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Study Of Forced Convection Heat Transfer From An Array Of Elliptical Pin Fin Heat Sink
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Book Synopsis Study of Forced Convection Heat Transfer from an Array of Elliptical Pin Fin Heat Sink by : Independently Published
Download or read book Study of Forced Convection Heat Transfer from an Array of Elliptical Pin Fin Heat Sink written by Independently Published and published by . This book was released on 2018-08-16 with total page 62 pages. Available in PDF, EPUB and Kindle. Book excerpt: In modernization, heat sink plays a key role to enhance heat transfer. A heat sink is a device which helps to dissipate the heat from heated surface using direct contact or radiant thermal contact. Heat sinks are basically used to enhance the heat transfer from the heated surface to eliminate the effect of overheating or burning. The heat sinks made up of copper and aluminum and directly attached to the heated surface. Extended surfaces are commonly used to improve the heat transfer in many industries. The extended surface of heat sink helps to increase the surface area in contact with air. It maintains the thermal stability of the system in limits for every electrical and electronic component of any system. There are different kinds of heat sink with different fin geometries and operating with natural or forced convection. Most of the work has been done on rectangular pin fin and circular pin fin under natural and forced convection. In present work, the modeling and fabrication is done on elliptical heat sink and perforated elliptical heat sink with circular perforation. In this work different wattages (100, 150, 200 and 250 W) are used with Reynolds number ranging from 8400 to 21000. The various flow velocities used are 4m/sec, 6m/sec, 8m/sec and 10m/sec. The perforation is done in the middle of the pin fin to achieve maximum heat transfer. The overall performance of the pin fin heat sink is affected by the perforation. In present study the experiment analysis is performed w.r.t the heat transfer coefficient, temperature variation and nusselt number for heat sinks. In experiment the working fluid is used as air. In the present work two different arrangements: elliptical pin fin heat sink and perforated elliptical pin fin heat sink are selected. Within the Reynolds number range 8400 to 21000 perforated elliptical pin fin heat has higher heat transfer coefficient in comparison to elliptical pin fin heat sink. The temperature variation in perforated elliptical pin fin heat sink is more as compare to other one. It was observe that the Nusselt number is directly proportional to the number of perforations. As the number perforation or perforation size increases the heat transfer coefficient also increases.
Book Synopsis Numerical Simulation of Heat Exchangers by : W. J. Minkowycz
Download or read book Numerical Simulation of Heat Exchangers written by W. J. Minkowycz and published by CRC Press. This book was released on 2017-04-07 with total page 273 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book deals with certain aspects of material science, particularly with the release of thermal energy associated with bond breaking. It clearly establishes the connection between heat transfer rates and product quality. The editors then sharply draw the thermal distinctions between the various categories of welding processes, and demonstrate how these distinctions are translated into simulation model uniqueness. The book discusses the incorporation of radiative heat transfer processes into the simulation model.
Download or read book ITHERM written by and published by . This book was released on 2000 with total page 442 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Optimal Free- and Forced-convection Cooling of Electronics by : Timothy Scott Fisher
Download or read book Optimal Free- and Forced-convection Cooling of Electronics written by Timothy Scott Fisher and published by . This book was released on 1998 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advances in Fluid and Thermal Engineering by : Pankaj Saha
Download or read book Advances in Fluid and Thermal Engineering written by Pankaj Saha and published by Springer. This book was released on 2019-04-23 with total page 831 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises select proceedings of the International Conference on Future Learning Aspects of Mechanical Engineering (FLAME 2018). The book gives an overview of recent developments in the field of thermal and fluid engineering, and covers theoretical and experimental fluid dynamics, numerical methods in heat transfer and fluid mechanics, different modes of heat transfer, multiphase transport and phase change, fluid machinery, turbo machinery, and fluid power. The book is primarily intended for researchers and professionals working in the field of fluid dynamics and thermal engineering.
Book Synopsis Journal of Thermophysics and Heat Transfer by :
Download or read book Journal of Thermophysics and Heat Transfer written by and published by . This book was released on 2007 with total page 868 pages. Available in PDF, EPUB and Kindle. Book excerpt: This journal is devoted to the advancement of the science and technology of thermophysics and heat transfer through the dissemination of original research papers disclosing new technical knowledge and exploratory developments and applications based on new knowledge. It publishes papers that deal with the properties and mechanisms involved in thermal energy transfer and storage in gases, liquids, and solids or combinations thereof. These studies include conductive, convective, and radiative modes alone or in combination and the effects of the environment.
Book Synopsis Techno-Societal 2018 by : Prashant M. Pawar
Download or read book Techno-Societal 2018 written by Prashant M. Pawar and published by Springer Nature. This book was released on 2019-11-06 with total page 968 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, divided in two volumes, originates from Techno-Societal 2018: the 2nd International Conference on Advanced Technologies for Societal Applications, Maharashtra, India, that brings together faculty members of various engineering colleges to solve Indian regional relevant problems under the guidance of eminent researchers from various reputed organizations. The focus is on technologies that help develop and improve society, in particular on issues such as the betterment of differently abled people, environment impact, livelihood, rural employment, agriculture, healthcare, energy, transport, sanitation, water, education. This conference aims to help innovators to share their best practices or products developed to solve specific local problems which in turn may help the other researchers to take inspiration to solve problems in their region. On the other hand, technologies proposed by expert researchers may find applications in different regions. This offers a multidisciplinary platform for researchers from a broad range of disciplines of Science, Engineering and Technology for reporting innovations at different levels.
