Read Books Online and Download eBooks, EPub, PDF, Mobi, Kindle, Text Full Free.
Low Temperature Wafer Bonding Using Amorphous Gallium Arsenide
Download Low Temperature Wafer Bonding Using Amorphous Gallium Arsenide full books in PDF, epub, and Kindle. Read online Low Temperature Wafer Bonding Using Amorphous Gallium Arsenide ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Book Synopsis State-of-the-Art Program on Compound Semiconductors XLI and Nitride and Wide Bandgap Semiconductors for Sensors, Photonics and Electronics V by : H. M. Ng
Download or read book State-of-the-Art Program on Compound Semiconductors XLI and Nitride and Wide Bandgap Semiconductors for Sensors, Photonics and Electronics V written by H. M. Ng and published by The Electrochemical Society. This book was released on 2004 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Semiconductor Wafer Bonding VIII : Science, Technology, and Applications by :
Download or read book Semiconductor Wafer Bonding VIII : Science, Technology, and Applications written by and published by The Electrochemical Society. This book was released on 2005 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Design and Process for Three-dimensional Heterogeneous Integration by : Shulu Chen
Download or read book Design and Process for Three-dimensional Heterogeneous Integration written by Shulu Chen and published by Stanford University. This book was released on 2010 with total page 186 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since the invention of the integrated circuit (IC) in the late 1950s, the semiconductor industry has experienced dramatic growth driven by both technology and manufacturing improvements. Over the past 40 years, the industry's growth trend has been predicted by Moore's law, and driven by the constant electrical field scaling design methodology. While the intrinsic performance of each device improves over generations, the corresponding interconnects do not. To alleviate this interconnect issue, a three-dimensional (3D) integration concept of transforming longer side to side interconnects into shorter vertical vias by using multiple active layers has attracted much attention. The focus of this thesis is on providing the foundation for 3D heterogeneous integration by investigating methods of growing single crystal materials on the silicon platform and the subsequent low-temperature process flow, through experimental demonstration, theoretical modeling and device structure simplification. First, thin film single crystal GaAs and GaSb were grown on dielectric layers on bulk silicon substrates by the rapid melt growth (RMG) method, using both rapid thermal annealing (RTA) and laser annealing. The relationship between stoichiometry and the crystal structure is discussed according to the theoretical phase diagram and the experimental results. A modified RMG structure is also proposed and demonstrated to solve the potential issue involved in integrating the RMG method into a three-dimensional integrated circuits (3D-IC) process with thick isolation layers. In order to estimate the outcome of the crystallization and to provide further understanding of the physics behind this RMG process, compact models are derived based on classical crystallization theory. Mathematical models including the geometry, the thermal environment and the outcome of the crystallization are built. The initial cooling rate is identified as the key factor for the RMG process. With the ability of integrating multiple materials on silicon substrates, the subsequent process flows using low-temperature-fabrication or simplified device structures are proposed and evaluated to achieve high density 3D integration. A "bonding substrate/monolithic contact" approach is proposed to relieve the thermal constraint from getting the starting single crystal layer without sacrificing the interconnect performance. A low-temperature process using germanium as the channel material is also discussed. Finally, gated thin film resistor structures are designed and compared to the conventional MOSFET structure with a focus on their relative performance and process complexity trade-off for future 3D-IC implementation.
Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Book Synopsis Amorphous Insulating Thin Films II by : Roderick A. B. Devine
Download or read book Amorphous Insulating Thin Films II written by Roderick A. B. Devine and published by Elsevier Publishing Company. This book was released on 1995 with total page 546 pages. Available in PDF, EPUB and Kindle. Book excerpt: These proceedings present a review of the research being carried out in the field of amorphous insulating thin films. Topics discussed include: nitrides, structure and defects; hydrogen in MOS structures and oxides; silicon dioxide, charge trapping; and ONO and nitride oxides.
