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Power Distribution Networks In High Speed Integrated Circuits
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Book Synopsis Power Distribution Networks in High Speed Integrated Circuits by : Andrey Mezhiba
Download or read book Power Distribution Networks in High Speed Integrated Circuits written by Andrey Mezhiba and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 287 pages. Available in PDF, EPUB and Kindle. Book excerpt: Distributing power in high speed, high complexity integrated circuits has become a challenging task as power levels exceeding tens of watts have become commonplace while the power supply is plunging toward one volt. This book is dedicated to this important subject. The primary purpose of this monograph is to provide insight and intuition into the behavior and design of power distribution systems for high speed, high complexity integrated circuits.
Book Synopsis Power Distribution Networks in High Speed Integrated Circuits by : Andrey Mezhiba
Download or read book Power Distribution Networks in High Speed Integrated Circuits written by Andrey Mezhiba and published by . This book was released on 2003-11-30 with total page 308 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Power Distribution Networks with On-Chip Decoupling Capacitors by : Mikhail Popovich
Download or read book Power Distribution Networks with On-Chip Decoupling Capacitors written by Mikhail Popovich and published by Springer Science & Business Media. This book was released on 2007-10-08 with total page 516 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides insight into the behavior and design of power distribution systems for high speed, high complexity integrated circuits. Also presented are criteria for estimating minimum required on-chip decoupling capacitance. Techniques and algorithms for computer-aided design of on-chip power distribution networks are also described; however, the emphasis is on developing circuit intuition and understanding the principles that govern the design and operation of power distribution systems.
Book Synopsis On-Chip Power Delivery and Management by : Inna P. Vaisband
Download or read book On-Chip Power Delivery and Management written by Inna P. Vaisband and published by Springer. This book was released on 2016-04-26 with total page 742 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
Book Synopsis Power Distribution Networks with On-Chip Decoupling Capacitors by : Renatas Jakushokas
Download or read book Power Distribution Networks with On-Chip Decoupling Capacitors written by Renatas Jakushokas and published by Springer Science & Business Media. This book was released on 2010-11-23 with total page 644 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power distribution systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this second edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
Book Synopsis On-Chip Inductance in High Speed Integrated Circuits by : Yehea I. Ismail
Download or read book On-Chip Inductance in High Speed Integrated Circuits written by Yehea I. Ismail and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: The appropriate interconnect model has changed several times over the past two decades due to the application of aggressive technology scaling. New, more accurate interconnect models are required to manage the changing physical characteristics of integrated circuits. Currently, RC models are used to analyze high resistance nets while capacitive models are used for less resistive interconnect. However, on-chip inductance is becoming more important with integrated circuits operating at higher frequencies, since the inductive impedance is proportional to the frequency. The operating frequencies of integrated circuits have increased dramatically over the past decade and are expected to maintain the same rate of increase over the next decade, approaching 10 GHz by the year 2012. Also, wide wires are frequently encountered in important global nets, such as clock distribution networks and in upper metal layers, and performance requirements are pushing the introduction of new materials for low resistance interconnect, such as copper interconnect already used in many commercial CMOS technologies. On-Chip Inductance in High Speed Integrated Circuits deals with the design and analysis of integrated circuits with a specific focus on on-chip inductance effects. It has been described throughout this book that inductance can have a tangible effect on current high speed integrated circuits. For example, neglecting inductance and using an RC interconnect model in a production 0.25 mum CMOS technology can cause large errors (over 35%) in estimates of the propagation delay of on-chip interconnect. It has also been shown that including inductance in the repeater insertion design process as compared to using an RC model improves the overall repeater solution in terms of area, power, and delay with average savings of 40.8%, 15.6%, and 6.7%, respectively. On-Chip Inductance in High Speed Integrated Circuits is full of design and analysis techniques for RLC interconnect. These techniques are compared to techniques traditionally used for RC interconnect design to emphasize the effect of inductance. emOn-Chip Inductance in High Speed Integrated Circuits will be of interest to researchers in the area of high frequency interconnect, noise, and high performance integrated circuit design.
