Moisture Sensitivity Of Plastic Packages Of Ic Devices

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Moisture Sensitivity of Plastic Packages of IC Devices

Author : X.J. Fan
Publisher : Springer Science & Business Media
ISBN 13 : 1441957197
Total Pages : 573 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Moisture Sensitivity of Plastic Packages of IC Devices by : X.J. Fan

Download or read book Moisture Sensitivity of Plastic Packages of IC Devices written by X.J. Fan and published by Springer Science & Business Media. This book was released on 2010-07-23 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

Moisture Sensitivity of Plastic Packages of IC Devices

Author : Xuejun Fan
Publisher : Springer
ISBN 13 : 9781441957207
Total Pages : 558 pages
Book Rating : 4.9/5 (572 download)

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Book Synopsis Moisture Sensitivity of Plastic Packages of IC Devices by : Xuejun Fan

Download or read book Moisture Sensitivity of Plastic Packages of IC Devices written by Xuejun Fan and published by Springer. This book was released on 2011-11-14 with total page 558 pages. Available in PDF, EPUB and Kindle. Book excerpt: Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

3D Microelectronic Packaging

Author : Yan Li
Publisher : Springer
ISBN 13 : 3319445863
Total Pages : 463 pages
Book Rating : 4.3/5 (194 download)

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Book Synopsis 3D Microelectronic Packaging by : Yan Li

Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer. This book was released on 2017-01-20 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Microelectronics Failure Analysis

Author :
Publisher : ASM International
ISBN 13 : 0871708043
Total Pages : 813 pages
Book Rating : 4.8/5 (717 download)

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Book Synopsis Microelectronics Failure Analysis by :

Download or read book Microelectronics Failure Analysis written by and published by ASM International. This book was released on 2004-01-01 with total page 813 pages. Available in PDF, EPUB and Kindle. Book excerpt: For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron

Power Electronic Packaging

Author : Yong Liu
Publisher : Springer Science & Business Media
ISBN 13 : 1461410533
Total Pages : 606 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Power Electronic Packaging by : Yong Liu

Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Electronic Enclosures, Housings and Packages

Author : Frank Suli
Publisher : Woodhead Publishing
ISBN 13 : 008102391X
Total Pages : 490 pages
Book Rating : 4.0/5 (81 download)

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Book Synopsis Electronic Enclosures, Housings and Packages by : Frank Suli

Download or read book Electronic Enclosures, Housings and Packages written by Frank Suli and published by Woodhead Publishing. This book was released on 2018-11-15 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. Introduces the concepts of materials recycling and sustainability to electronic enclosures Provides thorough coverage of all technical aspects relating to the design and manufacturing of electronic packaging Includes practical information on environmental considerations, shielding, standardization, materials selection, and more

Case Studies in Reliability and Maintenance

Author : Wallace R. Blischke
Publisher : John Wiley & Sons
ISBN 13 : 0471458732
Total Pages : 691 pages
Book Rating : 4.4/5 (714 download)

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Book Synopsis Case Studies in Reliability and Maintenance by : Wallace R. Blischke

Download or read book Case Studies in Reliability and Maintenance written by Wallace R. Blischke and published by John Wiley & Sons. This book was released on 2003-03-27 with total page 691 pages. Available in PDF, EPUB and Kindle. Book excerpt: Introducing a groundbreaking companion book to a bestselling reliability text Reliability is one of the most important characteristics defining the quality of a product or system, both for the manufacturer and the purchaser. One achieves high reliability through careful monitoring of design, materials and other input, production, quality assurance efforts, ongoing maintenance, and a variety of related decisions and activities. All of these factors must be considered in determining the costs of production, purchase, and ownership of a product. Case Studies in Reliability and Maintenance serves as a valuable addition to the current literature on the subject of reliability by bridging the gap between theory and application. Conceived during the preparation of the editors' earlier work, Reliability: Modeling, Prediction, and Optimization (Wiley, 2000), this new volume features twenty-six actual case studies written by top experts in their fields, each illustrating exactly how reliability models are applied. A valuable companion book to Reliability: Modeling, Prediction, and Optimization, or any other textbook on the subject, the book features: * Case studies from fields such as aerospace, automotive, mining, electronics, power plants, dikes, computer software, weapons, photocopiers, industrial furnaces, granite building cladding, chemistry, and aircraft engines * A logical organization according to the life cycle of a product or system * A unified format of discussion enhanced by tools, techniques, and models for drawing one's own conclusions * Pertinent exercises for reinforcement of ideas Of equal value to both students of reliability theory as well as professionals in industry, Case Studies in Reliability and Maintenance should be required reading for anyone seeking to understand how reliability and maintenance issues can be addressed and resolved in the real world.

