Microelectronic Failure Analysis

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Microelectronics Fialure Analysis Desk Reference, Seventh Edition

Author : Tejinder Gandhi
Publisher : ASM International
ISBN 13 : 1627082468
Total Pages : 719 pages
Book Rating : 4.6/5 (27 download)

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Book Synopsis Microelectronics Fialure Analysis Desk Reference, Seventh Edition by : Tejinder Gandhi

Download or read book Microelectronics Fialure Analysis Desk Reference, Seventh Edition written by Tejinder Gandhi and published by ASM International. This book was released on 2019-11-01 with total page 719 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.

Microelectronics Failure Analysis

Author : EDFAS Desk Reference Committee
Publisher : ASM International
ISBN 13 : 1615037268
Total Pages : 673 pages
Book Rating : 4.6/5 (15 download)

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Book Synopsis Microelectronics Failure Analysis by : EDFAS Desk Reference Committee

Download or read book Microelectronics Failure Analysis written by EDFAS Desk Reference Committee and published by ASM International. This book was released on 2011 with total page 673 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes bibliographical references and index.

Microelectronic Failure Analysis

Author :
Publisher : ASM International
ISBN 13 : 0871707691
Total Pages : 160 pages
Book Rating : 4.8/5 (717 download)

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Book Synopsis Microelectronic Failure Analysis by :

Download or read book Microelectronic Failure Analysis written by and published by ASM International. This book was released on 2002-01-01 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides new or expanded coverage on the latest techniques for microelectronic failure analysis. The CD-ROM includes the complete content of the book in fully searchable Adobe Acrobat format. Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee

Microelectronics Failure Analysis

Author :
Publisher : ASM International
ISBN 13 : 0871708043
Total Pages : 813 pages
Book Rating : 4.8/5 (717 download)

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Book Synopsis Microelectronics Failure Analysis by :

Download or read book Microelectronics Failure Analysis written by and published by ASM International. This book was released on 2004-01-01 with total page 813 pages. Available in PDF, EPUB and Kindle. Book excerpt: For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron

Physics-of-Failure Based Handbook of Microelectronic Systems

Author : Shahrzad Salemi
Publisher : RIAC
ISBN 13 : 1933904291
Total Pages : 271 pages
Book Rating : 4.9/5 (339 download)

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Book Synopsis Physics-of-Failure Based Handbook of Microelectronic Systems by : Shahrzad Salemi

Download or read book Physics-of-Failure Based Handbook of Microelectronic Systems written by Shahrzad Salemi and published by RIAC. This book was released on 2008 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Electronic Failure Analysis Handbook

Author : Perry L. Martin
Publisher : McGraw Hill Professional
ISBN 13 : 9780070410442
Total Pages : 770 pages
Book Rating : 4.4/5 (14 download)

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Book Synopsis Electronic Failure Analysis Handbook by : Perry L. Martin

Download or read book Electronic Failure Analysis Handbook written by Perry L. Martin and published by McGraw Hill Professional. This book was released on 1999 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--BOOK JACKET. Title Summary field provided by Blackwell North America, Inc. All Rights Reserved.

Reliability and Failure of Electronic Materials and Devices

Author : Milton Ohring
Publisher : Academic Press
ISBN 13 : 0080575528
Total Pages : 759 pages
Book Rating : 4.0/5 (85 download)

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Book Synopsis Reliability and Failure of Electronic Materials and Devices by : Milton Ohring

Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Academic Press. This book was released on 2014-10-14 with total page 759 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

Microelectronic Materials

Author : C.R.M. Grovenor
Publisher : CRC Press
ISBN 13 : 9780852742709
Total Pages : 560 pages
Book Rating : 4.7/5 (427 download)

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Book Synopsis Microelectronic Materials by : C.R.M. Grovenor

Download or read book Microelectronic Materials written by C.R.M. Grovenor and published by CRC Press. This book was released on 1989-01-01 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: This practical book shows how an understanding of structure, thermodynamics, and electrical properties can explain some of the choices of materials used in microelectronics, and can assist in the design of new materials for specific applications. It emphasizes the importance of the phase chemistry of semiconductor and metal systems for ensuring the long-term stability of new devices. The book discusses single-crystal and polycrystalline silicon, aluminium- and gold-based metallisation schemes, packaging semiconductor devices, failure analysis, and the suitability of various materials for optoelectronic devices and solar cells. It has been designed for senior undergraduates, graduates, and researchers in physics, electronic engineering, and materials science.

Microelectronic Failure Analysis Desk Reference

Author :
Publisher : ASM International
ISBN 13 : 0871707454
Total Pages : 162 pages
Book Rating : 4.8/5 (717 download)

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Book Synopsis Microelectronic Failure Analysis Desk Reference by :

Download or read book Microelectronic Failure Analysis Desk Reference written by and published by ASM International. This book was released on 2001-01-01 with total page 162 pages. Available in PDF, EPUB and Kindle. Book excerpt: Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee.

