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Interconnections
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Download or read book Interconnections written by Radia Perlman and published by Addison-Wesley Professional. This book was released on 2000 with total page 566 pages. Available in PDF, EPUB and Kindle. Book excerpt: Perlman, a bestselling author and senior consulting engineer for Sun Microsystems, provides insight for building more robust, reliable, secure and manageable networks. Coverage also includes routing and addressing strategies, VLANs, multicasting, IPv6, and more.
Book Synopsis High-Speed VLSI Interconnections by : Ashok K. Goel
Download or read book High-Speed VLSI Interconnections written by Ashok K. Goel and published by John Wiley & Sons. This book was released on 2007-10-19 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Book Synopsis Identity Interconnections by : Aeriel A. Ashlee
Download or read book Identity Interconnections written by Aeriel A. Ashlee and published by Taylor & Francis. This book was released on 2023-07-03 with total page 116 pages. Available in PDF, EPUB and Kindle. Book excerpt: Co-published with This book advocates an approach the authors call Identity Interconnections as a way of moving considerations of identity differences and commonalities from theory to socially just action in student affairs practice.Through pursuing complex commonalities expansive enough to hold both similarities and differences, student affairs educators can ethically consider identity interconnections in such a way that does not diminish difference, but instead recognizes points of difference as opportunities for social justice action. By pursuing radical interconnectivity, student affairs educators can advance an interdependent understanding of inherited systems of power; recognizing the ways in which all systems (and thus all oppression, and all liberation) are interconnected. This interconnected insight can enable student affairs educators to extend beyond binary and oppositional thinking, and in turn, give rise to the formation of new coalitions. Finally, by listening with raw openness (allowing themselves, and encouraging their students, to be changed by others’ experiences), student affairs educators can facilitate identity development and social justice action as interrelated endeavors.The editors have heard comments like, “This is all great in theory, but how can student affairs practitioners actually apply this?” This book answers that question by providing a theoretical framework and multiple practical examples for employing identity interconnections as expansive approaches to identity development and social justice action in student affairs.
Book Synopsis A One-Semester Course in Modeling of VSLI Interconnections by : Ashok Goel
Download or read book A One-Semester Course in Modeling of VSLI Interconnections written by Ashok Goel and published by Momentum Press. This book was released on 2014-12-29 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. A One-Semester Course in Modeling of VLSI Interconnections also includes an overview of the future interconnection technologies for the nanotechnology circuits.
Book Synopsis Parallel Computing Using Optical Interconnections by : Keqin Li
Download or read book Parallel Computing Using Optical Interconnections written by Keqin Li and published by Springer Science & Business Media. This book was released on 2007-08-26 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in optical technologies have made it possible to implement optical interconnections in future massively parallel processing systems. Photons are non-charged particles, and do not naturally interact. Consequently, there are many desirable characteristics of optical interconnects, e.g. high speed (speed of light), increased fanout, high bandwidth, high reliability, longer interconnection lengths, low power requirements, and immunity to EMI with reduced crosstalk. Optics can utilize free-space interconnects as well as guided wave technology, neither of which has the problems of VLSI technology mentioned above. Optical interconnections can be built at various levels, providing chip-to-chip, module-to-module, board-to-board, and node-to-node communications. Massively parallel processing using optical interconnections poses new challenges; new system configurations need to be designed, scheduling and data communication schemes based on new resource metrics need to be investigated, algorithms for a wide variety of applications need to be developed under the novel computation models that optical interconnections permit, and so on. Parallel Computing Using Optical Interconnections is a collection of survey articles written by leading and active scientists in the area of parallel computing using optical interconnections. This is the first book which provides current and comprehensive coverage of the field, reflects the state of the art from high-level architecture design and algorithmic points of view, and points out directions for further research and development.
Book Synopsis Interconnections in the Greek Economy by : Panagiotis E. Petrakis
Download or read book Interconnections in the Greek Economy written by Panagiotis E. Petrakis and published by Springer Nature. This book was released on 2023-05-23 with total page 267 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book examines the economic interconnections of the Greek economy at a macro and micro level, allowing it to explore both the economic relations between the various sectors and the interconnections of various companies and overlaps in management boards. Two approaches are used to quantify interdisciplinary and cross-sectoral interfaces: the traditional input-output analysis approach and the “influence and information flow” approach through network analysis. The book's first part presents the current conditions and the economic interconnections within the Greek economy. In the second part, during the analysis of microeconomic interconnections between individuals and companies, a much more thorough presentation of the economic interconnections of Greek companies is established. Finally, the book’s third part presents how the Greek economy must transform its production prototype under structural constraints and opportunities for economic diversification and inclusive growth and under the pressure of economic shocks and uncertainty.
