Encapsulation Technologies For Electronic Applications

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Encapsulation Technologies for Electronic Applications

Author : Haleh Ardebili
Publisher : William Andrew
ISBN 13 : 0128119799
Total Pages : 508 pages
Book Rating : 4.1/5 (281 download)

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Book Synopsis Encapsulation Technologies for Electronic Applications by : Haleh Ardebili

Download or read book Encapsulation Technologies for Electronic Applications written by Haleh Ardebili and published by William Andrew. This book was released on 2018-10-23 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them

Flexible Electronic Packaging and Encapsulation Technology

Author : Hong Meng
Publisher : John Wiley & Sons
ISBN 13 : 3527845712
Total Pages : 389 pages
Book Rating : 4.5/5 (278 download)

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Book Synopsis Flexible Electronic Packaging and Encapsulation Technology by : Hong Meng

Download or read book Flexible Electronic Packaging and Encapsulation Technology written by Hong Meng and published by John Wiley & Sons. This book was released on 2024-03-25 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.

Printed Electronics

Author : Zheng Cui
Publisher : John Wiley & Sons
ISBN 13 : 1118920929
Total Pages : 372 pages
Book Rating : 4.1/5 (189 download)

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Book Synopsis Printed Electronics by : Zheng Cui

Download or read book Printed Electronics written by Zheng Cui and published by John Wiley & Sons. This book was released on 2016-09-26 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an overview of the newly emerged and highly interdisciplinary field of printed electronics • Provides an overview of the latest developments and research results in the field of printed electronics • Topics addressed include: organic printable electronic materials, inorganic printable electronic materials, printing processes and equipments for electronic manufacturing, printable transistors, printable photovoltaic devices, printable lighting and display, encapsulation and packaging of printed electronic devices, and applications of printed electronics • Discusses the principles of the above topics, with support of examples and graphic illustrations • Serves both as an advanced introductory to the topic and as an aid for professional development into the new field • Includes end of chapter references and links to further reading

Polymers for Electronic & Photonic Application

Author : C. P. Wong
Publisher : Elsevier
ISBN 13 : 1483289397
Total Pages : 661 pages
Book Rating : 4.4/5 (832 download)

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Book Synopsis Polymers for Electronic & Photonic Application by : C. P. Wong

Download or read book Polymers for Electronic & Photonic Application written by C. P. Wong and published by Elsevier. This book was released on 2013-10-22 with total page 661 pages. Available in PDF, EPUB and Kindle. Book excerpt: The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This book provides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging, electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacture microelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments in this field. * Presents most recent advances in the use of polymeric materials by the electronic industry * Contributions by foremost experts in the field

Advanced Materials for Printed Flexible Electronics

Author : Colin Tong
Publisher : Springer Nature
ISBN 13 : 3030798046
Total Pages : 641 pages
Book Rating : 4.0/5 (37 download)

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Book Synopsis Advanced Materials for Printed Flexible Electronics by : Colin Tong

Download or read book Advanced Materials for Printed Flexible Electronics written by Colin Tong and published by Springer Nature. This book was released on 2021-10-04 with total page 641 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the creation of structure and function, printed flexible electronics have been explored for manufacturing of flexible, stretchable, wearable, and conformal electronics device with conventional, 3D, and hybrid printing technologies. Advanced materials such as polymers, ceramics, nanoparticles, 2D materials, and nanocomposites have enabled a wide variety of applications, such as transparent conductive films, thin film transistors, printable solar cells, flexible energy harvesting and storage devices, electroluminescent devices, and wearable sensors. This book provides students, researchers and engineers with the information to understand the current status and future trends in printed flexible electronics, and acquire skills for selecting and using materials and additive manufacturing processes in the design of printed flexible electronics.

Encapsulated Catalysts

Author : Samahe Sadjadi
Publisher : Academic Press
ISBN 13 : 0128039051
Total Pages : 554 pages
Book Rating : 4.1/5 (28 download)

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Book Synopsis Encapsulated Catalysts by : Samahe Sadjadi

Download or read book Encapsulated Catalysts written by Samahe Sadjadi and published by Academic Press. This book was released on 2017-06-08 with total page 554 pages. Available in PDF, EPUB and Kindle. Book excerpt: Encapsulated Catalysts provides valuable information for chemists, chemical engineers, and materials scientists in this promising area. The book describes many kinds of encapsulated catalysts and their applications in chemistry, including organic, inorganic, hybrid, and biological systems. Unlike other works, which discuss traditional supports, this useful resource uniquely focuses on extremely important topics, such as the encapsulation effects on reactivity and selectivity, the difficulty of their separation from reaction mixture, and/or their sensitivity to reaction conditions, and the limit of their industrial applications. In addition, the book covers the immobilization of homogenous catalysts on inorganic or organic supports and how it enables the separation of homogenous catalysts, as well as the protection or reuse of catalysts. Discusses one of the most promising advances in catalysis and recent developments in the area, including enzyme mimic catalysts and new nano-materials for catalyst encapsulation Provides interdisciplinary coverage of organic, inorganic, and biological materials for encapsulation of catalysts Describes various types of reactions which can be catalyzed in presence of encapsulated catalysts

Encapsulation and Controlled Release Technologies in Food Systems

Author : Jamileh M. Lakkis
Publisher : John Wiley & Sons
ISBN 13 : 1118733525
Total Pages : 410 pages
Book Rating : 4.1/5 (187 download)

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Book Synopsis Encapsulation and Controlled Release Technologies in Food Systems by : Jamileh M. Lakkis

Download or read book Encapsulation and Controlled Release Technologies in Food Systems written by Jamileh M. Lakkis and published by John Wiley & Sons. This book was released on 2016-04-18 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt: The emergence of the discipline of encapsulation and controlled release has had a great impact on the food and dietary supplements sectors; principally around fortifying food systems with nutrients and health-promoting ingredients. The successful incorporation of these actives in food formulations depends on preserving their stability and bioavailability as well as masking undesirable flavors throughout processing, shelf life and consumption. This second edition of Encapsulation and Controlled Release Technologies in Food Systems serves as an improvement and a complement companion to the first. However, it differentiates itself in two main aspects. Firstly, it introduces the reader to novel encapsulation and controlled release technologies which have not yet been addressed by any existing book on this matter, and secondly, it offers an in-depth discussion on the impact of encapsulation and controlled release technologies on the bioavailability of health ingredients and other actives. In common with the first edition the book includes chapters written by distinguished authors and researchers in their respective areas of specialization. This book is designed as a reference for scientists and formulators in the food, nutraceuticals and consumer products industries who are looking to formulate new or existing products using microencapsulated ingredients. It is also a post-graduate text designed to provide students with an introduction to encapsulation and controlled release along with detailed coverage of various encapsulation technologies and their adaptability to specific applications.

Encapsulation of Electronic Devices and Components

Author : Edward R. Salmon
Publisher : CRC Press
ISBN 13 : 9780824775896
Total Pages : 242 pages
Book Rating : 4.7/5 (758 download)

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Book Synopsis Encapsulation of Electronic Devices and Components by : Edward R. Salmon

Download or read book Encapsulation of Electronic Devices and Components written by Edward R. Salmon and published by CRC Press. This book was released on 1986-10-31 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Nitride Semiconductor Light-Emitting Diodes (LEDs)

Author : Jian-Jang Huang
Publisher : Woodhead Publishing
ISBN 13 : 0857099302
Total Pages : 650 pages
Book Rating : 4.8/5 (57 download)

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Book Synopsis Nitride Semiconductor Light-Emitting Diodes (LEDs) by : Jian-Jang Huang

