ITherm 2002

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Publisher :
ISBN 13 :
Total Pages : 1148 pages
Book Rating : 4.E/5 ( download)

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Book Synopsis ITherm 2002 by : Cristina H. Amon

Download or read book ITherm 2002 written by Cristina H. Amon and published by . This book was released on 2002 with total page 1148 pages. Available in PDF, EPUB and Kindle. Book excerpt:

ITHERM

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Publisher :
ISBN 13 :
Total Pages : 798 pages
Book Rating : 4.0/5 ( download)

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Book Synopsis ITHERM by :

Download or read book ITHERM written by and published by . This book was released on 2004 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Data Center Handbook

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Publisher : John Wiley & Sons
ISBN 13 : 1118436636
Total Pages : 720 pages
Book Rating : 4.1/5 (184 download)

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Book Synopsis Data Center Handbook by : Hwaiyu Geng

Download or read book Data Center Handbook written by Hwaiyu Geng and published by John Wiley & Sons. This book was released on 2014-12-22 with total page 720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides the fundamentals, technologies, and best practices in designing, constructing and managing mission critical, energy efficient data centers Organizations in need of high-speed connectivity and nonstop systems operations depend upon data centers for a range of deployment solutions. A data center is a facility used to house computer systems and associated components, such as telecommunications and storage systems. It generally includes multiple power sources, redundant data communications connections, environmental controls (e.g., air conditioning, fire suppression) and security devices. With contributions from an international list of experts, The Data Center Handbook instructs readers to: Prepare strategic plan that includes location plan, site selection, roadmap and capacity planning Design and build "green" data centers, with mission critical and energy-efficient infrastructure Apply best practices to reduce energy consumption and carbon emissions Apply IT technologies such as cloud and virtualization Manage data centers in order to sustain operations with minimum costs Prepare and practice disaster reovery and business continuity plan The book imparts essential knowledge needed to implement data center design and construction, apply IT technologies, and continually improve data center operations.

ITherm 2002

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Publisher :
ISBN 13 :
Total Pages : 1115 pages
Book Rating : 4.:/5 (16 download)

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Book Synopsis ITherm 2002 by :

Download or read book ITherm 2002 written by and published by . This book was released on 2002 with total page 1115 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Heat Transfer

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Publisher : CRC Press
ISBN 13 : 1439814686
Total Pages : 526 pages
Book Rating : 4.4/5 (398 download)

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Book Synopsis Heat Transfer by : Younes Shabany

Download or read book Heat Transfer written by Younes Shabany and published by CRC Press. This book was released on 2009-12-17 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use

Energy Efficient Thermal Management of Data Centers

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Publisher : Springer Science & Business Media
ISBN 13 : 1441971246
Total Pages : 635 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Energy Efficient Thermal Management of Data Centers by : Yogendra Joshi

Download or read book Energy Efficient Thermal Management of Data Centers written by Yogendra Joshi and published by Springer Science & Business Media. This book was released on 2012-03-20 with total page 635 pages. Available in PDF, EPUB and Kindle. Book excerpt: Energy Efficient Thermal Management of Data Centers examines energy flow in today's data centers. Particular focus is given to the state-of-the-art thermal management and thermal design approaches now being implemented across the multiple length scales involved. The impact of future trends in information technology hardware, and emerging software paradigms such as cloud computing and virtualization, on thermal management are also addressed. The book explores computational and experimental characterization approaches for determining temperature and air flow patterns within data centers. Thermodynamic analyses using the second law to improve energy efficiency are introduced and used in proposing improvements in cooling methodologies. Reduced-order modeling and robust multi-objective design of next generation data centers are discussed.

Qpedia Thermal Management – Electronics Cooling Book, Volume 3

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Publisher : Advanced Thermal Solutions
ISBN 13 : 098462791X
Total Pages : 204 pages
Book Rating : 4.9/5 (846 download)

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Book Synopsis Qpedia Thermal Management – Electronics Cooling Book, Volume 3 by : Advanced Thermal Solutions

Download or read book Qpedia Thermal Management – Electronics Cooling Book, Volume 3 written by Advanced Thermal Solutions and published by Advanced Thermal Solutions. This book was released on 2009 with total page 204 pages. Available in PDF, EPUB and Kindle. Book excerpt: The complete editorial contents of Qpedia Thermal eMagazine, Volume 3, Issues 1 - 12 features in-depth, technical articles covering the most critical areas of electronics cooling.

Numerical Simulation of Heat Exchangers

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Publisher : CRC Press
ISBN 13 : 1315355302
Total Pages : 273 pages
Book Rating : 4.3/5 (153 download)

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Book Synopsis Numerical Simulation of Heat Exchangers by : W. J. Minkowycz

Download or read book Numerical Simulation of Heat Exchangers written by W. J. Minkowycz and published by CRC Press. This book was released on 2017-04-07 with total page 273 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book deals with certain aspects of material science, particularly with the release of thermal energy associated with bond breaking. It clearly establishes the connection between heat transfer rates and product quality. The editors then sharply draw the thermal distinctions between the various categories of welding processes, and demonstrate how these distinctions are translated into simulation model uniqueness. The book discusses the incorporation of radiative heat transfer processes into the simulation model.

Structural Dynamics of Electronic and Photonic Systems

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Publisher : John Wiley & Sons
ISBN 13 : 047088679X
Total Pages : 610 pages
Book Rating : 4.4/5 (78 download)

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Book Synopsis Structural Dynamics of Electronic and Photonic Systems by : Ephraim Suhir

Download or read book Structural Dynamics of Electronic and Photonic Systems written by Ephraim Suhir and published by John Wiley & Sons. This book was released on 2011-04-04 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.

