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Mechanics Of Solder Alloy Interconnects
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Book Synopsis Mechanics of Solder Alloy Interconnects by : Darrel R. Frear
Download or read book Mechanics of Solder Alloy Interconnects written by Darrel R. Frear and published by Springer Science & Business Media. This book was released on 1994-01-31 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
Book Synopsis The Mechanics of Solder Alloy Interconnects by :
Download or read book The Mechanics of Solder Alloy Interconnects written by and published by . This book was released on 1994 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Fundamentals of Lead-Free Solder Interconnect Technology by : Tae-Kyu Lee
Download or read book Fundamentals of Lead-Free Solder Interconnect Technology written by Tae-Kyu Lee and published by Springer. This book was released on 2014-11-05 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Book Synopsis Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces by : Qingke Zhang
Download or read book Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces written by Qingke Zhang and published by Springer. This book was released on 2015-10-31 with total page 143 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.
Book Synopsis Lead-Free Solder Interconnect Reliability by : Dongkai Shangguan
Download or read book Lead-Free Solder Interconnect Reliability written by Dongkai Shangguan and published by ASM International. This book was released on 2005 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging by : Ephraim Suhir
Download or read book Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Book Synopsis Area Array Interconnection Handbook by : Karl J. Puttlitz
Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Book Synopsis Solder Materials by : Lin Kwang-lung
Download or read book Solder Materials written by Lin Kwang-lung and published by World Scientific. This book was released on 2001-06-21 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.
Book Synopsis Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture by : E-H Wong
Download or read book Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture written by E-H Wong and published by Woodhead Publishing. This book was released on 2015-05-23 with total page 477 pages. Available in PDF, EPUB and Kindle. Book excerpt: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study
Book Synopsis The Mechanics of Solder Alloy Wetting and Spreading by : Frederick G. Yost
Download or read book The Mechanics of Solder Alloy Wetting and Spreading written by Frederick G. Yost and published by Springer. This book was released on 1993-11-30 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt: All operative mechanisms and processes that occur when a solder joint is formed are discussed. Areas addressed include solderability testing, the effects of fluxes and flux reaction on the soldering process, intermetallic formation and reactive wetting, dewetting, oxidation in assemblies to be soldered, and surface energies. Advice is included on how to evaluate solder joints and improve their reliability, along with a discussion of soldering issues on the horizon both in processing techniques and in new solder alloys. Readers will discover how to measure surface energies for molten metals, characterize oxide coatings formed by surface reactions, remove contaminant layers in solders, prevent poor solderability and rejected parts, alleviate problems caused by cyclical temperature and strain.
Book Synopsis Assembly and Reliability of Lead-Free Solder Joints by : John H. Lau
Download or read book Assembly and Reliability of Lead-Free Solder Joints written by John H. Lau and published by Springer Nature. This book was released on 2020-05-29 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Book Synopsis Modeling and Simulation for Microelectronic Packaging Assembly by : Shen Liu
Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-08-24 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Book Synopsis Materials and Processes by : Barrie D. Dunn
Download or read book Materials and Processes written by Barrie D. Dunn and published by Springer. This book was released on 2015-12-29 with total page 667 pages. Available in PDF, EPUB and Kindle. Book excerpt: The objective of this book is to assist scientists and engineers select the ideal material or manufacturing process for particular applications; these could cover a wide range of fields, from light-weight structures to electronic hardware. The book will help in problem solving as it also presents more than 100 case studies and failure investigations from the space sector that can, by analogy, be applied to other industries. Difficult-to-find material data is included for reference. The sciences of metallic (primarily) and organic materials presented throughout the book demonstrate how they can be applied as an integral part of spacecraft product assurance schemes, which involve quality, material and processes evaluations, and the selection of mechanical and component parts. In this successor edition, which has been revised and updated, engineering problems associated with critical spacecraft hardware and the space environment are highlighted by over 500 illustrations including micrographs and fractographs. Space hardware captured by astronauts and returned to Earth from long durations in space are examined. Information detailed in the Handbook is applicable to general terrestrial applications including consumer electronics as well as high reliability systems associated with aeronautics, medical equipment and ground transportation. This Handbook is also directed to those involved in maximizing the relia bility of new materials and processes for space technology and space engineering. It will be invaluable to engineers concerned with the construction of advanced structures or mechanical and electronic sub-systems.
Download or read book Soldering written by Mel Schwartz and published by ASM International. This book was released on 2014-03-01 with total page 207 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covers various soldering methods and techniques as well as the latest on solder alloys, solder films, surface preparation, fluxes and cleaning methods, heating methods, inspection techniques, and quality control and reliability. Geared to scientists, material engineers, designers, manufacturing engineers, and technologists who need immediate practical guidance rather than theoretical instruction.
Book Synopsis Materials for Advanced Packaging by : Daniel Lu
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 969 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Book Synopsis The Advances in Joining Technology by : Mokhtar Awang
Download or read book The Advances in Joining Technology written by Mokhtar Awang and published by Springer. This book was released on 2018-05-22 with total page 107 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume presents selected papers from the 3rd International Conference on Mechanical, Manufacturing and Process Plant Engineering (ICMMPE 2017) which was in Penang, Malaysia, 22nd–23rd November 2017. The proceedings discuss genuine problems covering various topics of mechanical, manufacturing, and Process Plant engineering.
Book Synopsis Electrical Contacts by : Milenko Braunovic
Download or read book Electrical Contacts written by Milenko Braunovic and published by CRC Press. This book was released on 2017-12-19 with total page 672 pages. Available in PDF, EPUB and Kindle. Book excerpt: Various factors affect the performance of electrical contacts, including tribological, mechanical, electrical, and materials aspects. Although these behaviors have been studied for many years, they are not widely used or understood in practice. Combining approaches used across the globe, Electrical Contacts: Fundamentals, Applications, and Technology integrates advances in research and development in the tribological, material, and analytical aspects of electrical contacts with new data on electrical current transfer at the micro- and nanoscales. Taking an application-oriented approach, the authors illustrate how material characteristics, tribological behavior, and loading impact the degradation of contacts, formation of intermetallics, and overall reliability and performance. Coverage is divided broadly into three sections, with the first focused on mechanics, tribology, materials, current and heat transfer, and basic reliability issues of electrical contacts. The next section explores applications, such as power connections, electronic connections, and sliding contacts, while the final section presents the diagnostic and monitoring techniques used to investigate and measure phenomena occurring at electrical contact interfaces. Numerous references to current literature reflect the fact that this book is the most comprehensive survey in the field. Explore an impressive collection of data, theory, and practical applications in Electrical Contacts: Fundamentals, Applications, and Technology, a critical tool for anyone investigating or designing electrical equipment with improved performance and reliability in mind.