Download or read book Nitride Semiconductor Light-Emitting Diodes (LEDs) written by Jian-Jang Huang and published by Woodhead Publishing. This book was released on 2014-02-14 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of nitride-based light-emitting diodes (LEDs) has led to advancements in high-brightness LED technology for solid-state lighting, handheld electronics, and advanced bioengineering applications. Nitride Semiconductor Light-Emitting Diodes (LEDs) reviews the fabrication, performance, and applications of this technology that encompass the state-of-the-art material and device development, and practical nitride-based LED design considerations. Part one reviews the fabrication of nitride semiconductor LEDs. Chapters cover molecular beam epitaxy (MBE) growth of nitride semiconductors, modern metalorganic chemical vapor deposition (MOCVD) techniques and the growth of nitride-based materials, and gallium nitride (GaN)-on-sapphire and GaN-on-silicon technologies for LEDs. Nanostructured, non-polar and semi-polar nitride-based LEDs, as well as phosphor-coated nitride LEDs, are also discussed. Part two covers the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots. Further chapters discuss the development of LED encapsulation technology and the fundamental efficiency droop issues in gallium indium nitride (GaInN) LEDs. Finally, part three highlights applications of nitride LEDs, including liquid crystal display (LCD) backlighting, infrared emitters, and automotive lighting. Nitride Semiconductor Light-Emitting Diodes (LEDs) is a technical resource for academics, physicists, materials scientists, electrical engineers, and those working in the lighting, consumer electronics, automotive, aviation, and communications sectors. Reviews fabrication, performance, and applications of this technology that encompass the state-of-the-art material and device development, and practical nitride-based LED design considerations Covers the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots Highlights applications of nitride LEDs, including liquid crystal display (LCD) backlighting, infra-red emitters, and automotive lighting

Advances in Micro/Nano Electromechanical Systems and Fabrication Technologies

Author : Kenichi Takahata
Publisher : BoD – Books on Demand
ISBN 13 : 9535110853
Total Pages : 238 pages
Book Rating : 4.5/5 (351 download)

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Book Synopsis Advances in Micro/Nano Electromechanical Systems and Fabrication Technologies by : Kenichi Takahata

Download or read book Advances in Micro/Nano Electromechanical Systems and Fabrication Technologies written by Kenichi Takahata and published by BoD – Books on Demand. This book was released on 2013-05-29 with total page 238 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS technology is increasingly penetrating into our lives and improving our quality of life. In parallel to this, advances in nanotechnology and nanomaterials have been catalyzing the rise of NEMS. Consisting of nine chapters reviewing state-of-the-art technologies and their future trends, this book focuses on the latest development of devices and fabrication processes in the field of these extremely miniaturized electromechanical systems. The book offers new knowledge and insight into design, fabrication, and packaging, as well as solutions in these aspects for targeted applications, aiming to support scientists, engineers and academic trainees who are engaged in relevant research. In the chapters, practical issues and advances are discussed for flexible microdevices, bioMEMS, intelligent implants, optical MEMS, nanomachined structures and NEMS, and others. Most of the chapters also focus on novel fabrication/packaging processes, including silicon bulk micromachining, laser micromachining, nanolithography, and packaging for implantable microelectronics enabled by nanomaterials.

Encapsulation Technologies for Active Food Ingredients and Food Processing

Author : N.J. Zuidam
Publisher : Springer Science & Business Media
ISBN 13 : 1441910085
Total Pages : 402 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Encapsulation Technologies for Active Food Ingredients and Food Processing by : N.J. Zuidam

