Reliability And Failure Of Electronic Materials And Devices

Download Reliability And Failure Of Electronic Materials And Devices full books in PDF, epub, and Kindle. Read online Reliability And Failure Of Electronic Materials And Devices ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!

Reliability and Failure of Electronic Materials and Devices

Author : Milton Ohring
Publisher : Academic Press
ISBN 13 : 0080575528
Total Pages : 758 pages
Book Rating : 4.0/5 (85 download)

DOWNLOAD NOW!

Book Synopsis Reliability and Failure of Electronic Materials and Devices by : Milton Ohring

Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Academic Press. This book was released on 2014-11-03 with total page 758 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

Corrosion and Reliability of Electronic Materials and Devices

Author : Robert B. Comizzoli
Publisher : The Electrochemical Society
ISBN 13 : 9781566772525
Total Pages : 308 pages
Book Rating : 4.7/5 (725 download)

DOWNLOAD NOW!

Book Synopsis Corrosion and Reliability of Electronic Materials and Devices by : Robert B. Comizzoli

Download or read book Corrosion and Reliability of Electronic Materials and Devices written by Robert B. Comizzoli and published by The Electrochemical Society. This book was released on 1999 with total page 308 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Reliability of Semiconductor Lasers and Optoelectronic Devices

Author : Robert Herrick
Publisher : Woodhead Publishing
ISBN 13 : 0128192550
Total Pages : 334 pages
Book Rating : 4.1/5 (281 download)

DOWNLOAD NOW!

Book Synopsis Reliability of Semiconductor Lasers and Optoelectronic Devices by : Robert Herrick

Download or read book Reliability of Semiconductor Lasers and Optoelectronic Devices written by Robert Herrick and published by Woodhead Publishing. This book was released on 2021-03-06 with total page 334 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability of Semiconductor Lasers and Optoelectronic Devices simplifies complex concepts of optoelectronics reliability with approachable introductory chapters and a focus on real-world applications. This book provides a brief look at the fundamentals of laser diodes, introduces reliability qualification, and then presents real-world case studies discussing the principles of reliability and what occurs when these rules are broken. Then this book comprehensively looks at optoelectronics devices and the defects that cause premature failure in them and how to control those defects. Key materials and devices are reviewed including silicon photonics, vertical-cavity surface-emitting lasers (VCSELs), InGaN LEDs and lasers, and AlGaN LEDs, covering the majority of optoelectronic devices that we use in our everyday lives, powering the Internet, telecommunication, solid-state lighting, illuminators, and many other applications. This book features contributions from experts in industry and academia working in these areas and includes numerous practical examples and case studies. This book is suitable for new entrants to the field of optoelectronics working in R&D. • Includes case studies and numerous examples showing best practices and common mistakes affecting optoelectronics reliability written by experts working in the industry • Features the first wide-ranging and comprehensive overview of fiber optics reliability engineering, covering all elements of the practice from building a reliability laboratory, qualifying new products, to improving reliability on mature products. • Provides a look at the reliability issues and failure mechanisms for silicon photonics, VCSELs, InGaN LEDs and lasers, AIGaN LEDs, and more.

Failure Analysis

Author : Marius Bazu
Publisher : John Wiley & Sons
ISBN 13 : 1119990009
Total Pages : 372 pages
Book Rating : 4.1/5 (199 download)

DOWNLOAD NOW!

Book Synopsis Failure Analysis by : Marius Bazu

Download or read book Failure Analysis written by Marius Bazu and published by John Wiley & Sons. This book was released on 2011-03-08 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.

Materials and Reliability Handbook for Semiconductor Optical and Electron Devices

Author : Osamu Ueda
Publisher : Springer Science & Business Media
ISBN 13 : 1461443369
Total Pages : 618 pages
Book Rating : 4.4/5 (614 download)

DOWNLOAD NOW!

Book Synopsis Materials and Reliability Handbook for Semiconductor Optical and Electron Devices by : Osamu Ueda

Download or read book Materials and Reliability Handbook for Semiconductor Optical and Electron Devices written by Osamu Ueda and published by Springer Science & Business Media. This book was released on 2012-09-24 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt: Materials and Reliability Handbook for Semiconductor Optical and Electron Devices provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature. The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.

Practical Reliability Of Electronic Equipment And Products

Author : Eugene R. Hnatek
Publisher : CRC Press
ISBN 13 : 0824743547
Total Pages : 433 pages
Book Rating : 4.8/5 (247 download)

DOWNLOAD NOW!

Book Synopsis Practical Reliability Of Electronic Equipment And Products by : Eugene R. Hnatek

Download or read book Practical Reliability Of Electronic Equipment And Products written by Eugene R. Hnatek and published by CRC Press. This book was released on 2002-10-25 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Practical Reliability of Electronic Equipment and Products will help electrical, electronics, manufacturing, mechanical, systems design, and reliability engineers; electronics production managers; electronic circuit designers; and upper-level undergraduate and graduate students in these disciplines.

