Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

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Publisher : Springer Science & Business Media
ISBN 13 : 0387958681
Total Pages : 545 pages
Book Rating : 4.3/5 (879 download)

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Book Synopsis Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications by : Yosi Shacham-Diamand

Download or read book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

Proceedings of the IEEE International Interconnect Technology Conference

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Author :
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 : 9781424401031
Total Pages : 232 pages
Book Rating : 4.4/5 (1 download)

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Book Synopsis Proceedings of the IEEE International Interconnect Technology Conference by :

Download or read book Proceedings of the IEEE International Interconnect Technology Conference written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2006-01-01 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Proceedings of the IEEE 2003 International Interconnect Technology Conference : Hyatt Regency Hotel, Burlingame, CA, June 2-4, 2003

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Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (112 download)

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Book Synopsis Proceedings of the IEEE 2003 International Interconnect Technology Conference : Hyatt Regency Hotel, Burlingame, CA, June 2-4, 2003 by : IEEE International Interconnect Technology Conference

Download or read book Proceedings of the IEEE 2003 International Interconnect Technology Conference : Hyatt Regency Hotel, Burlingame, CA, June 2-4, 2003 written by IEEE International Interconnect Technology Conference and published by . This book was released on 2003 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Advanced Interconnects for ULSI Technology

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Publisher : John Wiley & Sons
ISBN 13 : 0470662549
Total Pages : 616 pages
Book Rating : 4.4/5 (76 download)

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Book Synopsis Advanced Interconnects for ULSI Technology by : Mikhail Baklanov

Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-04-02 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Interlayer Dielectrics for Semiconductor Technologies

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Publisher : Elsevier
ISBN 13 : 9780080521954
Total Pages : 464 pages
Book Rating : 4.5/5 (219 download)

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Book Synopsis Interlayer Dielectrics for Semiconductor Technologies by : Shyam P Muraka

Download or read book Interlayer Dielectrics for Semiconductor Technologies written by Shyam P Muraka and published by Elsevier. This book was released on 2003-10-13 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor technologies are moving at such a fast pace that new materials are needed in all types of application. Manipulating the materials and their properties at atomic dimensions has become a must. This book presents the case of interlayer dielectrics materials whilst considering these challenges. Interlayer Dielectrics for Semiconductor Technologies cover the science, properties and applications of dielectrics, their preparation, patterning, reliability and characterisation, followed by the discussion of different materials including those with high dielctric constants and those useful for waveguide applications in optical communications on the chip and the package. * Brings together for the FIRST time the science and technology of interlayer deilectrics materials, in one volume * written by renowned experts in the field * Provides an up-to-date starting point in this young research field.

On-Chip Power Delivery and Management

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Publisher : Springer
ISBN 13 : 3319293958
Total Pages : 742 pages
Book Rating : 4.3/5 (192 download)

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Book Synopsis On-Chip Power Delivery and Management by : Inna P. Vaisband

Download or read book On-Chip Power Delivery and Management written by Inna P. Vaisband and published by Springer. This book was released on 2016-04-26 with total page 742 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.

Power Distribution Networks with On-Chip Decoupling Capacitors

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Publisher : Springer Science & Business Media
ISBN 13 : 0387716017
Total Pages : 532 pages
Book Rating : 4.3/5 (877 download)

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Book Synopsis Power Distribution Networks with On-Chip Decoupling Capacitors by : Mikhail Popovich

Download or read book Power Distribution Networks with On-Chip Decoupling Capacitors written by Mikhail Popovich and published by Springer Science & Business Media. This book was released on 2007-10-08 with total page 532 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides insight into the behavior and design of power distribution systems for high speed, high complexity integrated circuits. Also presented are criteria for estimating minimum required on-chip decoupling capacitance. Techniques and algorithms for computer-aided design of on-chip power distribution networks are also described; however, the emphasis is on developing circuit intuition and understanding the principles that govern the design and operation of power distribution systems.

EDA for IC Implementation, Circuit Design, and Process Technology

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Author :
Publisher : CRC Press
ISBN 13 : 1351837583
Total Pages : 762 pages
Book Rating : 4.3/5 (518 download)

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Book Synopsis EDA for IC Implementation, Circuit Design, and Process Technology by : Luciano Lavagno

Download or read book EDA for IC Implementation, Circuit Design, and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2018-10-03 with total page 762 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.

Power Distribution Networks in High Speed Integrated Circuits

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Publisher : Springer Science & Business Media
ISBN 13 : 146150399X
Total Pages : 287 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Power Distribution Networks in High Speed Integrated Circuits by : Andrey Mezhiba

Download or read book Power Distribution Networks in High Speed Integrated Circuits written by Andrey Mezhiba and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 287 pages. Available in PDF, EPUB and Kindle. Book excerpt: Distributing power in high speed, high complexity integrated circuits has become a challenging task as power levels exceeding tens of watts have become commonplace while the power supply is plunging toward one volt. This book is dedicated to this important subject. The primary purpose of this monograph is to provide insight and intuition into the behavior and design of power distribution systems for high speed, high complexity integrated circuits.

Electromigration in Metals

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Publisher : Cambridge University Press
ISBN 13 : 1107032385
Total Pages : 433 pages
Book Rating : 4.1/5 (7 download)

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Book Synopsis Electromigration in Metals by : Paul S. Ho

Download or read book Electromigration in Metals written by Paul S. Ho and published by Cambridge University Press. This book was released on 2022-05-12 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.