Book Synopsis Microelectronic Interconnections and Assembly by : G.G. Harman
Download or read book Microelectronic Interconnections and Assembly written by G.G. Harman and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Book Synopsis Optical Interconnections and Parallel Processing by : Pascal Berthome
Download or read book Optical Interconnections and Parallel Processing written by Pascal Berthome and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: Optical media are now widely used in the telecommunication networks, and the evolution of optical and optoelectronic technologies tends to show that their wide range of techniques could be successfully introduced in shorter-distance interconnection systems. This book bridges the existing gap between research in optical interconnects and research in high-performance computing and communication systems, of which parallel processing is just an example. It also provides a more comprehensive understanding of the advantages and limitations of optics as applied to high-speed communications. Audience: The book will be a vital resource for researchers and graduate students of optical interconnects, computer architectures and high-performance computing and communication systems who wish to understand the trends in the newest technologies, models and communication issues in the field.
Book Synopsis Electromigration in ULSI Interconnections by : Cher Ming Tan
Download or read book Electromigration in ULSI Interconnections written by Cher Ming Tan and published by World Scientific. This book was released on 2010 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electromigration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electromigration are presented in a concise and rigorous manner. Methods of numerical modeling for the interconnect electromigration and their applications to the understanding of electromigration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electromigration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electromigration are outlined and discussed.
Book Synopsis Institutional Interconnections and Cross-Boundary Cooperation in Inclusive Business by : Yoshitaka Okada
Download or read book Institutional Interconnections and Cross-Boundary Cooperation in Inclusive Business written by Yoshitaka Okada and published by Emerald Group Publishing. This book was released on 2021-11-05 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt: Institutional Interconnections and Cross-Boundary Cooperation in Inclusive Business explores the nature and characteristics of institutional interconnections in inclusive business and how these connections can be developed to help alleviate poverty through business activities in developing countries.
Book Synopsis Interconnections for Computer Communications and Packet Networks by : Roberto Rojas-Cessa
Download or read book Interconnections for Computer Communications and Packet Networks written by Roberto Rojas-Cessa and published by CRC Press. This book was released on 2016-11-03 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces different interconnection networks applied to different systems. Interconnection networks are used to communicate processing units in a multi-processor system, routers in communication networks, and servers in data centers. Queuing techniques are applied to interconnection networks to support a higher utilization of resources. There are different queuing strategies, and these determine not only the performance of the interconnection network, but also the set of requirements to make them work effectively and their cost. Routing algorithms are used to find routes to destinations and directions in what information travels. Additional properties, such as avoiding deadlocks and congestion, are sought. Effective routing algorithms need to be paired up with these networks. The book will introduce the most relevant interconnection networks, queuing strategies, and routing algorithm. It discusses their properties and how these leverage the performance of the whole interconnection system. In addition, the book covers additional topics for memory management and congestion avoidance, used to extract higher performance from the interconnection network.
Author :Electrochemical Society. Dielectric Science and Technology Division Publisher :The Electrochemical Society ISBN 13 :9781566770033 Total Pages :346 pages Book Rating :4.7/5 (7 download)
Book Synopsis Proceedings of the Symposia on Reliability of Semiconductor Devices/interconnections and Dielectric Breakdown, and Laser Process for Microelectronic Applications by : Electrochemical Society. Dielectric Science and Technology Division
Download or read book Proceedings of the Symposia on Reliability of Semiconductor Devices/interconnections and Dielectric Breakdown, and Laser Process for Microelectronic Applications written by Electrochemical Society. Dielectric Science and Technology Division and published by The Electrochemical Society. This book was released on 1992 with total page 346 pages. Available in PDF, EPUB and Kindle. Book excerpt: Papers in this volume are from the 180th ECS Meeting, held in held in Phoenix, Arizona, Fall 1991. This symposium addresses all aspects of reliability of semiconductor devices, multilevel interconnection and dielectric breakdown in VLSI and ULSI technologies. The symposium establishes reliability from design through manufacturing. The second part of the symposium addresses laser ablation/etching, laser planarization laser/UV. CVD of metal end dielectric films, laser/UV enhanced etching and deposition processesing liquid phase, and photomodification of surfaces.