Book Synopsis Surface and Interface Science, Volumes 9 and 10 by : Klaus Wandelt
Download or read book Surface and Interface Science, Volumes 9 and 10 written by Klaus Wandelt and published by John Wiley & Sons. This book was released on 2020-03-30 with total page 990 pages. Available in PDF, EPUB and Kindle. Book excerpt: In ten volumes, this unique handbook covers all fundamental aspects of surface and interface science and offers a comprehensive overview of this research area for scientists working in the field, as well as an introduction for newcomers. Volume 1: Concepts and Methods Volume 2: Properties of Elemental Surfaces Volume 3: Properties of Composite Surfaces: Alloys, Compounds, Semiconductors Volume 4: Solid-Solid Interfaces and Thin Films Volume 5: Solid-Gas Interfaces I Volume 6: Solid-Gas Interfaces II Volume 7: Liquid and Biological Interfaces Volume 8: Interfacial Electrochemistry Volume 9: Applications of Surface Science I Volume 10: Applications of Surface Science II Content of Volumes 8 & 9: * Surface Analytics with X-Ray Photoelectron and Auger Electron Spectroscopy on Coated Steel Sheets * Applications of Graphene * Industrial Heterogeneous Catalysis * Automotive Catalysis * High-Throughput Heterogeneous Catalyst Research, Development, Scale-Up, and Production Support * Industrial Separation of Insulating Particles: Triboelectric Charging * Friction: Friend and Foe * Surface Science and Flotation * Application of Surface Science to Corrosion * Electrons, Electrodes, and the Transformation of Organic Molecules * Self-Cleaning Surfaces: From Fundamental Aspect to Real Technical Applications * Thin Films: Sputtering, PVD Methods and Applications * Wafer Bonding * Superconformal Deposition * Spintronics: Surface and Interface Aspects * Device Efficiency of Organic Light-Emitting Diodes * Dye-Sensitized Solar Cells * Electronic Nose: Current Status and Future Trends * Surface Science in Batteries * Surface and Interface Science in Fuel Cells Research
Book Synopsis Thermal Management of Gallium Nitride Electronics by : Marko Tadjer
Download or read book Thermal Management of Gallium Nitride Electronics written by Marko Tadjer and published by Woodhead Publishing. This book was released on 2022-07-13 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management of Gallium Nitride Electronics outlines the technical approaches undertaken by leaders in the community, the challenges they have faced, and the resulting advances in the field. This book serves as a one-stop reference for compound semiconductor device researchers tasked with solving this engineering challenge for future material systems based on ultra-wide bandgap semiconductors. A number of perspectives are included, such as the growth methods of nanocrystalline diamond, the materials integration of polycrystalline diamond through wafer bonding, and the new physics of thermal transport across heterogeneous interfaces. Over the past 10 years, the book's authors have performed pioneering experiments in the integration of nanocrystalline diamond capping layers into the fabrication process of compound semiconductor devices. Significant research efforts of integrating diamond and GaN have been reported by a number of groups since then, thus resulting in active thermal management options that do not necessarily lead to performance derating to avoid self-heating during radio frequency or power switching operation of these devices. Self-heating refers to the increased channel temperature caused by increased energy transfer from electrons to the lattice at high power. This book chronicles those breakthroughs. - Includes the fundamentals of thermal management of wide-bandgap semiconductors, with historical context, a review of common heating issues, thermal transport physics, and characterization methods - Reviews the latest strategies to overcome heating issues through materials modeling, growth and device design strategies - Touches on emerging, real-world applications for thermal management strategies in power electronics
Book Synopsis Microscopy of Semiconducting Materials by : A.G Cullis
Download or read book Microscopy of Semiconducting Materials written by A.G Cullis and published by CRC Press. This book was released on 2000-01-01 with total page 782 pages. Available in PDF, EPUB and Kindle. Book excerpt: With IC technology continuing to advance, the analysis of very small structures remains critically important. Microscopy of Semiconducting Materials provides an overview of advances in semiconductor studies using microscopy. The book explores the use of transmission and scanning electron microscopy, ultrafine electron probes, and EELS to investigate semiconducting structures. It also covers specimen preparation using focused ion beam milling and advances in microscopy techniques using different types of scanning probes, such as AFM, STM, and SCM. In addition, the book discusses a range of materials, from finished devices to partly processed materials and structures, including nanoscale wires and dots. This volume provides an authoritative reference for all academics and researchers in materials science, electrical and electronic engineering and instrumentation, and condensed matter physics.