Download or read book Encapsulation Technologies for Active Food Ingredients and Food Processing written by N.J. Zuidam and published by Springer Science & Business Media. This book was released on 2009-10-30 with total page 402 pages. Available in PDF, EPUB and Kindle. Book excerpt: Consumers prefer food products that are tasty, healthy, and convenient. Encapsulation is an important way to meet these demands by delivering food ingredients at the right time and right place. For example, encapsulates may allow flavor retention, mask bad tasting or bad smelling components, stabilize food ingredients, and increase their bioavailability. Encapsulation may also be used to immobilize cells or enzymes in the production of food materials or products, such as fermentation or metabolite production. This book provides a detailed overview of the encapsulation technologies available for use in food products, food processing, and food production. The book aims to inform those who work in academia or R&D about both the delivery of food compounds via encapsulation and food processing using immobilized cells or enzymes. The structure of the book is according to the use of encapsulates for a specific application. Emphasis is placed on strategy, since encapsulation technologies may change. Most chapters include application possibilities of the encapsulation technologies in specific food products or processes. The first part of the book reviews general technologies, food-grade materials, and characterization methods for encapsulates. The second part discusses encapsulates of active ingredients (e.g., aroma, fish oil, minerals, vitamins, peptides, proteins, probiotics) for specific food applications. The last part describes immobilization technologies of cells and enzymes for use within food fermentation processes (e.g., beer, wine, dairy, meat), and food production (e.g., sugar conversion, production of organic acids or amino acids, hydrolysis of triglycerides). Edited by two leading experts in the field, Encapsulation Technologies for Food Active Ingredients and Food Processing will be a valuable reference source for those working in the academia or food industry. The editors work in both industry or academia, and they have brought together in this book contributions from both fields.

Plastic-Encapsulated Microelectronics

Author : Michael Pecht
Publisher : Wiley-Interscience
ISBN 13 :
Total Pages : 520 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Plastic-Encapsulated Microelectronics by : Michael Pecht

Download or read book Plastic-Encapsulated Microelectronics written by Michael Pecht and published by Wiley-Interscience. This book was released on 1995-02-20 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt: Until now, professionals in search of detailed information about the latest developments in PEM design and production have had to waste valuable time browsing through countless professional journals, monographs, and databases.

Green Materials for Electronics

Author : Mihai Irimia-Vladu
Publisher : John Wiley & Sons
ISBN 13 : 3527338659
Total Pages : 348 pages
Book Rating : 4.5/5 (273 download)

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Book Synopsis Green Materials for Electronics by : Mihai Irimia-Vladu

Download or read book Green Materials for Electronics written by Mihai Irimia-Vladu and published by John Wiley & Sons. This book was released on 2017-12-04 with total page 348 pages. Available in PDF, EPUB and Kindle. Book excerpt: Combining the materials science, technological, and device aspects of organic bioelectronics based on green materials, this is the first overview of the emerging concepts involving fabrication techniques for sustainable electronics with low energy and material consumption. With contributions from top-notch editors and authors, in one focus, the book covers a collection of natural materials suited for electronics applications such as paper, silk, melanin, DNA and nucleobases, resins, gums, saccharides, cellulose, gelatine and peptides. In another thrust, the book focuses on device fabrication based on these materials, including processing aspects, and applications such as sensors, signal transducers, transient, implantable and digestible electronics. With its interdisciplinary approach this text will appeal to the chemistry, physics, materials science, and engineering communities.

Handbook of Flexible Organic Electronics

Author : Stergios Logothetidis
Publisher : Elsevier
ISBN 13 : 1782420436
Total Pages : 478 pages
Book Rating : 4.7/5 (824 download)

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Book Synopsis Handbook of Flexible Organic Electronics by : Stergios Logothetidis

Download or read book Handbook of Flexible Organic Electronics written by Stergios Logothetidis and published by Elsevier. This book was released on 2014-12-15 with total page 478 pages. Available in PDF, EPUB and Kindle. Book excerpt: Organic flexible electronics represent a highly promising technology that will provide increased functionality and the potential to meet future challenges of scalability, flexibility, low power consumption, light weight, and reduced cost. They will find new applications because they can be used with curved surfaces and incorporated in to a number of products that could not support traditional electronics. The book covers device physics, processing and manufacturing technologies, circuits and packaging, metrology and diagnostic tools, architectures, and systems engineering. Part one covers the production, properties and characterisation of flexible organic materials and part two looks at applications for flexible organic devices. Reviews the properties and production of various flexible organic materials. Describes the integration technologies of flexible organic electronics and their manufacturing methods. Looks at the application of flexible organic materials in smart integrated systems and circuits, chemical sensors, microfluidic devices, organic non-volatile memory devices, and printed batteries and other power storage devices.