Engineering and Management of Data Centers

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Publisher : Springer
ISBN 13 : 3319650823
Total Pages : 290 pages
Book Rating : 4.3/5 (196 download)

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Book Synopsis Engineering and Management of Data Centers by : Jorge Marx Gómez

Download or read book Engineering and Management of Data Centers written by Jorge Marx Gómez and published by Springer. This book was released on 2017-11-10 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: This edited volume covers essential and recent development in the engineering and management of data centers. Data centers are complex systems requiring ongoing support, and their high value for keeping business continuity operations is crucial. The book presents core topics on the planning, design, implementation, operation and control, and sustainability of a data center from a didactical and practitioner viewpoint. Chapters include: · Foundations of data centers: Key Concepts and Taxonomies · ITSDM: A Methodology for IT Services Design · Managing Risks on Data Centers through Dashboards · Risk Analysis in Data Center Disaster Recovery Plans · Best practices in Data Center Management Case: KIO Networks · QoS in NaaS (Network as a Service) using Software Defined Networking · Optimization of Data Center Fault-Tolerance Design · Energetic Data Centre Design Considering Energy Efficiency Improvements During Operation · Demand-side Flexibility and Supply-side Management: The Use Case of Data Centers and Energy Utilities · DevOps: Foundations and its Utilization in Data Centers · Sustainable and Resilient Network Infrastructure Design for Cloud Data Centres · Application Software in Cloud-Ready Data Centers This book bridges the gap between academia and the industry, offering essential reading for practitioners in data centers, researchers in the area, and faculty teaching related courses on data centers. The book can be used as a complementary text for traditional courses on Computer Networks, as well as innovative courses on IT Architecture, IT Service Management, IT Operations, and Data Centers.

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

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Publisher : Springer Science & Business Media
ISBN 13 : 0387329897
Total Pages : 1471 pages
Book Rating : 4.3/5 (873 download)

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Book Synopsis Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging by : Ephraim Suhir

Download or read book Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Theory and Practice of Thermal Transient Testing of Electronic Components

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Publisher : Springer Nature
ISBN 13 : 3030861740
Total Pages : 389 pages
Book Rating : 4.0/5 (38 download)

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Book Synopsis Theory and Practice of Thermal Transient Testing of Electronic Components by : Marta Rencz

Download or read book Theory and Practice of Thermal Transient Testing of Electronic Components written by Marta Rencz and published by Springer Nature. This book was released on 2023-01-23 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.

Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set)

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Author :
Publisher : World Scientific
ISBN 13 : 9814520241
Total Pages : 1397 pages
Book Rating : 4.8/5 (145 download)

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Book Synopsis Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) by :

Download or read book Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) written by and published by World Scientific. This book was released on 2014-10-23 with total page 1397 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Performance Evaluation of Complex Systems: Techniques and Tools

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Publisher : Springer
ISBN 13 : 3540457984
Total Pages : 509 pages
Book Rating : 4.5/5 (44 download)

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Book Synopsis Performance Evaluation of Complex Systems: Techniques and Tools by : Maria Carla Calzarossa

Download or read book Performance Evaluation of Complex Systems: Techniques and Tools written by Maria Carla Calzarossa and published by Springer. This book was released on 2003-08-02 with total page 509 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the tutorial lectures given by leading experts in the area at the IFIP WG 7.3 International Symposium on Computer Modeling, Measurement and Evaluation, Performance 2002, held in Rome, Italy in September 2002.The survey papers presented are devoted to theoretical and methodological advances in performance and reliability evaluation as well as new perspectives in the major application fields. Modeling and verification issues, solution methods, workload characterization, and benchmarking are addressed from the methodological point of view. Among the applications dealt with are hardware and software architectures, wired and wireless networks, grid environments, Web services, and real-time voice and video processing.This book is intended to serve as a state-of-the-art survey and reference for students, scientists, and engineers active in the area of performance and reliability evaluation.

Lead-free Electronics

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Publisher : John Wiley & Sons
ISBN 13 : 0471786179
Total Pages : 804 pages
Book Rating : 4.4/5 (717 download)

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Book Synopsis Lead-free Electronics by : Sanka Ganesan

Download or read book Lead-free Electronics written by Sanka Ganesan and published by John Wiley & Sons. This book was released on 2006-02-17 with total page 804 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.

Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set)

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Author :
Publisher : World Scientific
ISBN 13 : 9814313785
Total Pages : 1582 pages
Book Rating : 4.8/5 (143 download)

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Book Synopsis Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set) by : Avram Bar-Cohen

Download or read book Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set) written by Avram Bar-Cohen and published by World Scientific. This book was released on 2012-02-01 with total page 1582 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.

Encyclopedia Of Thermal Packaging - Set 1: Thermal Packaging Techniques (A 6-volume Set)

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Author :
Publisher : World Scientific
ISBN 13 : 9814452599
Total Pages : 1582 pages
Book Rating : 4.8/5 (144 download)

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Book Synopsis Encyclopedia Of Thermal Packaging - Set 1: Thermal Packaging Techniques (A 6-volume Set) by :

Download or read book Encyclopedia Of Thermal Packaging - Set 1: Thermal Packaging Techniques (A 6-volume Set) written by and published by World Scientific. This book was released on 2012-09-25 with total page 1582 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit Set 2: Thermal Packaging Tools and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology “building blocks” used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual “building blocks” and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These “building blocks” are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.