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Area Array Interconnection Handbook

Author : Karl J. Puttlitz
Publisher : Springer Science & Business Media
ISBN 13 : 1461513898
Total Pages : 1250 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Area Array Interconnection Handbook by : Karl J. Puttlitz

Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.

Rapid Thermal and Other Short-time Processing Technologies II

Author : Dim-Lee Kwong
Publisher : The Electrochemical Society
ISBN 13 : 9781566773157
Total Pages : 458 pages
Book Rating : 4.7/5 (731 download)

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Book Synopsis Rapid Thermal and Other Short-time Processing Technologies II by : Dim-Lee Kwong

Download or read book Rapid Thermal and Other Short-time Processing Technologies II written by Dim-Lee Kwong and published by The Electrochemical Society. This book was released on 2001 with total page 458 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Electronics, Dielectric Science and Technology, and High Temperature Materials Divisions."

Solder Joint Technology

Author : King-Ning Tu
Publisher : Springer Science & Business Media
ISBN 13 : 0387388923
Total Pages : 376 pages
Book Rating : 4.3/5 (873 download)

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Book Synopsis Solder Joint Technology by : King-Ning Tu

Download or read book Solder Joint Technology written by King-Ning Tu and published by Springer Science & Business Media. This book was released on 2007-07-27 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.

Electronic Thin-Film Reliability

Author : King-Ning Tu
Publisher : Cambridge University Press
ISBN 13 : 1139492705
Total Pages : 413 pages
Book Rating : 4.1/5 (394 download)

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Book Synopsis Electronic Thin-Film Reliability by : King-Ning Tu

Download or read book Electronic Thin-Film Reliability written by King-Ning Tu and published by Cambridge University Press. This book was released on 2010-11-25 with total page 413 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.

Crucial Issues in Semiconductor Materials and Processing Technologies

Author : S. Coffa
Publisher : Springer Science & Business Media
ISBN 13 : 9780792320036
Total Pages : 568 pages
Book Rating : 4.3/5 (2 download)

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Book Synopsis Crucial Issues in Semiconductor Materials and Processing Technologies by : S. Coffa

Download or read book Crucial Issues in Semiconductor Materials and Processing Technologies written by S. Coffa and published by Springer Science & Business Media. This book was released on 1992-10-31 with total page 568 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductors lie at the heart of some of the most important industries and technologies of the twentieth century. The complexity of silicon integrated circuits is increasing considerably because of the continuous dimensional shrinkage to improve efficiency and functionality. This evolution in design rules poses real challenges for the materials scientists and processing engineers. Materials, defects and processing now have to be understood in their totality. World experts discuss, in this volume, the crucial issues facing lithography, ion implication and plasma processing, metallization and insulating layer quality, and crystal growth. Particular emphasis is placed upon silicon, but compound semiconductors and photonic materials are also highlighted. The fundamental concepts of phase stability, interfaces and defects play a key role in understanding these crucial issues. These concepts are reviewed in a crucial fashion.

Electronic Packaging Science and Technology

Author : King-Ning Tu
Publisher : John Wiley & Sons
ISBN 13 : 1119418313
Total Pages : 340 pages
Book Rating : 4.1/5 (194 download)

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Book Synopsis Electronic Packaging Science and Technology by : King-Ning Tu

Download or read book Electronic Packaging Science and Technology written by King-Ning Tu and published by John Wiley & Sons. This book was released on 2021-12-29 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.

3D Microelectronic Packaging

Author : Yan Li
Publisher : Springer
ISBN 13 : 3319445863
Total Pages : 465 pages
Book Rating : 4.3/5 (194 download)

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Book Synopsis 3D Microelectronic Packaging by : Yan Li

Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer. This book was released on 2017-01-20 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Solder Materials

Author : Kwang-lung Lin
Publisher : World Scientific
ISBN 13 : 9813238216
Total Pages : 388 pages
Book Rating : 4.8/5 (132 download)

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Book Synopsis Solder Materials by : Kwang-lung Lin

Download or read book Solder Materials written by Kwang-lung Lin and published by World Scientific. This book was released on 2018-07-13 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.

Introduction to Unified Mechanics Theory with Applications

Author : Cemal Basaran
Publisher : Springer Nature
ISBN 13 : 3031186214
Total Pages : 531 pages
Book Rating : 4.0/5 (311 download)

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Book Synopsis Introduction to Unified Mechanics Theory with Applications by : Cemal Basaran

Download or read book Introduction to Unified Mechanics Theory with Applications written by Cemal Basaran and published by Springer Nature. This book was released on 2023-01-04 with total page 531 pages. Available in PDF, EPUB and Kindle. Book excerpt: This second edition adds new sections on derivation of dynamic equilibrium equations in unified mechanics theory and solution of an example, derivation of very high cycle fatigue thermodynamic fundamental equation and application/verification with two metal fatigue examples, derivation of thermodynamic fundamental equations for metal corrosion, examples of corrosion – fatigue interaction. There is also an example of ultrasonic vibration fatigue and one traditional tension/compression loading in elastic regime. While updated and augmented throughout, the book retains its description of the mathematical formulation and proof of the unified mechanics theory (UMT), which is based on the unification of Newton’s laws and the laws of thermodynamics. It also presents formulations and experimental verifications of the theory for thermal, mechanical, electrical, corrosion, chemical and fatigue loads, and it discusses why the original universal laws of motion proposed by Isaac Newton in 1687 are incomplete. The author provides concrete examples, such as how Newton’s second law, F = ma, gives the initial acceleration of a soccer ball kicked by a player, but does not tell us how and when the ball would come to a stop. Over the course of the text, Dr. Basaran illustrates that Newtonian mechanics does not account for the thermodynamic changes happening in a system over its usable lifetime. And in this context, this book explains how to design a system to perform its intended functions safely over its usable life time and predicts the expected lifetime of the system without using empirical models, a process currently done using Newtonian mechanics and empirical degradation/failure/fatigue models which are curve-fit to test data. Written as a textbook suitable for upper-level undergraduate mechanics courses, as well as first year graduate level courses, this book is the result of over 25 years of scientific activity with the contribution of dozens of scientists from around the world.

Reliability and Failure of Electronic Materials and Devices

Author : Milton Ohring
Publisher : Elsevier
ISBN 13 : 0080516076
Total Pages : 715 pages
Book Rating : 4.0/5 (85 download)

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Book Synopsis Reliability and Failure of Electronic Materials and Devices by : Milton Ohring

Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Elsevier. This book was released on 1998-06-12 with total page 715 pages. Available in PDF, EPUB and Kindle. Book excerpt: Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects--their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed.The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise. - Discusses reliability and failure on both the chip and packaging levels - Handles the role of defects in yield and reliability - Includes a tutorial chapter on the mathematics of reliability - Focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints - Considers defect detection methods and failure analysis techniques

Lead-free Solders

Author : K. Subramanian
Publisher : John Wiley & Sons
ISBN 13 : 1119966809
Total Pages : 510 pages
Book Rating : 4.1/5 (199 download)

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Book Synopsis Lead-free Solders by : K. Subramanian

Download or read book Lead-free Solders written by K. Subramanian and published by John Wiley & Sons. This book was released on 2012-03-06 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.

Nuclear Science Abstracts

Author :
Publisher :
ISBN 13 :
Total Pages : 1524 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Nuclear Science Abstracts by :

Download or read book Nuclear Science Abstracts written by and published by . This book was released on 1972 with total page 1524 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Author : Karl J. Puttlitz
Publisher : CRC Press
ISBN 13 : 082475249X
Total Pages : 1044 pages
Book Rating : 4.8/5 (247 download)

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Book Synopsis Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by : Karl J. Puttlitz

Download or read book Handbook of Lead-Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

Nanopackaging

Author : James E. Morris
Publisher : Springer
ISBN 13 : 3319903624
Total Pages : 1007 pages
Book Rating : 4.3/5 (199 download)

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Book Synopsis Nanopackaging by : James E. Morris

Download or read book Nanopackaging written by James E. Morris and published by Springer. This book was released on 2018-09-22 with total page 1007 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Theory of Transformations in Steels

Author : Harshad K. D. H. Bhadeshia
Publisher : CRC Press
ISBN 13 : 1000352684
Total Pages : 604 pages
Book Rating : 4.0/5 (3 download)

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Book Synopsis Theory of Transformations in Steels by : Harshad K. D. H. Bhadeshia

Download or read book Theory of Transformations in Steels written by Harshad K. D. H. Bhadeshia and published by CRC Press. This book was released on 2021-03-25 with total page 604 pages. Available in PDF, EPUB and Kindle. Book excerpt: Written by the leading authority in the field of solid-state phase transformations, Theory of Transformations in Steels is the first book to provide readers with a complete discussion of the theory of transformations in steel. Offers comprehensive treatment of solid-state transformations, covering the vast number in steels Serves as a single source for almost any aspect of the subject Features discussion of physical properties, thermodynamics, diffusion, and kinetics Covers ferrites, martensite, cementite, carbides, nitrides, substitutionally-alloyed precipitates, and pearlite Contains a thoroughly researched and comprehensive list of references as further and recommended reading With its broad and deep coverage of the subject, this work aims at inspiring research within the field of materials science and metallurgy.

Proceedings of the Second International Conference on Long Wavelength Infrared Dectectors and Arrays, Physics and Applications

Author : V. Swaminathan
Publisher : The Electrochemical Society
ISBN 13 : 9781566770897
Total Pages : 276 pages
Book Rating : 4.7/5 (78 download)

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Book Synopsis Proceedings of the Second International Conference on Long Wavelength Infrared Dectectors and Arrays, Physics and Applications by : V. Swaminathan

Download or read book Proceedings of the Second International Conference on Long Wavelength Infrared Dectectors and Arrays, Physics and Applications written by V. Swaminathan and published by The Electrochemical Society. This book was released on 1995 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Radioisotopes—Advances in Research and Application: 2012 Edition

Author :
Publisher : ScholarlyEditions
ISBN 13 : 1481603949
Total Pages : 202 pages
Book Rating : 4.4/5 (816 download)

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Book Synopsis Radioisotopes—Advances in Research and Application: 2012 Edition by :

Download or read book Radioisotopes—Advances in Research and Application: 2012 Edition written by and published by ScholarlyEditions. This book was released on 2012-12-26 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt: Radioisotopes—Advances in Research and Application: 2012 Edition is a ScholarlyEditions™ eBook that delivers timely, authoritative, and comprehensive information about Radioisotopes. The editors have built Radioisotopes—Advances in Research and Application: 2012 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Radioisotopes in this eBook to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Radioisotopes—Advances in Research and Application: 2012 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.