Reliable Design of Electronic Equipment

Author : Dhanasekharan Natarajan
Publisher : Springer
ISBN 13 : 3319091115
Total Pages : 156 pages
Book Rating : 4.3/5 (19 download)

DOWNLOAD NOW!

Book Synopsis Reliable Design of Electronic Equipment by : Dhanasekharan Natarajan

Download or read book Reliable Design of Electronic Equipment written by Dhanasekharan Natarajan and published by Springer. This book was released on 2014-08-02 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains reliability techniques with examples from electronics design for the benefit of engineers. It presents the application of de-rating, FMEA, overstress analyses and reliability improvement tests for designing reliable electronic equipment. Adequate information is provided for designing computerized reliability database system to support the application of the techniques by designers. Pedantic terms and the associated mathematics of reliability engineering discipline are excluded for the benefit of comprehensiveness and practical applications. This book offers excellent support for electrical and electronics engineering students and professionals, bridging academic curriculum with industrial expectations.

Electronic Thin-Film Reliability

Author : King-Ning Tu
Publisher : Cambridge University Press
ISBN 13 : 1139492705
Total Pages : 413 pages
Book Rating : 4.1/5 (394 download)

DOWNLOAD NOW!

Book Synopsis Electronic Thin-Film Reliability by : King-Ning Tu

Download or read book Electronic Thin-Film Reliability written by King-Ning Tu and published by Cambridge University Press. This book was released on 2010-11-25 with total page 413 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.

Practical Electronic Reliability Engineering

Author : Jerome Klion
Publisher : Springer Science & Business Media
ISBN 13 : 9401169705
Total Pages : 616 pages
Book Rating : 4.4/5 (11 download)

DOWNLOAD NOW!

Book Synopsis Practical Electronic Reliability Engineering by : Jerome Klion

Download or read book Practical Electronic Reliability Engineering written by Jerome Klion and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is intended for the engineer or engineering student with little or no prior background in reliability. Its purpose is to provide the background material and guidance necessary to comprehend and carry out all the tasks associated with a reliability program from specification generation to final demonstration of reliability achieved. Most available texts on reliability concentrate on the mathematics and statistics used for reliability analysis, evaluation, and demonstration. They are more often suited more for the professional with a heavier mathematical background that most engineers have, and more often than not, ignore or pay short-shrift to basic engineering design and organizational efforts associated with a reliability program. A reliability engineer must be familiar with both the mathematics and engineering aspects of a reliability program. This text: 1. Describes the mathematics needed for reliability analysis, evaluation, and demonstration commensurate with an engineer's background. 2. Provides background material, guidance, and references necessary to the structure and implementation of a reliability program including: • identification of the reliability standards in most common use • how to generate and respond to a reliability specification • how reliability can be increased • the tasks which make up a reliability program and how to judge the need and scope of each; how each is commonly performed; caution and comments about their application.

Electronics Reliability–Calculation and Design

Author : Geoffrey W. A. Dummer
Publisher : Elsevier
ISBN 13 : 1483149269
Total Pages : 248 pages
Book Rating : 4.4/5 (831 download)

DOWNLOAD NOW!

Book Synopsis Electronics Reliability–Calculation and Design by : Geoffrey W. A. Dummer

Download or read book Electronics Reliability–Calculation and Design written by Geoffrey W. A. Dummer and published by Elsevier. This book was released on 2013-10-22 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics Reliability–Calculation and Design provides an introduction to the fundamental concepts of reliability. The increasing complexity of electronic equipment has made problems in designing and manufacturing a reliable product more and more difficult. Specific techniques have been developed that enable designers to integrate reliability into their products, and reliability has become a science in its own right. The book begins with a discussion of basic mathematical and statistical concepts, including arithmetic mean, frequency distribution, median and mode, scatter or dispersion of measurements, and the normal and binomial distributions. Separate chapters deal with techniques for calculating equipment and system reliability; safety and derating factors; and the effects of constructional methods on reliability. Subsequent chapters cover environmental effects on reliability; improved reliability through microelectronics or integrated circuits; and failure rates for electronic components. Each chapter concludes with questions to enable students to test their understanding of the topics discussed. This book offers students an introduction to the subject of reliability in a form that is easily assimilated. It also serves as a reference to the various aspects contributing towards increased reliability of both electronic equipment and complete systems.

Reliability Characterisation of Electrical and Electronic Systems

Author : Jonathan Swingler
Publisher : Woodhead Publishing
ISBN 13 : 9780081029633
Total Pages : 350 pages
Book Rating : 4.0/5 (296 download)

DOWNLOAD NOW!