Flexible Electronics

Author : William S. Wong
Publisher : Springer Science & Business Media
ISBN 13 : 0387743634
Total Pages : 474 pages
Book Rating : 4.3/5 (877 download)

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Book Synopsis Flexible Electronics by : William S. Wong

Download or read book Flexible Electronics written by William S. Wong and published by Springer Science & Business Media. This book was released on 2009-04-09 with total page 474 pages. Available in PDF, EPUB and Kindle. Book excerpt: This excellent volume covers a range of materials used for flexible electronics, including semiconductors, dielectrics, and metals. The functional integration of these different materials is treated as well. Fundamental issues for both organic and inorganic materials systems are included. A corresponding overview of technological applications, based on each materials system, is presented to give both the non-specialist and the researcher in the field relevant information on the status of the flexible electronics area.

The Flexible Electronics Opportunity

Author : National Research Council (U.S.). Committee on Best Practice in National Innovation Programs for Flexible Electronics
Publisher : National Academies Press
ISBN 13 : 9780309305914
Total Pages : 0 pages
Book Rating : 4.3/5 (59 download)

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Book Synopsis The Flexible Electronics Opportunity by : National Research Council (U.S.). Committee on Best Practice in National Innovation Programs for Flexible Electronics

Download or read book The Flexible Electronics Opportunity written by National Research Council (U.S.). Committee on Best Practice in National Innovation Programs for Flexible Electronics and published by National Academies Press. This book was released on 2014 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Flexible electronics describes circuits that can bend and stretch, enabling significant versatility in applications and the prospect of low-cost manufacturing processes. They represent an important technological advance, in terms of their performance characteristics and potential range of applications, ranging from medical care, packaging, lighting and signage, consumer electronics and alternative energy (especially solar energy.) What these technologies have in common is a dependence on efficient manufacturing that currently requires improved technology, processes, tooling, and materials, as well as ongoing research. Seeking to capture the global market opportunity in flexible electronics, major U.S. competitors have initiated dedicated programs that are large in scope and supported with significant government funding to develop and acquire these new technologies, refine them, and ultimately manufacture them within their national borders. These national and regional investments are significantly larger than U.S. investment and more weighted toward later stage applied research and development. The Flexible Electronics Opportunity examines and compares selected innovation programs both foreign and domestic, and their potential to advance the production of flexible electronics technology in the United States. This report reviews the goals, concept, structure, operation, funding levels, and evaluation of foreign programs similar to major U.S. programs, e.g., innovation awards, S&T parks, and consortia. The report describes the transition of flexible electronics research into products and to makes recommendations to improve and to develop U.S. programs. Through an examination of the role of research consortia around the world to advance flexible electronics technology, the report makes recommendations for steps that the U.S. might consider to develop a robust industry in the United States. Significant U.S. expansion in the market for flexible electronics technologies is not likely to occur in the absence of mechanisms to address investment risks, the sharing of intellectual property, and the diverse technology requirements associated with developing and manufacturing flexible electronics technologies. The Flexible Electronics Opportunity makes recommendations for collaboration among industry, universities, and government to achieve the critical levels of investment and the acceleration of new technology development that are needed to catalyze a vibrant flexible electronics industry.

Lead-free Soldering Process Development and Reliability

Author : Jasbir Bath
Publisher : John Wiley & Sons
ISBN 13 : 1119482046
Total Pages : 512 pages
Book Rating : 4.1/5 (194 download)

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Book Synopsis Lead-free Soldering Process Development and Reliability by : Jasbir Bath

Download or read book Lead-free Soldering Process Development and Reliability written by Jasbir Bath and published by John Wiley & Sons. This book was released on 2020-06-12 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.