Book Synopsis Power Distribution Network Design for VLSI by : Qing K. Zhu
Download or read book Power Distribution Network Design for VLSI written by Qing K. Zhu and published by John Wiley & Sons. This book was released on 2004-02-19 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: A hands-on troubleshooting guide for VLSI network designers The primary goal in VLSI (very large scale integration) power network design is to provide enough power lines across a chip to reduce voltage drops from the power pads to the center of the chip. Voltage drops caused by the power network's metal lines coupled with transistor switching currents on the chip cause power supply noises that can affect circuit timing and performance, thus providing a constant challenge for designers of high-performance chips. Power Distribution Network Design for VLSI provides detailed information on this critical component of circuit design and physical integration for high-speed chips. A vital tool for professional engineers (especially those involved in the use of commercial tools), as well as graduate students of engineering, the text explains the design issues, guidelines, and CAD tools for the power distribution of the VLSI chip and package, and provides numerous examples for its effective application. Features of the text include: * An introduction to power distribution network design * Design perspectives, such as power network planning, layout specifications, decoupling capacitance insertion, modeling, and analysis * Electromigration phenomena * IR drop analysis methodology * Commands and user interfaces of the VoltageStorm(TM) CAD tool * Microprocessor design examples using on-chip power distribution * Flip-chip and package design issues * Power network measurement techniques from real silicon The author includes several case studies and a glossary of key words and basic terms to help readers understand and integrate basic concepts in VLSI design and power distribution.
Book Synopsis Power Distribution Network Design Methodologies by : Istvan Novak
Download or read book Power Distribution Network Design Methodologies written by Istvan Novak and published by Intl. Engineering Consortiu. This book was released on 2008 with total page 578 pages. Available in PDF, EPUB and Kindle. Book excerpt: A series of cogently written articles by 49 industry experts, this collection fills the void on Power Distribution Network (PDN) design procedures, and addresses such related topics as DC–DC converters, selection of bypass capacitors, DDR2 memory systems, powering of FPGAs, and synthesis of impedance profiles. Through these contributions from such leading companies as Sun Microsystems, Sanyo, IBM, Hewlett-Packard, Intel, and Rambus, readers will come to understand why books on power integrity are only now becoming available to the public and can relate these topics to current industry trends.
Book Synopsis Three-dimensional Integrated Circuit Design by : Vasilis F. Pavlidis
Download or read book Three-dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Morgan Kaufmann. This book was released on 2010-07-28 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits. Demonstrates how to overcome "interconnect bottleneck" with 3-D integrated circuit design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers The FIRST book on 3-D integrated circuit design...provides up-to-date information that is otherwise difficult to find Focuses on design issues key to the product development cycle...good design plays a major role in exploiting the implementation flexibilities offered in the 3-D Provides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization...offers practical view of designing 3-D circuits
Book Synopsis High Performance Integrated Circuit Design by : Emre Salman
Download or read book High Performance Integrated Circuit Design written by Emre Salman and published by McGraw Hill Professional. This book was released on 2012-08-21 with total page 738 pages. Available in PDF, EPUB and Kindle. Book excerpt: The latest techniques for designing robust, high performance integrated circuits in nanoscale technologies Focusing on a new technological paradigm, this practical guide describes the interconnect-centric design methodologies that are now the major focus of nanoscale integrated circuits (ICs). High Performance Integrated Circuit Design begins by discussing the dominant role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management, synchronization, and substrate-aware design. Specific design constraints and methodologies unique to each type of interconnect are addressed. This comprehensive volume also explains the design of specialized circuits such as tapered buffers and repeaters for data signaling, voltage regulators for power management, and phase-locked loops for synchronization. This is an invaluable resource for students, researchers, and engineers working in the area of high performance ICs. Coverage includes: Technology scaling Interconnect modeling and extraction Signal propagation and delay analysis Interconnect coupling noise Global signaling Power generation Power distribution networks CAD of power networks Techniques to reduce power supply noise Power dissipation Synchronization theory and tradeoffs Synchronous system characteristics On-chip clock generation and distribution Substrate noise in mixed-signal ICs Techniques to reduce substrate noise
Book Synopsis Three-Dimensional Integrated Circuit Design by : Vasilis F. Pavlidis
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Book Synopsis Electrical Design of Through Silicon Via by : Manho Lee
Download or read book Electrical Design of Through Silicon Via written by Manho Lee and published by Springer. This book was released on 2014-05-11 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
Book Synopsis Power Distribution Network Design for VLSI. by : Qing Zhu
Download or read book Power Distribution Network Design for VLSI. written by Qing Zhu and published by . This book was released on 2004 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :IEEE Circuits and Systems Society Publisher :Institute of Electrical & Electronics Engineers(IEEE) ISBN 13 : Total Pages :974 pages Book Rating :4.3/5 (91 download)
Book Synopsis IEEE International Symposium on Circuits and Systems by : IEEE Circuits and Systems Society
Download or read book IEEE International Symposium on Circuits and Systems written by IEEE Circuits and Systems Society and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2003 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: These volumes relate to matters discussed during the 2003 IEEE International Symposium on Circuits and Systems, such as: analogue circuits and signal processing; communications; multimedia systems and applications; general and nonlinear circuits and systems; and neural networks and systems.
Book Synopsis Designing Power Distribution Systems for Electronic Circuits by : K. Barry A. Williams
Download or read book Designing Power Distribution Systems for Electronic Circuits written by K. Barry A. Williams and published by . This book was released on 2004-12-01 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: A guide to the design of power distribution systems for high speed logic systems who must deal with the ever-increasing speeds of microporcessors, memory, I/O, and other interface logic systems. This book covers the much needed practical application of designing power distribution systems using easily accessable explainations of each part of the system. "Designing Power Distribution Systems for Electronic Circuits" covers many neglected topics and their problems and provides many solutions with extensive use of tables, modeling, and formulas.
Book Synopsis Power Management Integrated Circuits by : Mona M. Hella
Download or read book Power Management Integrated Circuits written by Mona M. Hella and published by CRC Press. This book was released on 2017-12-19 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Management Integrated Circuits and Technologies delivers a modern treatise on mixed-signal integrated circuit design for power management. Comprised of chapters authored by leading researchers from industry and academia, this definitive text: Describes circuit- and architectural-level innovations that meet advanced power and speed capabilities Explores hybrid inductive-capacitive converters for wide-range dynamic voltage scaling Presents innovative control techniques for single inductor dual output (SIDO) and single inductor multiple output (SIMO) converters Discusses cutting-edge design techniques including switching converters for analog/RF loads Compares the use of GaAs pHEMTs to CMOS devices for efficient high-frequency switching converters Thus, Power Management Integrated Circuits and Technologies provides comprehensive, state-of-the-art coverage of this exciting and emerging field of engineering.
Book Synopsis Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal ICs by : Balsha R. Stanisic
Download or read book Synthesis of Power Distribution to Manage Signal Integrity in Mixed-Signal ICs written by Balsha R. Stanisic and published by Springer. This book was released on 2011-09-27 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the early days of VLSI, the design of the power distribution for an integrated cir cuit was rather simple. Power distribution --the design of the geometric topology for the network of wires that connect the various power supplies, the widths of the indi vidual segments for each of these wires, the number and location of the power I/O pins around the periphery of the chip --was simple because the chips were simpler. Few available wiring layers forced floorplans that allowed simple, planar (non-over lapping) power networks. Lower speeds and circuit density made the choice of the wire widths easier: we made them just fat enough to avoid resistive voltage drops due to switching currents in the supply network. And we just didn't need enormous num bers of power and ground pins on the package for the chips to work. It's not so simple any more. Increased integration has forced us to focus on reliability concerns such as metal elec tromigration, which affects wire sizing decisions in the power network. Extra metal layers have allowed more flexibility in the topological layout of the power networks.
