Power Electronic Packaging

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Power Electronic Packaging

Author : Yong Liu
Publisher : Springer Science & Business Media
ISBN 13 : 1461410533
Total Pages : 606 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Power Electronic Packaging by : Yong Liu

Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Advanced Electronic Packaging

Author : Richard K. Ulrich
Publisher : John Wiley & Sons
ISBN 13 : 0471466093
Total Pages : 852 pages
Book Rating : 4.4/5 (714 download)

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Book Synopsis Advanced Electronic Packaging by : Richard K. Ulrich

Download or read book Advanced Electronic Packaging written by Richard K. Ulrich and published by John Wiley & Sons. This book was released on 2006-02-24 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

Power Electronic Packaging

Author : Yong Liu
Publisher : Springer Science & Business Media
ISBN 13 : 1461410525
Total Pages : 606 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Power Electronic Packaging by : Yong Liu

Power Electronics Packaging Reliability

Author : Mark Johnson
Publisher : Energy Engineering
ISBN 13 : 9781785612527
Total Pages : 400 pages
Book Rating : 4.6/5 (125 download)

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Book Synopsis Power Electronics Packaging Reliability by : Mark Johnson

Download or read book Power Electronics Packaging Reliability written by Mark Johnson and published by Energy Engineering. This book was released on 2018-06-26 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the technologies involved in power electronic device manufacturing with an emphasis on characterising the key wear-out mechanisms and technologies to increase reliability.

The Electronic Packaging Handbook

Author : Glenn R. Blackwell
Publisher : CRC Press
ISBN 13 : 1351835548
Total Pages : 640 pages
Book Rating : 4.3/5 (518 download)

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Book Synopsis The Electronic Packaging Handbook by : Glenn R. Blackwell

Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 640 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Reliability of Power Electronic Converter Systems

Author : Henry Shu-hung Chung
Publisher : IET
ISBN 13 : 1849199019
Total Pages : 502 pages
Book Rating : 4.8/5 (491 download)

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Book Synopsis Reliability of Power Electronic Converter Systems by : Henry Shu-hung Chung

Download or read book Reliability of Power Electronic Converter Systems written by Henry Shu-hung Chung and published by IET. This book was released on 2015-12-07 with total page 502 pages. Available in PDF, EPUB and Kindle. Book excerpt: The main aims of power electronic converter systems (PECS) are to control, convert, and condition electrical power flow from one form to another through the use of solid state electronics. This book outlines current research into the scientific modeling, experimentation, and remedial measures for advancing the reliability, availability, system robustness, and maintainability of PECS at different levels of complexity.

Wide Bandgap Power Semiconductor Packaging

Author : Katsuaki Suganuma
Publisher : Woodhead Publishing
ISBN 13 : 0081020953
Total Pages : 240 pages
Book Rating : 4.0/5 (81 download)

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Book Synopsis Wide Bandgap Power Semiconductor Packaging by : Katsuaki Suganuma

Download or read book Wide Bandgap Power Semiconductor Packaging written by Katsuaki Suganuma and published by Woodhead Publishing. This book was released on 2018-05-28 with total page 240 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

The Electronic Packaging Handbook

Author : Glenn R. Blackwell
Publisher : CRC Press
ISBN 13 : 9781420049848
Total Pages : 648 pages
Book Rating : 4.0/5 (498 download)

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Book Synopsis The Electronic Packaging Handbook by : Glenn R. Blackwell

Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Advanced Materials for Thermal Management of Electronic Packaging

Author : Xingcun Colin Tong
Publisher : Springer Science & Business Media
ISBN 13 : 1441977597
Total Pages : 633 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Advanced Materials for Thermal Management of Electronic Packaging by : Xingcun Colin Tong

Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Materials for High-Density Electronic Packaging and Interconnection

Author : National Research Council
Publisher : National Academies Press
ISBN 13 : 030904233X
Total Pages : 154 pages
Book Rating : 4.3/5 (9 download)

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Book Synopsis Materials for High-Density Electronic Packaging and Interconnection by : National Research Council

Download or read book Materials for High-Density Electronic Packaging and Interconnection written by National Research Council and published by National Academies Press. This book was released on 1990-02-01 with total page 154 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Principles of Electronic Packaging

Author : Donald P. Seraphim
Publisher : McGraw-Hill Companies
ISBN 13 :
Total Pages : 1000 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Principles of Electronic Packaging by : Donald P. Seraphim

Download or read book Principles of Electronic Packaging written by Donald P. Seraphim and published by McGraw-Hill Companies. This book was released on 1989 with total page 1000 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Electronic Packaging Materials and Their Properties

Author : Michael Pecht
Publisher : CRC Press
ISBN 13 : 1498730868
Total Pages : 120 pages
Book Rating : 4.4/5 (987 download)

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Book Synopsis Electronic Packaging Materials and Their Properties by : Michael Pecht

Download or read book Electronic Packaging Materials and Their Properties written by Michael Pecht and published by CRC Press. This book was released on 2017-12-19 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Electronic Packaging

Author : John H. Lau
Publisher : McGraw-Hill Professional Publishing
ISBN 13 : 9780070371354
Total Pages : 0 pages
Book Rating : 4.3/5 (713 download)

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Book Synopsis Electronic Packaging by : John H. Lau

Download or read book Electronic Packaging written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1998 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.

Wafer-Level Chip-Scale Packaging

Author : Shichun Qu
Publisher : Springer
ISBN 13 : 1493915568
Total Pages : 322 pages
Book Rating : 4.4/5 (939 download)

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Book Synopsis Wafer-Level Chip-Scale Packaging by : Shichun Qu

Download or read book Wafer-Level Chip-Scale Packaging written by Shichun Qu and published by Springer. This book was released on 2014-09-10 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt: Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Author : Beth Keser
Publisher : John Wiley & Sons
ISBN 13 : 1119314135
Total Pages : 576 pages
Book Rating : 4.1/5 (193 download)

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Book Synopsis Advances in Embedded and Fan-Out Wafer Level Packaging Technologies by : Beth Keser

Download or read book Advances in Embedded and Fan-Out Wafer Level Packaging Technologies written by Beth Keser and published by John Wiley & Sons. This book was released on 2019-02-12 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.

Electronic Packaging Science and Technology

Author : King-Ning Tu
Publisher : John Wiley & Sons
ISBN 13 : 1119418313
Total Pages : 340 pages
Book Rating : 4.1/5 (194 download)

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Book Synopsis Electronic Packaging Science and Technology by : King-Ning Tu

Download or read book Electronic Packaging Science and Technology written by King-Ning Tu and published by John Wiley & Sons. This book was released on 2021-12-29 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.

Electronic Packaging Science and Technology

Author : King-Ning Tu
Publisher : John Wiley & Sons
ISBN 13 : 111941833X
Total Pages : 336 pages
Book Rating : 4.1/5 (194 download)

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Book Synopsis Electronic Packaging Science and Technology by : King-Ning Tu

Download or read book Electronic Packaging Science and Technology written by King-Ning Tu and published by John Wiley & Sons. This book was released on 2021-12-14 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.