Book Synopsis Handbook of Silicon Based MEMS Materials and Technologies by : Markku Tilli
Download or read book Handbook of Silicon Based MEMS Materials and Technologies written by Markku Tilli and published by William Andrew. This book was released on 2015-09-02 with total page 827 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures - Geared towards practical applications rather than theory
Book Synopsis State-of-the-Art Program on Compound Semiconductors : (SOTAPOCS XLII) and Processes at the Compound-Semiconductor/Solution Interface by : P. C. Chang
Download or read book State-of-the-Art Program on Compound Semiconductors : (SOTAPOCS XLII) and Processes at the Compound-Semiconductor/Solution Interface written by P. C. Chang and published by The Electrochemical Society. This book was released on 2005 with total page 500 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2004-05-14 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Book Synopsis Scientific and Technical Aerospace Reports by :
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis State-of-the-Art Program on Compound Semiconductors 46 (SOTAPOCS 46) -and- Processes at the Semiconductor/Solution Interface 2 by : C. O'Dwyer
Download or read book State-of-the-Art Program on Compound Semiconductors 46 (SOTAPOCS 46) -and- Processes at the Semiconductor/Solution Interface 2 written by C. O'Dwyer and published by The Electrochemical Society. This book was released on 2007 with total page 647 pages. Available in PDF, EPUB and Kindle. Book excerpt: Section 1 addresses the most recent developments in processes at the semiconductor-solution interface include etching, oxidation, passivation, film growth, porous semiconductor formation, electrochemical, photoelectrochemical, electroluminescence and photoluminescence processes, electroanalytical measurements and related topics on both elemental and compound semiconductors. Section 2 addresses the most recent developments in compound semiconductors encompassing advanced devices, materials growth, characterization, processing, device fabrication, reliability, and related topics.
Book Synopsis Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications by : F. Roozeboom
Download or read book Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications written by F. Roozeboom and published by The Electrochemical Society. This book was released on 2011-04-25 with total page 377 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions covers emerging materials, process and technology options for large-area silicon wafers to enhance advanced IC performance or to enable revolutionary device structures with entirely new functionalities. Topics : high-mobility channel materials, (e.g. strained Si/Ge, compound semiconductors and graphene), high-performance gate stacks and low-resistivity junctions and contacts on new, Si-compatible materials; new materials and processes for 3-D (TSV) integration ; synthesis of nano-structures including wires, pores and membranes of Si-compatible materials; novel MEMS/NEMS structures and their integration with the mainstream Si-IC technology.
Book Synopsis Applied Mechanics, Mechatronics Automation & System Simulation by : J.Y. Liang
Download or read book Applied Mechanics, Mechatronics Automation & System Simulation written by J.Y. Liang and published by Trans Tech Publications Ltd. This book was released on 2012-09-26 with total page 1852 pages. Available in PDF, EPUB and Kindle. Book excerpt: Selected, peer reviewed papers from the 2012 International Applied Mechanics, Mechatronics Automation & System Simulation Meeting (AMMASS 2012), June 24-26, 2012, Hangzhou, Zhejiang, China
Book Synopsis Handbook of Optofluidics by : Aaron R. Hawkins
Download or read book Handbook of Optofluidics written by Aaron R. Hawkins and published by CRC Press. This book was released on 2010-03-19 with total page 666 pages. Available in PDF, EPUB and Kindle. Book excerpt: Optofluidics is an emerging field that involves the use of fluids to modify optical properties and the use of optical devices to detect flowing media. Ultimately, its value is highly dependent on the successful integration of photonic integrated circuits with microfluidic or nanofluidic systems. Handbook of Optofluidics provides a snapshot of the s
Book Synopsis GaN-based Materials and Devices by : Michael Shur
Download or read book GaN-based Materials and Devices written by Michael Shur and published by World Scientific. This book was released on 2004 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: The unique materials properties of GaN-based semiconductors have stimulated a great deal of interest in research and development regarding nitride materials growth and optoelectronic and nitride-based electronic devices. High electron mobility and saturation velocity, high sheet carrier concentration at heterojunction interfaces, high breakdown field, and low thermal impedance of GaN-based films grown over SiC or bulk AlN substrates make nitride-based electronic devices very promising. The chemical inertness of nitrides is another key property.This volume, written by experts on different aspects of nitride technology, addresses the entire spectrum of issues related to nitride materials and devices, and it will be useful for technologists, scientists, engineers, and graduate students who are working on wide bandgap materials and devices. The book can also be used as a supplementary text for graduate courses on wide bandgap semiconductor technology.
