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Author :
Publisher :
ISBN 13 :
Total Pages : 17 pages
Book Rating : 4.:/5 (951 download)
Download or read book Reliability Analysis of a Pin-in-Hole Solder Joint by Computational Modeling written by and published by . This book was released on 2015 with total page 17 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 13 pages
Book Rating : 4.:/5 (951 download)
Download or read book Reliability Analysis of Pin-in-Hole Solder Joints by Computational Modeling written by and published by . This book was released on 2015 with total page 13 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Mohd N. Tamin
Publisher : Springer Science & Business
ISBN 13 : 3319000926
Total Pages : 179 pages
Book Rating : 4.3/5 (19 download)
Download or read book Solder Joint Reliability Assessment written by Mohd N. Tamin and published by Springer Science & Business. This book was released on 2014-04-26 with total page 179 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.
Author : Darrel R. Frear
Publisher : Springer Science & Business Media
ISBN 13 : 9780442015053
Total Pages : 434 pages
Book Rating : 4.0/5 (15 download)
Download or read book Mechanics of Solder Alloy Interconnects written by Darrel R. Frear and published by Springer Science & Business Media. This book was released on 1994-01-31 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
Author : Andrew E. Perkins
Publisher : Springer Science & Business Media
ISBN 13 : 0387793941
Total Pages : 202 pages
Book Rating : 4.3/5 (877 download)
Download or read book Solder Joint Reliability Prediction for Multiple Environments written by Andrew E. Perkins and published by Springer Science & Business Media. This book was released on 2008-12-16 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
Author : American Society of Mechanical Engineers. Winter Annual Meeting
Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.:/5 (139 download)
Download or read book Solder Joint Reliability written by American Society of Mechanical Engineers. Winter Annual Meeting and published by . This book was released on 1989 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: An extensive finite element modeling and experimental testing program has been carried out to determine the most optimum design parameters for solder joints in surface mount applications. Although the analysis and testing (power cycling and thermal cycling) has been carried out for a variety of package styles, particular attention will be paid to the result for leadless ceramic chip carriers. This package is particularly useful in certain high performance military and commercial applications. Analysis and experimentation indicate that increased fatigue life under power cycling can be attained by fabricating solder joints with large fillets and low standoff heights. The large fillet geometry significantly reduces harmful stress concentrations while increasing the net cross-sectional area within the joint. Both factors tend to improve the fracture toughness of the joint. The temperature and frequency dependencies of solder joint fatigue life under power cycling testing is discussed. The observed frequency dependence can be minimized by eliminating harmful tensile strain components thus reducing harmful stress relaxation and tensile induced oxygen embrittlement of grain boundaries. Temperature cycling studies indicate joints with slightly higher standoffs and low fillet angles are more resistant to cyclic fatigue than pillar type joints which tend to focus shear strains at the interfaces. Solder joints can be tapered to improve overall reliability but, in most cases, tapering will provide only a small increase in fracture toughness of the joint through the elimination of stress concentrations. Additional fatigue life increases can be obtained only through an enlargement of the joint cross-sectional area. Aspects of the above results will be presented in detail along with design guidelines for creating high reliability solder joints for various application scenarios.
Author : John H. Lau
Publisher : Springer Science & Business Media
ISBN 13 : 1461539102
Total Pages : 649 pages
Book Rating : 4.4/5 (615 download)
Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Author :
Publisher : ASM International
ISBN 13 : 9780871702852
Total Pages : 1234 pages
Book Rating : 4.7/5 (28 download)
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author :
Publisher :
ISBN 13 :
Total Pages : 336 pages
Book Rating : 4.:/5 (318 download)
Download or read book Computer Modeling in Engineering & Sciences written by and published by . This book was released on 2009 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 :
Total Pages : 312 pages
Book Rating : 4.0/5 ( download)
Download or read book ASME Technical Papers written by and published by . This book was released on 1999 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 :
Total Pages : 456 pages
Book Rating : 4.3/5 (97 download)
Download or read book Computers in Engineering 1989: Computers in education, thermo-fluids-energy education, finite elements, applied computer methods in mechanics, numerical modeling, computational fluid dynamics, combustion and heat transfer, simulation of energy system and process control written by and published by . This book was released on 1989 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 :
Total Pages : 594 pages
Book Rating : 4.3/5 (91 download)
Download or read book Paper written by and published by . This book was released on 1999 with total page 594 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 :
Total Pages : 1158 pages
Book Rating : 4.:/5 (31 download)
Download or read book Proceedings written by and published by . This book was released on 1994 with total page 1158 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 :
Total Pages : 400 pages
Book Rating : 4.3/5 (243 download)
Download or read book Applied mechanics reviews written by and published by . This book was released on 1948 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 :
Total Pages : 2240 pages
Book Rating : 4.3/5 (243 download)
Download or read book Electrical & Electronics Abstracts written by and published by . This book was released on 1997 with total page 2240 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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ISBN 13 :
Total Pages : 268 pages
Book Rating : 4.:/5 (318 download)
Download or read book 40th Electronic Components & Technology Conference written by and published by . This book was released on 1990 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Ray Prasad
Publisher : Springer Science & Business Media
ISBN 13 : 1461540844
Total Pages : 791 pages
Book Rating : 4.4/5 (615 download)
Download or read book Surface Mount Technology written by Ray Prasad and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 791 pages. Available in PDF, EPUB and Kindle. Book excerpt: A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.