Humidity and Electronics

Author : Rajan Ambat
Publisher : Woodhead Publishing
ISBN 13 : 0323908543
Total Pages : 399 pages
Book Rating : 4.3/5 (239 download)

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Book Synopsis Humidity and Electronics by : Rajan Ambat

Download or read book Humidity and Electronics written by Rajan Ambat and published by Woodhead Publishing. This book was released on 2021-11-30 with total page 399 pages. Available in PDF, EPUB and Kindle. Book excerpt: Humidity and Electronics: Corrosion Reliability Issues and Preventive Measures provides comprehensive information on humidity related corrosion reliability issues surrounding electronics and how to tackle potential issues from a pro-active-design-prevention perspective. The book contains a mix of academic and industrial relevance, making it suitable for a detailed understanding on humidity issues on electronics, both for materials and corrosion experts and electronics and electrical experts. It will be useful for researchers, academics, and industrial personals involved in materials, corrosion, and electronics reliability aspects. Provides basic and applied knowledge surrounding corrosion in electronics Combines electronics/electrical and electrochemical aspects related to failure modes and mechanisms Presents knowledge on influencing factors and how they can be used as preventive measures at the material, component, device and system level

Microelectronics Failure Analysis

Author : EDFAS Desk Reference Committee
Publisher : ASM International
ISBN 13 : 1615037268
Total Pages : 673 pages
Book Rating : 4.6/5 (15 download)

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Book Synopsis Microelectronics Failure Analysis by : EDFAS Desk Reference Committee

Download or read book Microelectronics Failure Analysis written by EDFAS Desk Reference Committee and published by ASM International. This book was released on 2011 with total page 673 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes bibliographical references and index.

Micro and Nanophased Polymeric Composites

Author : Bankim Chandra Ray
Publisher : Woodhead Publishing
ISBN 13 : 012818955X
Total Pages : 252 pages
Book Rating : 4.1/5 (281 download)

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Book Synopsis Micro and Nanophased Polymeric Composites by : Bankim Chandra Ray

Download or read book Micro and Nanophased Polymeric Composites written by Bankim Chandra Ray and published by Woodhead Publishing. This book was released on 2024-06-15 with total page 252 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro and Nanophased Polymeric Composites: Durability Assessment in Engineering Applications provides a comprehensive review of in-service environmental damage and degradation studies of FRP composites in a broad range of different applications. End-users such as academic and industrial researchers and materials scientists and engineers working in the design, analysis, and manufacture of composite material systems will be able to identify the possible superior advantages and limitations of FRP composites in various applications. Particular emphasis is given on the identification of various failure micro-mechanisms leading to unprecedented failure in different harsh and hostile environments. Divided into two distinct parts, the first section focuses on fundamentals, with key chapters on the main constituents of FRP composites, mechanical properties, characterization techniques, and processing and fabrication techniques. Part two focuses on polymer composites under different in-service applications, including the marine and space environment, chemical and corrosive environments, high and low temperature environments, and other critical environments. Covers various micro-mechanisms of failure under different environmental conditions, including moisture diffusion kinetics and the effects of aging parameters on microstructures Discusses the impact of different nanoscale reinforcements on the environmental durability of conventional FRP composites Presents a comprehensive approach with widespread applications such as low earth orbit space environments and different corrosive environments

Advanced Thermal Stress Analysis of Smart Materials and Structures

Author : Zengtao Chen
Publisher : Springer Nature
ISBN 13 : 3030252019
Total Pages : 304 pages
Book Rating : 4.0/5 (32 download)

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Book Synopsis Advanced Thermal Stress Analysis of Smart Materials and Structures by : Zengtao Chen

Download or read book Advanced Thermal Stress Analysis of Smart Materials and Structures written by Zengtao Chen and published by Springer Nature. This book was released on 2019-09-03 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry. A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials.

Fibrous Polymeric Composites

Author : Bankim Chandra Ray
Publisher : CRC Press
ISBN 13 : 0429013957
Total Pages : 208 pages
Book Rating : 4.4/5 (29 download)

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Book Synopsis Fibrous Polymeric Composites by : Bankim Chandra Ray

Download or read book Fibrous Polymeric Composites written by Bankim Chandra Ray and published by CRC Press. This book was released on 2018-05-20 with total page 208 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book emphasizes the scientific origin of deformation and damage of FRP composites under various environmental effects and analyses present understanding on degradation mechanisms, role of interfaces and addition of nanofillers Discusses micro-characterization of composites and interfaces, also includes micro-mechanisms and microscopic evidences to establish the structure-property correlation Elucidates advantages and limitations of FRP composites in supercritical applications

Organic Photovoltaics

Author : Christoph Brabec
Publisher : John Wiley & Sons
ISBN 13 : 3527656936
Total Pages : 766 pages
Book Rating : 4.5/5 (276 download)

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Book Synopsis Organic Photovoltaics by : Christoph Brabec

Download or read book Organic Photovoltaics written by Christoph Brabec and published by John Wiley & Sons. This book was released on 2014-02-20 with total page 766 pages. Available in PDF, EPUB and Kindle. Book excerpt: The versatility of organic photovoltaics is already well known and this completely revised, updated, and enlarged edition of a classic provides an up-to-date overview of this hot topic. The proven structure of the successful first edition, divided into the three key aspects of successful device design: materials, device physics, and manufacturing technologies, has been retained. Important aspects such as printing technologies, substrates, and electrode systems are covered. The result is a balanced, comprehensive text on the fundamentals as well as the latest results in the area that will set R&D trends for years to come. With its combination of both academic and commercial technological views, this is an optimal source of information for scientists, engineers, and graduate students already actively working in this field, and looking for comprehensive summaries on specific topics.

Surface Mount Technology

Author : Ray Prasad
Publisher : Springer Science & Business Media
ISBN 13 : 1461540844
Total Pages : 791 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Surface Mount Technology by : Ray Prasad

Download or read book Surface Mount Technology written by Ray Prasad and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 791 pages. Available in PDF, EPUB and Kindle. Book excerpt: A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.

Microelectronic Failure Analysis

Author :
Publisher : ASM International
ISBN 13 : 0871707691
Total Pages : 160 pages
Book Rating : 4.8/5 (717 download)

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Book Synopsis Microelectronic Failure Analysis by :

Download or read book Microelectronic Failure Analysis written by and published by ASM International. This book was released on 2002-01-01 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides new or expanded coverage on the latest techniques for microelectronic failure analysis. The CD-ROM includes the complete content of the book in fully searchable Adobe Acrobat format. Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee

The Electronics Handbook

Author : Jerry C. Whitaker
Publisher : CRC Press
ISBN 13 : 1420036661
Total Pages : 2640 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis The Electronics Handbook by : Jerry C. Whitaker

Download or read book The Electronics Handbook written by Jerry C. Whitaker and published by CRC Press. This book was released on 2018-10-03 with total page 2640 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the ten years since the appearance of the groundbreaking, bestselling first edition of The Electronics Handbook, the field has grown and changed tremendously. With a focus on fundamental theory and practical applications, the first edition guided novice and veteran engineers along the cutting edge in the design, production, installation, operation, and maintenance of electronic devices and systems. Completely updated and expanded to reflect recent advances, this second edition continues the tradition. The Electronics Handbook, Second Edition provides a comprehensive reference to the key concepts, models, and equations necessary to analyze, design, and predict the behavior of complex electrical devices, circuits, instruments, and systems. With 23 sections that encompass the entire electronics field, from classical devices and circuits to emerging technologies and applications, The Electronics Handbook, Second Edition not only covers the engineering aspects, but also includes sections on reliability, safety, and engineering management. The book features an individual table of contents at the beginning of each chapter, which enables engineers from industry, government, and academia to navigate easily to the vital information they need. This is truly the most comprehensive, easy-to-use reference on electronics available.

Microelectronics Fialure Analysis Desk Reference, Seventh Edition

Author : Tejinder Gandhi
Publisher : ASM International
ISBN 13 : 1627082468
Total Pages : 750 pages
Book Rating : 4.6/5 (27 download)

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Book Synopsis Microelectronics Fialure Analysis Desk Reference, Seventh Edition by : Tejinder Gandhi

Download or read book Microelectronics Fialure Analysis Desk Reference, Seventh Edition written by Tejinder Gandhi and published by ASM International. This book was released on 2019-11-01 with total page 750 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.