Proceedings of the IEEE ... International Interconnect Technology Conferece

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Publisher :
ISBN 13 :
Total Pages : 288 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Proceedings of the IEEE ... International Interconnect Technology Conferece by :

Download or read book Proceedings of the IEEE ... International Interconnect Technology Conferece written by and published by . This book was released on 2004 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Circuits at the Nanoscale

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Publisher : CRC Press
ISBN 13 : 1420070630
Total Pages : 602 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Circuits at the Nanoscale by : Krzysztof Iniewski

Download or read book Circuits at the Nanoscale written by Krzysztof Iniewski and published by CRC Press. This book was released on 2018-10-08 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt: Circuits for Emerging Technologies Beyond CMOS New exciting opportunities are abounding in the field of body area networks, wireless communications, data networking, and optical imaging. In response to these developments, top-notch international experts in industry and academia present Circuits at the Nanoscale: Communications, Imaging, and Sensing. This volume, unique in both its scope and its focus, addresses the state-of-the-art in integrated circuit design in the context of emerging systems. A must for anyone serious about circuit design for future technologies, this book discusses emerging materials that can take system performance beyond standard CMOS. These include Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP). Three-dimensional CMOS integration and co-integration with Microelectromechanical (MEMS) technology and radiation sensors are described as well. Topics in the book are divided into comprehensive sections on emerging design techniques, mixed-signal CMOS circuits, circuits for communications, and circuits for imaging and sensing. Dr. Krzysztof Iniewski is a director at CMOS Emerging Technologies, Inc., a consulting company in Vancouver, British Columbia. His current research interests are in VLSI ciruits for medical applications. He has published over 100 research papers in international journals and conferences, and he holds 18 international patents granted in the United States, Canada, France, Germany, and Japan. In this volume, he has assembled the contributions of over 60 world-reknown experts who are at the top of their field in the world of circuit design, advancing the bank of knowledge for all who work in this exciting and burgeoning area.

Design Rules in a Semiconductor Foundry

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Publisher : CRC Press
ISBN 13 : 1000631354
Total Pages : 831 pages
Book Rating : 4.0/5 (6 download)

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Book Synopsis Design Rules in a Semiconductor Foundry by : Eitan N. Shauly

Download or read book Design Rules in a Semiconductor Foundry written by Eitan N. Shauly and published by CRC Press. This book was released on 2022-11-30 with total page 831 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.

Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology

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Publisher : CRC Press
ISBN 13 : 1482254611
Total Pages : 798 pages
Book Rating : 4.4/5 (822 download)

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Book Synopsis Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology by : Luciano Lavagno

Download or read book Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2017-02-03 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.

Computational Finite Element Methods in Nanotechnology

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Publisher : CRC Press
ISBN 13 : 135183259X
Total Pages : 647 pages
Book Rating : 4.3/5 (518 download)

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Book Synopsis Computational Finite Element Methods in Nanotechnology by : Sarhan M. Musa

Download or read book Computational Finite Element Methods in Nanotechnology written by Sarhan M. Musa and published by CRC Press. This book was released on 2017-12-19 with total page 647 pages. Available in PDF, EPUB and Kindle. Book excerpt: Computational Finite Element Methods in Nanotechnology demonstrates the capabilities of finite element methods in nanotechnology for a range of fields. Bringing together contributions from researchers around the world, it covers key concepts as well as cutting-edge research and applications to inspire new developments and future interdisciplinary research. In particular, it emphasizes the importance of finite element methods (FEMs) for computational tools in the development of efficient nanoscale systems. The book explores a variety of topics, including: A novel FE-based thermo-electrical-mechanical-coupled model to study mechanical stress, temperature, and electric fields in nano- and microelectronics The integration of distributed element, lumped element, and system-level methods for the design, modeling, and simulation of nano- and micro-electromechanical systems (N/MEMS) Challenges in the simulation of nanorobotic systems and macro-dimensions The simulation of structures and processes such as dislocations, growth of epitaxial films, and precipitation Modeling of self-positioning nanostructures, nanocomposites, and carbon nanotubes and their composites Progress in using FEM to analyze the electric field formed in needleless electrospinning How molecular dynamic (MD) simulations can be integrated into the FEM Applications of finite element analysis in nanomaterials and systems used in medicine, dentistry, biotechnology, and other areas The book includes numerous examples and case studies, as well as recent applications of microscale and nanoscale modeling systems with FEMs using COMSOL Multiphysics® and MATLAB®. A one-stop reference for professionals, researchers, and students, this is also an accessible introduction to computational FEMs in nanotechnology for those new to the field.

Design of 3D Integrated Circuits and Systems

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Publisher : CRC Press
ISBN 13 : 1351831593
Total Pages : 328 pages
Book Rating : 4.3/5 (518 download)

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Book Synopsis Design of 3D Integrated Circuits and Systems by : Rohit Sharma

Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics

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Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566773799
Total Pages : 364 pages
Book Rating : 4.7/5 (737 download)

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Book Synopsis Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics by :

Download or read book Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics written by and published by The Electrochemical Society. This book was released on 2003 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt: