3D Integration in VLSI Circuits

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Publisher : CRC Press
ISBN 13 : 1351779826
Total Pages : 211 pages
Book Rating : 4.3/5 (517 download)

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Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma

Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018-04-17 with total page 211 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

3D Integration in VLSI Circuits

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Author :
Publisher : CRC Press
ISBN 13 : 9781315200699
Total Pages : 217 pages
Book Rating : 4.2/5 (6 download)

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Book Synopsis 3D Integration in VLSI Circuits by : Katsuyuki Sakuma

Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018 with total page 217 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

3D Integration for VLSI Systems

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Publisher : CRC Press
ISBN 13 : 9814303828
Total Pages : 376 pages
Book Rating : 4.8/5 (143 download)

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Book Synopsis 3D Integration for VLSI Systems by : Chuan Seng Tan

Download or read book 3D Integration for VLSI Systems written by Chuan Seng Tan and published by CRC Press. This book was released on 2016-04-19 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

Handbook of 3D Integration, Volume 1

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Author :
Publisher : John Wiley & Sons
ISBN 13 : 352762306X
Total Pages : 798 pages
Book Rating : 4.5/5 (276 download)

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Book Synopsis Handbook of 3D Integration, Volume 1 by : Philip Garrou

Download or read book Handbook of 3D Integration, Volume 1 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2011-09-22 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.

More-than-Moore Devices and Integration for Semiconductors

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Author :
Publisher :
ISBN 13 : 9783031216114
Total Pages : 0 pages
Book Rating : 4.2/5 (161 download)

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Book Synopsis More-than-Moore Devices and Integration for Semiconductors by : Francesca Iacopi

Download or read book More-than-Moore Devices and Integration for Semiconductors written by Francesca Iacopi and published by . This book was released on 2023 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.

Cyberpragmatics

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Publisher : John Benjamins Publishing
ISBN 13 : 9027284660
Total Pages : 370 pages
Book Rating : 4.0/5 (272 download)

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Book Synopsis Cyberpragmatics by : Francisco Yus

Download or read book Cyberpragmatics written by Francisco Yus and published by John Benjamins Publishing. This book was released on 2011-08-22 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: Cyberpragmatics is an analysis of Internet-mediated communication from the perspective of cognitive pragmatics. It addresses a whole range of interactions that can be found on the Net: the web page, chat rooms, instant messaging, social networking sites, 3D virtual worlds, blogs, videoconference, e-mail, Twitter, etc. Of special interest is the role of intentions and the quality of interpretations when these Internet-mediated interactions take place, which is often affected by the textual properties of the medium. The book also analyses the pragmatic implications of transferring offline discourses (e.g. printed paper, advertisements) to the screen-framed space of the Net. And although the main framework is cognitive pragmatics, the book also draws from other theories and models in order to build up a better picture of what really happens when people communicate on the Net. This book will interest analysts doing research on computer-mediated communication, university students and researchers undergoing post-graduate courses or writing a PhD thesis. Now Open Access as part of the Knowledge Unlatched 2017 Backlist Collection.

Chemical-Mechanical Planarization of Semiconductor Materials

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 9783540431817
Total Pages : 444 pages
Book Rating : 4.4/5 (318 download)

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Book Synopsis Chemical-Mechanical Planarization of Semiconductor Materials by : M.R. Oliver

Download or read book Chemical-Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer Science & Business Media. This book was released on 2004-01-26 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Air Pollution Modeling

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 147574465X
Total Pages : 448 pages
Book Rating : 4.4/5 (757 download)

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Book Synopsis Air Pollution Modeling by : P. Zannetti

Download or read book Air Pollution Modeling written by P. Zannetti and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 448 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finishing this book is giving me a mixture of relief, satisfaction and frus tration. Relief, for the completion of a project that has taken too many of my evenings and weekends and that, in the last several months, has become almost an obsession. Satisfaction, for the optimistic feeling that this book, in spite of its many shortcomings and imbalances, will be of some help to the air pollution scientific community. Frustration, for the impossibility of incorporating newly available material that would require another major review of several key chap ters - an effort that is currently beyond my energies but not beyond my desires. The first canovaccio of this book came out in 1980 when I was invited by Computational Mechanics in the United Kingdom to give my first Air Pollution Modeling course. The course material, in the form of transparencies, expanded, year after year, thus providing a growing working basis. In 1985, the ECC Joint Research Center in Ispra, Italy, asked me to prepare a critical survey of mathe matical models of atmospheric pollution, transport and deposition. This support gave me the opportunity to prepare a sort of "first draft" of the book, which I expanded in the following years.

Measurement, Instrumentation, and Sensors Handbook, Second Edition

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Publisher : CRC Press
ISBN 13 : 1439848882
Total Pages : 1641 pages
Book Rating : 4.4/5 (398 download)

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Book Synopsis Measurement, Instrumentation, and Sensors Handbook, Second Edition by : John G. Webster

Download or read book Measurement, Instrumentation, and Sensors Handbook, Second Edition written by John G. Webster and published by CRC Press. This book was released on 2014-01-29 with total page 1641 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Second Edition of the bestselling Measurement, Instrumentation, and Sensors Handbook brings together all aspects of the design and implementation of measurement, instrumentation, and sensors. Reflecting the current state of the art, it describes the use of instruments and techniques for performing practical measurements in engineering, physics, chemistry, and the life sciences and discusses processing systems, automatic data acquisition, reduction and analysis, operation characteristics, accuracy, errors, calibrations, and the incorporation of standards for control purposes. Organized according to measurement problem, the Spatial, Mechanical, Thermal, and Radiation Measurement volume of the Second Edition: Contains contributions from field experts, new chapters, and updates to all 96 existing chapters Covers instrumentation and measurement concepts, spatial and mechanical variables, displacement, acoustics, flow and spot velocity, radiation, wireless sensors and instrumentation, and control and human factors A concise and useful reference for engineers, scientists, academic faculty, students, designers, managers, and industry professionals involved in instrumentation and measurement research and development, Measurement, Instrumentation, and Sensors Handbook, Second Edition: Spatial, Mechanical, Thermal, and Radiation Measurement provides readers with a greater understanding of advanced applications.

Campus Design

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Publisher :
ISBN 13 :
Total Pages : 314 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Campus Design by : Richard P. Dober

Download or read book Campus Design written by Richard P. Dober and published by . This book was released on 1992 with total page 314 pages. Available in PDF, EPUB and Kindle. Book excerpt: Utilizing case studies which cover all types of universities and institutions of higher learning throughout the world, this planning and design study illustrates how to create a university setting which is functional, attractive and accessible

Materials for Advanced Packaging

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Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 974 pages
Book Rating : 4.3/5 (194 download)

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Book Synopsis Materials for Advanced Packaging by : Daniel Lu

Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Hispania and the Roman Mediterranean, AD 100-700

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Author :
Publisher : Bristol Classical Press
ISBN 13 :
Total Pages : 390 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Hispania and the Roman Mediterranean, AD 100-700 by : Paul Reynolds

Download or read book Hispania and the Roman Mediterranean, AD 100-700 written by Paul Reynolds and published by Bristol Classical Press. This book was released on 2010-01-28 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt: Gathers together and reviews the evidence for trends in production of table wares and amphora-borne goods across the Iberian Peninsula and Balearics from the second to the seventh century AD.

Mems Packaging

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Publisher : World Scientific
ISBN 13 : 9813229373
Total Pages : 363 pages
Book Rating : 4.8/5 (132 download)

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Book Synopsis Mems Packaging by : Yung-cheng Lee

Download or read book Mems Packaging written by Yung-cheng Lee and published by World Scientific. This book was released on 2018-01-03 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.

Bioinorganic Chemistry

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Publisher : Springer Science & Business Media
ISBN 13 : 9401102554
Total Pages : 422 pages
Book Rating : 4.4/5 (11 download)

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Book Synopsis Bioinorganic Chemistry by : D.P. Kessissoglou

Download or read book Bioinorganic Chemistry written by D.P. Kessissoglou and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 422 pages. Available in PDF, EPUB and Kindle. Book excerpt: Bioinorganic chemistry is primarily concerned with the role of metal atoms in biology and is a very active research field. However, even though such important structures of metalloenzymes are known, as the MoFeCo of nitrogenase, Cu or Mn superoxide dismutase and plastocyanin, the synthetic routes to the modelling of such centers remains a matter of acute scientific interest. Other metalloenzymes, such as the Mn center of the oxygen evolving complex of PSII, are still the focus of in-depth examination, both spectroscopic and structural. Another area of concern is the interaction between drugs and metals and metal ion antagonism. Understanding the chemistry of metal ions in biological systems will bring benefits in terms of understanding such problems as biomineralization and the production of advanced materials by micro-organisms. The 29 contributions to Bioinorganic Chemistry: An Inorganic Perspective of Life give an excellent summary of the state of the art in this field, covering areas from the NMR of paramagnetic molecules to the use of lanthanide porphyrins in artificial batteries.

Electroacoustic Devices: Microphones and Loudspeakers

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Author :
Publisher : Taylor & Francis
ISBN 13 : 113612117X
Total Pages : 330 pages
Book Rating : 4.1/5 (361 download)

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Book Synopsis Electroacoustic Devices: Microphones and Loudspeakers by : Glen Ballou

Download or read book Electroacoustic Devices: Microphones and Loudspeakers written by Glen Ballou and published by Taylor & Francis. This book was released on 2012-09-10 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the definitive reference for microphones and loudspeakers, your one-stop reference covering in great detail all you could want and need to know about electroacoustics devises (microphones and loudspeakers). Covering both the technology and the practical set up and placement this guide explores and bridges the link between experience and the technology, giving you a better understanding of the tools to use and why, leading to greatly improved results.

Digital Media Steganography

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Publisher : Academic Press
ISBN 13 : 0128194391
Total Pages : 388 pages
Book Rating : 4.1/5 (281 download)

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Book Synopsis Digital Media Steganography by : Mahmoud Hassaballah

Download or read book Digital Media Steganography written by Mahmoud Hassaballah and published by Academic Press. This book was released on 2020-06-27 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: The common use of the Internet and cloud services in transmission of large amounts of data over open networks and insecure channels, exposes that private and secret data to serious situations. Ensuring the information transmission over the Internet is safe and secure has become crucial, consequently information security has become one of the most important issues of human communities because of increased data transmission over social networks. Digital Media Steganography: Principles, Algorithms, and Advances covers fundamental theories and algorithms for practical design, while providing a comprehensive overview of the most advanced methodologies and modern techniques in the field of steganography. The topics covered present a collection of high-quality research works written in a simple manner by world-renowned leaders in the field dealing with specific research problems. It presents the state-of-the-art as well as the most recent trends in digital media steganography. - Covers fundamental theories and algorithms for practical design which form the basis of modern digital media steganography - Provides new theoretical breakthroughs and a number of modern techniques in steganography - Presents the latest advances in digital media steganography such as using deep learning and artificial neural network as well as Quantum Steganography

Polk's Crocker-Langley San Francisco City Directory

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Author :
Publisher :
ISBN 13 :
Total Pages : 2134 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Polk's Crocker-Langley San Francisco City Directory by :

Download or read book Polk's Crocker-Langley San Francisco City Directory written by and published by . This book was released on 1900 with total page 2134 pages. Available in PDF, EPUB and Kindle. Book excerpt: