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Interconnections
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Download or read book Interconnections written by Radia Perlman and published by Addison-Wesley Professional. This book was released on 2000 with total page 566 pages. Available in PDF, EPUB and Kindle. Book excerpt: Perlman, a bestselling author and senior consulting engineer for Sun Microsystems, provides insight for building more robust, reliable, secure and manageable networks. Coverage also includes routing and addressing strategies, VLANs, multicasting, IPv6, and more.
Book Synopsis Interconnections: Interpersonal Communication Foundations and Contexts by : Jonathan M. Bowman
Download or read book Interconnections: Interpersonal Communication Foundations and Contexts written by Jonathan M. Bowman and published by Cengage Learning. This book was released on 2018-02-08 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt: With its intriguing anecdotes, current research and storytelling narrative, Bowman's INTERCONNECTIONS illustrates the relevance of interpersonal communication to readers' everyday lives. It is written specifically for readers whose lives are increasingly mediated via Instagram, Twitter and Facebook. The text integrates issues of social diversity throughout, while boxed features offer in-depth coverage of technology, diversity and ethics. It also includes self-assessment via both journal activities and research-based questionnaires to help readers analyze their own communication style--and equips them with the tools to change it, if they want. Important Notice: Media content referenced within the product description or the product text may not be available in the ebook version.
Book Synopsis A One-Semester Course in Modeling of VSLI Interconnections by : Ashok Goel
Download or read book A One-Semester Course in Modeling of VSLI Interconnections written by Ashok Goel and published by Momentum Press. This book was released on 2014-12-29 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. A One-Semester Course in Modeling of VLSI Interconnections also includes an overview of the future interconnection technologies for the nanotechnology circuits.
Book Synopsis High-Speed VLSI Interconnections by : Ashok K. Goel
Download or read book High-Speed VLSI Interconnections written by Ashok K. Goel and published by John Wiley & Sons. This book was released on 2007-10-19 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Book Synopsis Optical Interconnections and Parallel Processing by : Pascal Berthome
Download or read book Optical Interconnections and Parallel Processing written by Pascal Berthome and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: Optical media are now widely used in the telecommunication networks, and the evolution of optical and optoelectronic technologies tends to show that their wide range of techniques could be successfully introduced in shorter-distance interconnection systems. This book bridges the existing gap between research in optical interconnects and research in high-performance computing and communication systems, of which parallel processing is just an example. It also provides a more comprehensive understanding of the advantages and limitations of optics as applied to high-speed communications. Audience: The book will be a vital resource for researchers and graduate students of optical interconnects, computer architectures and high-performance computing and communication systems who wish to understand the trends in the newest technologies, models and communication issues in the field.
Book Synopsis Microelectronic Interconnections and Assembly by : G.G. Harman
Download or read book Microelectronic Interconnections and Assembly written by G.G. Harman and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Book Synopsis Electromigration in ULSI Interconnections by : Cher Ming Tan
Download or read book Electromigration in ULSI Interconnections written by Cher Ming Tan and published by World Scientific. This book was released on 2010 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electromigration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electromigration are presented in a concise and rigorous manner. Methods of numerical modeling for the interconnect electromigration and their applications to the understanding of electromigration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electromigration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electromigration are outlined and discussed.
Book Synopsis Institutional Interconnections and Cross-Boundary Cooperation in Inclusive Business by : Yoshitaka Okada
Download or read book Institutional Interconnections and Cross-Boundary Cooperation in Inclusive Business written by Yoshitaka Okada and published by Emerald Group Publishing. This book was released on 2021-11-05 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt: Institutional Interconnections and Cross-Boundary Cooperation in Inclusive Business explores the nature and characteristics of institutional interconnections in inclusive business and how these connections can be developed to help alleviate poverty through business activities in developing countries.
Book Synopsis Interconnections for Computer Communications and Packet Networks by : Roberto Rojas-Cessa
Download or read book Interconnections for Computer Communications and Packet Networks written by Roberto Rojas-Cessa and published by CRC Press. This book was released on 2016-11-03 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces different interconnection networks applied to different systems. Interconnection networks are used to communicate processing units in a multi-processor system, routers in communication networks, and servers in data centers. Queuing techniques are applied to interconnection networks to support a higher utilization of resources. There are different queuing strategies, and these determine not only the performance of the interconnection network, but also the set of requirements to make them work effectively and their cost. Routing algorithms are used to find routes to destinations and directions in what information travels. Additional properties, such as avoiding deadlocks and congestion, are sought. Effective routing algorithms need to be paired up with these networks. The book will introduce the most relevant interconnection networks, queuing strategies, and routing algorithm. It discusses their properties and how these leverage the performance of the whole interconnection system. In addition, the book covers additional topics for memory management and congestion avoidance, used to extract higher performance from the interconnection network.
Author :Electrochemical Society. Dielectric Science and Technology Division Publisher :The Electrochemical Society ISBN 13 :9781566770033 Total Pages :346 pages Book Rating :4.7/5 (7 download)
Book Synopsis Proceedings of the Symposia on Reliability of Semiconductor Devices/interconnections and Dielectric Breakdown, and Laser Process for Microelectronic Applications by : Electrochemical Society. Dielectric Science and Technology Division
Download or read book Proceedings of the Symposia on Reliability of Semiconductor Devices/interconnections and Dielectric Breakdown, and Laser Process for Microelectronic Applications written by Electrochemical Society. Dielectric Science and Technology Division and published by The Electrochemical Society. This book was released on 1992 with total page 346 pages. Available in PDF, EPUB and Kindle. Book excerpt: Papers in this volume are from the 180th ECS Meeting, held in held in Phoenix, Arizona, Fall 1991. This symposium addresses all aspects of reliability of semiconductor devices, multilevel interconnection and dielectric breakdown in VLSI and ULSI technologies. The symposium establishes reliability from design through manufacturing. The second part of the symposium addresses laser ablation/etching, laser planarization laser/UV. CVD of metal end dielectric films, laser/UV enhanced etching and deposition processesing liquid phase, and photomodification of surfaces.
Book Synopsis Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections by : Cher Ming Tan
Download or read book Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections written by Cher Ming Tan and published by Springer Science & Business Media. This book was released on 2011-03-28 with total page 154 pages. Available in PDF, EPUB and Kindle. Book excerpt: Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI interconnect reliability. Over the past two decades the application of FEMs has become widespread and continues to lead to a much better understanding of reliability physics. To help readers cope with the increasing sophistication of FEMs’ applications to interconnect reliability, Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections will: introduce the principle of FEMs; review numerical modeling of ULSI interconnect reliability; describe the physical mechanism of ULSI interconnect reliability encountered in the electronics industry; and discuss in detail the use of FEMs to understand and improve ULSI interconnect reliability from both the physical and practical perspective, incorporating the Monte Carlo method. A full-scale review of the numerical modeling methodology used in the study of interconnect reliability highlights useful and noteworthy techniques that have been developed recently. Many illustrations are used throughout the book to improve the reader’s understanding of the methodology and its verification. Actual experimental results and micrographs on ULSI interconnects are also included. Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections is a good reference for researchers who are working on interconnect reliability modeling, as well as for those who want to know more about FEMs for reliability applications. It gives readers a thorough understanding of the applications of FEM to reliability modeling and an appreciation of the strengths and weaknesses of various numerical models for interconnect reliability.
Author :United States. Department of Commerce. Office of Telecommunications Publisher : ISBN 13 : Total Pages :140 pages Book Rating :4.:/5 (319 download)
Book Synopsis A Survey of Technical Requirements for Broadband Cable Teleservices: System interconnections [by] Peter M. McNanamon by : United States. Department of Commerce. Office of Telecommunications
Download or read book A Survey of Technical Requirements for Broadband Cable Teleservices: System interconnections [by] Peter M. McNanamon written by United States. Department of Commerce. Office of Telecommunications and published by . This book was released on 1973 with total page 140 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Global Energy Interconnection by : Zhenya Liu
Download or read book Global Energy Interconnection written by Zhenya Liu and published by Academic Press. This book was released on 2015-08-28 with total page 396 pages. Available in PDF, EPUB and Kindle. Book excerpt: Global energy network is an important platform to guarantee effective exploitation of global clean energy and ensure reliable energy supply for everybody. Global Energy Interconnection analyzes the current situation and challenges of global energy development, provides the strategic thinking, overall objective, basic pattern, construction method and development mode for the development of global energy network. Based on the prediction of global energy and electricity supply and demand in the future, with the development of UHV AC/DC and smart grid technologies, this book offers new solutions to drive the safe, clean, highly efficient and sustainable development of global energy. The concept and development ideas concerning global energy interconnection in this book are based on the author's thinking of strategic issues about China's and the world's energy and electricity development for many years, especially combined with successful practices of China's UHV development. This book is particularly suitable for researchers and graduated students engaged in energy sector, as well as energy economics researchers, economists, consultants, and government energy policy makers in relevant fields. - Based on the author's many years' experience in developing Smart Grid solutions within national and international projects. - Combines both solid background information and cutting-edge technology progress, coupled with a useful and impressive list of references. - The key energy problems which are challenging us nowadays are well stated and explained in this book, which facilitates a better understanding of the development of global energy interconnection with UHV AC/DC and smart grid technologies.
Book Synopsis Work, Family, and Community by : Patricia Voydanoff
Download or read book Work, Family, and Community written by Patricia Voydanoff and published by Psychology Press. This book was released on 2014-06-03 with total page 217 pages. Available in PDF, EPUB and Kindle. Book excerpt: Research in recent decades has proven that the seemingly disparate worlds of family life and the workplace are in fact closely intertwined. Moreover, scholars have begun to recognize the extent to which community life influences the work-family interface, for instance, the lack of fit between school hours and work hours, and assistance provided by community-based child care services. Work, Family, and Community is the first to provide a comprehensive review and analysis of the theoretical and empirical research that has examined the complex interconnections among these domains. This book integrates literature from several disciplines, including sociology, industrial-organizational and occupational health psychology, human development and family studies, management, gender studies, and social work. It documents significant patterns and trends in the economy and looks at the health of communities and neighborhoods, exploring the level of social integration, availability of community services, and the extent to which such services meet the needs of working families. Author Patricia Voydanoff takes an important step in conceptualizing the components and processes that comprise the work-family-community relationship, and provides direction for future theoretical and empirical work on the topic. This volume speaks to scholars, researchers, and students who address the theoretical, empirical, and policy-relevant issues associated with the work-family-community interface.
Book Synopsis Interconnections by : Carol Faulkner
Download or read book Interconnections written by Carol Faulkner and published by Boydell & Brewer. This book was released on 2014 with total page 301 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explores gender and race as principal bases of identity and locations of power and oppression in American history. This collection builds on decades of interdisciplinary work by historians of African American women as well as scholars of feminist and critical race theory, bridging the gap between well-developed theories of race, gender, and power and the practice of historical research. It examines how racial and gender identity is constructed from individuals' lived experiences in specific historical contexts, such as westward expansion, civil rights movements, or economic depression as well as by national and transnational debates over marriage, citizenship and sexual mores. All of these essays consider multiple aspects of identity, including sexuality, class, religion, and nationality, amongothers, but the volume emphasizes gender and race as principal bases of identity and locations of power and oppression in American history. Contributors: Deborah Gray White, Michele Mitchell, Vivian May, Carol MoseleyBraun, Rashauna Johnson, Hélène Quanquin, Kendra Taira Field, Michelle Kuhl, Meredith Clark-Wiltz. Carol Faulkner is Associate Professor and Chair of History at Syracuse University. Alison M. Parker is Professor and Chairof the History Department at SUNY College at Brockport.
Book Synopsis Circuits, Interconnections, and Packaging for VLSI by : H. B. Bakoglu
Download or read book Circuits, Interconnections, and Packaging for VLSI written by H. B. Bakoglu and published by Addison Wesley Publishing Company. This book was released on 1990 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Integrated Circuit Packaging, Assembly and Interconnections by : William Greig
Download or read book Integrated Circuit Packaging, Assembly and Interconnections written by William Greig and published by Springer Science & Business Media. This book was released on 2007-04-24 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
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