Failure Analysis

Author : Marius Bazu
Publisher : John Wiley & Sons
ISBN 13 : 1119990009
Total Pages : 372 pages
Book Rating : 4.1/5 (199 download)

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Book Synopsis Failure Analysis by : Marius Bazu

Download or read book Failure Analysis written by Marius Bazu and published by John Wiley & Sons. This book was released on 2011-03-08 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.

3D Microelectronic Packaging

Author : Yan Li
Publisher : Springer Nature
ISBN 13 : 9811570906
Total Pages : 629 pages
Book Rating : 4.8/5 (115 download)

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Book Synopsis 3D Microelectronic Packaging by : Yan Li

Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer Nature. This book was released on 2020-11-23 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

Infrared Characterization For Microelectronics

Author : Wai Shing Lau
Publisher : World Scientific
ISBN 13 : 9814500070
Total Pages : 175 pages
Book Rating : 4.8/5 (145 download)

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Book Synopsis Infrared Characterization For Microelectronics by : Wai Shing Lau

Download or read book Infrared Characterization For Microelectronics written by Wai Shing Lau and published by World Scientific. This book was released on 1999-10-01 with total page 175 pages. Available in PDF, EPUB and Kindle. Book excerpt: Most of the books on infrared characterization are for applications in chemistry and no book has been dedicated to infrared characterization for microelectronics. The focus of the book will be on practical applications useful to the production line and to the research and development of microelectronics. The background knowledge and significance of doing a particular type of infrared measurement will be discussed in detail. The principal purpose of the book is to serve as a useful handbook for practising engineers and scientists in the field of microelectronics.

Lead-Free Solder Interconnect Reliability

Author : Dongkai Shangguan
Publisher : ASM International
ISBN 13 : 161503093X
Total Pages : 292 pages
Book Rating : 4.6/5 (15 download)

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Book Synopsis Lead-Free Solder Interconnect Reliability by : Dongkai Shangguan

Download or read book Lead-Free Solder Interconnect Reliability written by Dongkai Shangguan and published by ASM International. This book was released on 2005 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:

3D Microelectronic Packaging

Author : Yan Li
Publisher : Springer
ISBN 13 : 9783319445847
Total Pages : 560 pages
Book Rating : 4.4/5 (458 download)

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Book Synopsis 3D Microelectronic Packaging by : Yan Li

Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer. This book was released on 2016-10-29 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Reliability, Maintainability and Risk

Author : David J. Smith
Publisher : Elsevier
ISBN 13 : 0080969038
Total Pages : 463 pages
Book Rating : 4.0/5 (89 download)

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Book Synopsis Reliability, Maintainability and Risk by : David J. Smith

Download or read book Reliability, Maintainability and Risk written by David J. Smith and published by Elsevier. This book was released on 2011-06-29 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability, Maintainability and Risk: Practical Methods for Engineers, Eighth Edition, discusses tools and techniques for reliable and safe engineering, and for optimizing maintenance strategies. It emphasizes the importance of using reliability techniques to identify and eliminate potential failures early in the design cycle. The focus is on techniques known as RAMS (reliability, availability, maintainability, and safety-integrity). The book is organized into five parts. Part 1 on reliability parameters and costs traces the history of reliability and safety technology and presents a cost-effective approach to quality, reliability, and safety. Part 2 deals with the interpretation of failure rates, while Part 3 focuses on the prediction of reliability and risk. Part 4 discusses design and assurance techniques; review and testing techniques; reliability growth modeling; field data collection and feedback; predicting and demonstrating repair times; quantified reliability maintenance; and systematic failures. Part 5 deals with legal, management and safety issues, such as project management, product liability, and safety legislation. - 8th edition of this core reference for engineers who deal with the design or operation of any safety critical systems, processes or operations - Answers the question: how can a defect that costs less than $1000 dollars to identify at the process design stage be prevented from escalating to a $100,000 field defect, or a $1m+ catastrophe - Revised throughout, with new examples, and standards, including must have material on the new edition of global functional safety standard IEC 61508, which launches in 2010

Mechanics of Microelectronics

Author : G.Q. Zhang
Publisher : Springer Science & Business Media
ISBN 13 : 1402049358
Total Pages : 580 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Mechanics of Microelectronics by : G.Q. Zhang

Download or read book Mechanics of Microelectronics written by G.Q. Zhang and published by Springer Science & Business Media. This book was released on 2006-08-25 with total page 580 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Plastic-Encapsulated Microelectronics

Author : Michael Pecht
Publisher : Wiley-Interscience
ISBN 13 :
Total Pages : 520 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Plastic-Encapsulated Microelectronics by : Michael Pecht

Download or read book Plastic-Encapsulated Microelectronics written by Michael Pecht and published by Wiley-Interscience. This book was released on 1995-02-20 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt: Until now, professionals in search of detailed information about the latest developments in PEM design and production have had to waste valuable time browsing through countless professional journals, monographs, and databases.