Book Synopsis Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections by : Cher Ming Tan
Download or read book Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections written by Cher Ming Tan and published by Springer Science & Business Media. This book was released on 2011-03-28 with total page 152 pages. Available in PDF, EPUB and Kindle. Book excerpt: Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI interconnect reliability. Over the past two decades the application of FEMs has become widespread and continues to lead to a much better understanding of reliability physics. To help readers cope with the increasing sophistication of FEMs’ applications to interconnect reliability, Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections will: introduce the principle of FEMs; review numerical modeling of ULSI interconnect reliability; describe the physical mechanism of ULSI interconnect reliability encountered in the electronics industry; and discuss in detail the use of FEMs to understand and improve ULSI interconnect reliability from both the physical and practical perspective, incorporating the Monte Carlo method. A full-scale review of the numerical modeling methodology used in the study of interconnect reliability highlights useful and noteworthy techniques that have been developed recently. Many illustrations are used throughout the book to improve the reader’s understanding of the methodology and its verification. Actual experimental results and micrographs on ULSI interconnects are also included. Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections is a good reference for researchers who are working on interconnect reliability modeling, as well as for those who want to know more about FEMs for reliability applications. It gives readers a thorough understanding of the applications of FEM to reliability modeling and an appreciation of the strengths and weaknesses of various numerical models for interconnect reliability.
Book Synopsis CMOS-Compatible Key Engineering Devices for High-Speed Silicon-Based Optical Interconnections by : Jing Wang
Download or read book CMOS-Compatible Key Engineering Devices for High-Speed Silicon-Based Optical Interconnections written by Jing Wang and published by Springer. This book was released on 2018-11-23 with total page 199 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses some research results for CMOS-compatible silicon-based optical devices and interconnections. With accurate simulation and experimental demonstration, it provides insights on silicon-based modulation, advanced multiplexing, polarization and efficient coupling controlling technologies, which are widely used in silicon photonics. Researchers, scientists, engineers and especially students in the field of silicon photonics can benefit from the book. This book provides valuable knowledge, useful methods and practical design that can be considered in emerging silicon-based optical interconnections and communications. And it also give some guidance to student how to organize and complete an good dissertation.
Author :United States. Department of Commerce. Office of Telecommunications Publisher : ISBN 13 : Total Pages :140 pages Book Rating :4.:/5 (319 download)
Book Synopsis A Survey of Technical Requirements for Broadband Cable Teleservices: System interconnections [by] Peter M. McNanamon by : United States. Department of Commerce. Office of Telecommunications
Download or read book A Survey of Technical Requirements for Broadband Cable Teleservices: System interconnections [by] Peter M. McNanamon written by United States. Department of Commerce. Office of Telecommunications and published by . This book was released on 1973 with total page 140 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Interconnections by : Carol Faulkner
Download or read book Interconnections written by Carol Faulkner and published by Boydell & Brewer. This book was released on 2014-06 with total page 301 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explores gender and race as principal bases of identity and locations of power and oppression in American history.
Book Synopsis Work, Family, and Community by : Patricia Voydanoff
Download or read book Work, Family, and Community written by Patricia Voydanoff and published by Psychology Press. This book was released on 2014-06-03 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: Research in recent decades has proven that the seemingly disparate worlds of family life and the workplace are in fact closely intertwined. Moreover, scholars have begun to recognize the extent to which community life influences the work-family interface, for instance, the lack of fit between school hours and work hours, and assistance provided by community-based child care services. Work, Family, and Community is the first to provide a comprehensive review and analysis of the theoretical and empirical research that has examined the complex interconnections among these domains. This book integrates literature from several disciplines, including sociology, industrial-organizational and occupational health psychology, human development and family studies, management, gender studies, and social work. It documents significant patterns and trends in the economy and looks at the health of communities and neighborhoods, exploring the level of social integration, availability of community services, and the extent to which such services meet the needs of working families. Author Patricia Voydanoff takes an important step in conceptualizing the components and processes that comprise the work-family-community relationship, and provides direction for future theoretical and empirical work on the topic. This volume speaks to scholars, researchers, and students who address the theoretical, empirical, and policy-relevant issues associated with the work-family-community interface.
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