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Handbook Of Electronic Package Design
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Book Synopsis The Electronic Packaging Handbook by : Glenn R. Blackwell
Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 638 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Book Synopsis Handbook of Electronic Package Design by : Michael Pecht
Download or read book Handbook of Electronic Package Design written by Michael Pecht and published by CRC Press. This book was released on 2018-10-24 with total page 844 pages. Available in PDF, EPUB and Kindle. Book excerpt: Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Book Synopsis Handbook Of Electronics Packaging Design and Engineering by : Bernard S. Matisoff
Download or read book Handbook Of Electronics Packaging Design and Engineering written by Bernard S. Matisoff and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 656 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Handbook of Electronics Packaging Design and Engineering has been writ ten as a reference source for use in the packaging design of electronics equip ment. It is designed to provide a single convenient source for the solution of re curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the following economies and equipment improvements: • Economics of design. Uniform design practices will result in less engineering and design times and lower costs. They will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. • Improved design. Better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. • Production economies. Uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. The Handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting profession. It attempts to present electronics packaging as it is today. It can be used as a training text for instructional purposes and as a reference source for the practicing designer and engineer.
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Book Synopsis Handbook of Electronics Manufacturing Engineering by : Bernie Matisoff
Download or read book Handbook of Electronics Manufacturing Engineering written by Bernie Matisoff and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 691 pages. Available in PDF, EPUB and Kindle. Book excerpt: This single source reference offers a pragmatic and accessible approach to the basic methods and procedures used in the manufacturing and design of modern electronic products. Providing a stategic yet simplified layout, this handbook is set up with an eye toward maximizing productivity in each phase of the eletronics manufacturing process. Not only does this handbook inform the reader on vital issues concerning electronics manufacturing and design, it also provides practical insight and will be of essential use to manufacturing and process engineers in electronics and aerospace manufacturing. In addition, electronics packaging engineers and electronics manufacturing managers and supervisors will gain a wealth of knowledge.
Book Synopsis Electronic Packaging and Interconnection Handbook by : Charles A. Harper
Download or read book Electronic Packaging and Interconnection Handbook written by Charles A. Harper and published by McGraw-Hill Companies. This book was released on 1997 with total page 1020 pages. Available in PDF, EPUB and Kindle. Book excerpt: Charles A. Harper's 2nd edition on designing and manufacturing all the major types of electronic systems is now double the size of the 1st edition. It draws upon the expertise of a dozen experts to make sense of this highly interdisciplinary field
Book Synopsis Electronic Packaging and Interconnection Handbook by : Charles A. Harper
Download or read book Electronic Packaging and Interconnection Handbook written by Charles A. Harper and published by McGraw-Hill Professional Publishing. This book was released on 2000 with total page 1112 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook, Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package. Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more.
Book Synopsis Electronic Packaging by : John H. Lau
Download or read book Electronic Packaging written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1998 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.
Book Synopsis Microelectronics Packaging Handbook by : Rao Tummala
Download or read book Microelectronics Packaging Handbook written by Rao Tummala and published by Springer Science & Business Media. This book was released on 1997-01-31 with total page 662 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Book Synopsis Area Array Packaging Handbook by : Ken Gilleo
Download or read book Area Array Packaging Handbook written by Ken Gilleo and published by McGraw Hill Professional. This book was released on 2002 with total page 832 pages. Available in PDF, EPUB and Kindle. Book excerpt: *Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
Book Synopsis Handbook of Electronic Packaging by : Charles A. Harper
Download or read book Handbook of Electronic Packaging written by Charles A. Harper and published by . This book was released on 1969 with total page 1208 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electronic Designer's Handbook by : Thomas Keith Hemingway
Download or read book Electronic Designer's Handbook written by Thomas Keith Hemingway and published by . This book was released on 1979 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Power Electronics Design Handbook by : Nihal Kularatna
Download or read book Power Electronics Design Handbook written by Nihal Kularatna and published by Elsevier. This book was released on 1998-09-09 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronics Design Handbook covers the basics of power electronics theory and components while emphasizing modern low-power components and applications. Coverage includes power semiconductors, converters, power supplies, batteries, protection systems, and power ICs. One of the unique features of the Power Electronics Design Handbook is the integration of component and system theory with practical applications, particularly energy-saving low-power applications. Many chapters also include a section that looks forward to future developments in that area. References for further information or more in-depth technical reading are also included. Nihal Kularatna is a principal research engineer with the Arthur C. Clarke Foundation in Sri Lanka. He is also the author of Modern Electronic Test and Measuring Instruments, published by the Institute of Electrical Engineers. Emphasizes low- and medium-power components Offers a unique mix of theory and practical application Provides a useful guide to further reading
Book Synopsis Printed Circuit Board Materials Handbook by : Martin W. Jawitz
Download or read book Printed Circuit Board Materials Handbook written by Martin W. Jawitz and published by McGraw Hill Professional. This book was released on 1997 with total page 792 pages. Available in PDF, EPUB and Kindle. Book excerpt: Select PCB materials for top performing boards. From weaving glass fiber mats to testing finished boards, this materials database offers close-up look at how to process and fabricate PCBs. It gives you hands-on working knowledge of the electrical, mechanical and physical properties of PCB raw materials.
Book Synopsis Thermal Design of Electronic Equipment by : Ralph Remsburg
Download or read book Thermal Design of Electronic Equipment written by Ralph Remsburg and published by CRC Press. This book was released on 2017-12-19 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Book Synopsis Microelectronics Packaging Handbook by : R.R. Tummala
Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 742 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Book Synopsis Thermal Management Handbook: For Electronic Assemblies by : Jerry E. Sergent
Download or read book Thermal Management Handbook: For Electronic Assemblies written by Jerry E. Sergent and published by McGraw Hill Professional. This book was released on 1998 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.
