and durability evaluation of smart structures and devices will find this book an invaluable resource./a
Book Synopsis Computational Methods in Engineering & Science by : Zhenhan Yao
Download or read book Computational Methods in Engineering & Science written by Zhenhan Yao and published by Springer Science & Business Media. This book was released on 2007-12-31 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: Here are the printed proceedings of EPMESC X, held on August 21-23, 2006 in Sanya, Hainan Island of China. It includes 14 full papers of plenary and semi-plenary lectures and approximately 166 one-page summaries. The accompanying CD-ROM includes all 180 full papers presented at the conference.
Book Synopsis National Semiconductor Metrology Program, Semiconductor Electronics Division, NIST List Of Publications, LP 103, March 1999 by :
Download or read book National Semiconductor Metrology Program, Semiconductor Electronics Division, NIST List Of Publications, LP 103, March 1999 written by and published by . This book was released on 1999 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis National Semiconductor Metrology Program by : National Semiconductor Metrology Program (U.S.)
Download or read book National Semiconductor Metrology Program written by National Semiconductor Metrology Program (U.S.) and published by . This book was released on 1999 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging by : Ephraim Suhir
Download or read book Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Book Synopsis National Semiconductor Metrology Program by : National Institute of Standards and Technology (U.S.)
Download or read book National Semiconductor Metrology Program written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 2000 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Encapsulation Technologies for Electronic Applications by : Haleh Ardebili
Download or read book Encapsulation Technologies for Electronic Applications written by Haleh Ardebili and published by William Andrew. This book was released on 2009-07-22 with total page 500 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology. - Guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Coverage of environmentally friendly 'green encapsulants' - Practical coverage of faults and defects: how to analyze them and how to avoid them
Book Synopsis Modeling and Application of Flexible Electronics Packaging by : YongAn Huang
Download or read book Modeling and Application of Flexible Electronics Packaging written by YongAn Huang and published by Springer. This book was released on 2019-04-23 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
Book Synopsis Handbook of Electronic Package Design by : Michael Pecht
Download or read book Handbook of Electronic Package Design written by Michael Pecht and published by CRC Press. This book was released on 2018-10-24 with total page 910 pages. Available in PDF, EPUB and Kindle. Book excerpt: Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