Book Synopsis Reliability Characterisation of Electrical and Electronic Systems by : Jonathan Swingler

Download or read book Reliability Characterisation of Electrical and Electronic Systems written by Jonathan Swingler and published by Woodhead Publishing. This book was released on 2020-11-15 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book charts how reliability engineering has moved from the use of sometimes arbitrary standards to an empirical scientific approach of understanding operating conditions, failure mechanisms, the need for testing for a more realistic characterisation and, new for the second edition, includes the monitoring of performance/robustness in the field. Reliability Characterisation of Electrical and Electronic Systems brings together a number of experts and key players in the discipline to concisely present the fundamentals and background to reliability theory, elaborate on the current thinking and developments behind reliability characterisation, and give a detailed account of emerging issues across a wide range of applications. The second edition has a new section titled Reliability Condition Monitoring and Prognostics for Specific Application which provides a guide to critical issues in key industrial sectors such as automotive and aerospace. There are also new chapters on areas of growing importance such as reliability methods in high-temperature electronics and reliability and testing of electric aircraft power systems. Reviews emerging areas of importance such as reliability methods in high-temperature electronics and reliability testing of electric vehicles Looks at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability Facilitates a greater understanding of operating conditions, failure mechanisms and the need for testing

Modern Power Electronic Devices

Author : Francesco Iannuzzo
Publisher : Energy Engineering
ISBN 13 : 9781785619175
Total Pages : 504 pages
Book Rating : 4.6/5 (191 download)

DOWNLOAD NOW!

Book Synopsis Modern Power Electronic Devices by : Francesco Iannuzzo

Download or read book Modern Power Electronic Devices written by Francesco Iannuzzo and published by Energy Engineering. This book was released on 2020-10 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power devices are key to modern power systems, performing functions such as inverting and changing voltages, buffering and switching. Following a device-centric approach, this book covers power electronic applications, semiconductor physics, materials science, application engineering, and key technologies such as MOSFET, IGBT and WBG.

Semiconductor Material and Device Characterization

Author : Dieter K. Schroder
Publisher : John Wiley & Sons
ISBN 13 : 0471739065
Total Pages : 800 pages
Book Rating : 4.4/5 (717 download)

DOWNLOAD NOW!

Book Synopsis Semiconductor Material and Device Characterization by : Dieter K. Schroder

Download or read book Semiconductor Material and Device Characterization written by Dieter K. Schroder and published by John Wiley & Sons. This book was released on 2015-06-29 with total page 800 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.

Reliability of Electronic Packages and Semiconductor Devices

Author : Giulio Di Giacomo
Publisher : McGraw-Hill Professional Publishing
ISBN 13 : 9780070170247
Total Pages : 0 pages
Book Rating : 4.1/5 (72 download)

DOWNLOAD NOW!

Book Synopsis Reliability of Electronic Packages and Semiconductor Devices by : Giulio Di Giacomo

Download or read book Reliability of Electronic Packages and Semiconductor Devices written by Giulio Di Giacomo and published by McGraw-Hill Professional Publishing. This book was released on 1997 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This text looks at predicting and extending the functional life of semiconductor components. Using empirical modelling, the author covers major types of failure mechanisms that can greatly reduce the active life of semiconductor components, including interconnection fatigue and electromigration.

Engineering Materials Science

Author : Milton Ohring
Publisher : Academic Press
ISBN 13 : 0125249950
Total Pages : 861 pages
Book Rating : 4.1/5 (252 download)

DOWNLOAD NOW!

Book Synopsis Engineering Materials Science by : Milton Ohring

Download or read book Engineering Materials Science written by Milton Ohring and published by Academic Press. This book was released on 1995 with total page 861 pages. Available in PDF, EPUB and Kindle. Book excerpt: This introductory text is intended to provide undergraduate engineering students with the background needed to understand the science of structure-property relationships, as well as address the engineering concerns of materials selection in design. A computer diskette is included.

Direct Copper Interconnection for Advanced Semiconductor Technology

Author : Dongkai Shangguan
Publisher : CRC Press
ISBN 13 : 1040028640
Total Pages : 463 pages
Book Rating : 4.0/5 (4 download)

DOWNLOAD NOW!

Book Synopsis Direct Copper Interconnection for Advanced Semiconductor Technology by : Dongkai Shangguan

Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Reliability of Microtechnology

Author : Johan Liu
Publisher : Springer Science & Business Media
ISBN 13 : 144195760X
Total Pages : 216 pages
Book Rating : 4.4/5 (419 download)

DOWNLOAD NOW!

Book Synopsis Reliability of Microtechnology by : Johan Liu

Download or read book Reliability of Microtechnology written by Johan Liu and published by Springer Science & Business Media. This book was released on 2011-02-07 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also includes exercises and detailed solutions at the end of each chapter.