Book Synopsis Annual IEEE Semiconductor Thermal Measurement and Management Symposium by :
Download or read book Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by . This book was released on 1994 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Recent Advances in Thermofluids and Manufacturing Engineering by : Shripad Revankar
Download or read book Recent Advances in Thermofluids and Manufacturing Engineering written by Shripad Revankar and published by Springer Nature. This book was released on 2022-09-30 with total page 561 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the select proceedings of the International Conference on Thermofluids and Manufacturing Science (ICTMS 2022). Some of the topics covered include Heat transfer, fluid dynamics, multiphase flow, flow diagnostics using artificial neural network, aerodynamics, high-speed flows, sustainable energy technology, propulsion and emissions, Eco-friendly manufacturing, Coating Techniques and Supply chain management etc. Given the scope, the book will be highly useful for researchers and professionals interested in mechanical, production or aerospace engineering
Book Synopsis The International Journal of Microcircuits and Electronic Packaging by :
Download or read book The International Journal of Microcircuits and Electronic Packaging written by and published by . This book was released on 2001 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Applied Mechanics Reviews written by and published by . This book was released on 1988 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Thermal Performance of Nanofluids in Miniature Heat Sinks with Conduits by : S. Harikrishnan
Download or read book Thermal Performance of Nanofluids in Miniature Heat Sinks with Conduits written by S. Harikrishnan and published by Springer Nature. This book was released on 2022-01-04 with total page 105 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive book focuses on the basic physical features and purpose of nanofluids and miniature heat sinks. The contents demonstrate the design modification, fabrication, experimental investigation, and various applications of miniature heat sinks. The book provides context for thermal performance of miniature heat sinks as well as summaries of experimental results correlations that reflect the current technical innovations are included. This book is a useful reference for both academia and industry alike.
Book Synopsis Heat and Mass Transfer Data Book by : KOTHANDARAMAN
Download or read book Heat and Mass Transfer Data Book written by KOTHANDARAMAN and published by John Wiley & Sons. This book was released on 1977-01-01 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Optimum Cooling of Data Centers by : Jun Dai
Download or read book Optimum Cooling of Data Centers written by Jun Dai and published by Springer Science & Business Media. This book was released on 2013-11-20 with total page 196 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the use of free air cooling to improve the efficiency of, and cooling of, equipment for use in telecom infrastructures. Discussed at length is the cooling of communication installation rooms such as data centers or base stations, and this is intended as a valuable tool for the people designing and manufacturing key parts of communication networks. This book provides an introduction to current cooling methods used for energy reduction, and also compares present cooling methods in use in the field. The qualification methods and standard reliability assessments are reviewed, and their inability to assess the risks of free air cooling is discussed. The method of identifying the risks associated with free air cooling on equipment performance and reliability is introduced. A novel method of assessment for free air cooling is also proposed that utilizes prognostics and health management (PHM). This book also: Describes how the implementation of free air cooling can save energy for cooling within the telecommunications infrastructure. Analyzes the potential risks and failures of mechanisms possible in the implementation of free air cooling, which benefits manufacturers and equipment designers. Presents prognostics-based assessments to identify and mitigate the risks of telecommunications equipment under free air cooling conditions, which can provide the early warning of equipment failures at operation stage without disturbing the data centers' service. Optimum Cooling for Data Centers is an ideal book for researchers and engineers interested in designing and manufacturing equipment for use in telecom infrastructures.
Download or read book Journal of Heat Transfer written by and published by . This book was released on 2008 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Theoretical, Computational, and Experimental Solutions to Thermo-Fluid Systems by : Muthukumar Palanisamy
Download or read book Theoretical, Computational, and Experimental Solutions to Thermo-Fluid Systems written by Muthukumar Palanisamy and published by Springer Nature. This book was released on 2021-03-09 with total page 505 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents select proceedings of the International Conference on Innovations in Thermo-Fluid Engineering and Sciences (ICITFES 2020). It covers topics in theoretical and experimental fluid dynamics, numerical methods in heat transfer and fluid mechanics, different modes of heat transfer, multiphase flow, fluid machinery, fluid power, refrigeration and air conditioning, and cryogenics. The book will be helpful to the researchers, scientists, and professionals working in the field of fluid mechanics and machinery, and thermal engineering.
Book Synopsis Thermal Computations for Electronics by : Gordon N. Ellison
Download or read book Thermal Computations for Electronics written by Gordon N. Ellison and published by CRC Press. This book was released on 2020-05-13 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first edition of Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling was based on the author's lecture notes that he developed over the course of nearly 40 years of thermal design and analysis activity, the last 15 years of which included teaching a university course at the senior undergraduate and graduate levels. The subject material was developed from publications of respected researchers and includes topics and methods original to this author. Numerous students have contributed to both the first and second editions, the latter corrected, sections rewritten (e.g., radiation spatial effects, Green's function properties for thermal spreading, 1-D FEA theory and application), and some new material added. The flavor and organization of the first edition have been retained, whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer. The first 20% of the book is devoted to the prediction of airflow and well-mixed air temperatures in systems, circuit board channels, and heat sinks, followed by convective (PCB-mounted components included), radiative, and conductive heat transfer and the resultant temperatures in electronic equipment. Detailed application examples illustrate a variety of problems. Downloads (from the CRC website) include: MathcadTM text examples, exercise solutions (adopting professors only) plus PDF lecture aids (professors only), and a tutorial (Chapter 14) using free FEA software to solve a thermal spreading problem. This book is a valuable professional resource for self-study and is ideal for use in a course on electronics cooling. It is well-suited for a first course in heat transfer where applications are as important as theory.
