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Author : G. S. Mathad
Publisher : The Electrochemical Society
ISBN 13 : 9781566772549
Total Pages : 358 pages
Book Rating : 4.7/5 (725 download)
Download or read book Interconnect and Contact Metallization for ULSI written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2000 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Robert Havemann
Publisher : Mrs Conference Proceedings
ISBN 13 :
Total Pages : 640 pages
Book Rating : 4.3/5 (91 download)
Download or read book Advanced Metallization and Interconnect Systems for ULSI Applications in 1996: Volume 12 written by Robert Havemann and published by Mrs Conference Proceedings. This book was released on 1997 with total page 640 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 0470662549
Total Pages : 616 pages
Book Rating : 4.4/5 (76 download)
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-04-02 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Author : S. P. Murarka
Publisher : Butterworth-Heinemann
ISBN 13 :
Total Pages : 268 pages
Book Rating : 4.3/5 (91 download)
Download or read book Metallization written by S. P. Murarka and published by Butterworth-Heinemann. This book was released on 1993 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: This title covers fundemental concepts, properties and applicabilities of metals and alloys for use in various metallization schemes. Metallizations form the key components on electronic circuits - controlling device properties and providing power and device interconnections with the outside world or with other devices. The recent advent of submicron dimensions and increasingly faster devices in the semiconductor have challenged researchers to keep metallization schemes in line with new demanding requirements.
Author : George J. Hefferon
Publisher :
ISBN 13 :
Total Pages : 382 pages
Book Rating : 4.:/5 (97 download)
Download or read book Interconnection and Contact Metallization for ULSI written by George J. Hefferon and published by . This book was released on 1992 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yosi Shacham-Diamand
Publisher : Springer Science & Business Media
ISBN 13 : 0387958681
Total Pages : 545 pages
Book Rating : 4.3/5 (879 download)
Download or read book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Author : Electrochemical Society. Dielectric Science and Technology Division
Publisher :
ISBN 13 :
Total Pages : 290 pages
Book Rating : 4.3/5 (91 download)
Download or read book Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I written by Electrochemical Society. Dielectric Science and Technology Division and published by . This book was released on 1999 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Krishna Shenai
Publisher : Artech House Publishers
ISBN 13 :
Total Pages : 548 pages
Book Rating : 4.3/5 (91 download)
Download or read book VLSI Metallization written by Krishna Shenai and published by Artech House Publishers. This book was released on 1991 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive collection of reprinted articles presents the most important developments on VLSI contact and interconnect technologies and applications. The book covers important developments in metallization of compound semiconductor technologies, and includes a section on metallization reliability and high speed testing.
Author : Materials Research Society. Meeting
Publisher :
ISBN 13 :
Total Pages : 624 pages
Book Rating : 4.3/5 (91 download)
Download or read book Advanced Metallization for Future ULSI: Volume 427 written by Materials Research Society. Meeting and published by . This book was released on 1996-11-08 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt: The feature sizes of microelectronic devices have entered the deep submicron regime. The process integration and structure-properties control of the multilevel metal circuitry demand an interdisciplinary interaction and understanding between manufacturing and research. To realize the vision presented in the national technology road map, material and technological challenges will need to be overcome. For example Cu conductor and its barrier metals and low-dielectric constant insulators are at issue. For materials processing, chemical-mechanical planarization and low-temperature filling of high-aspect ratio vias are challenges. For materials examination, the metrology of submicron structures is nontrivial and for materials reliability, the interplay among multiple driving forces and the response in small-dimension microstructures are intriguing. These issues are the focus of this book from MRS. Topics include: road map, technology and metrology of submicron device structures; reliability issues for Cu metallization; Al interconnects and vias; barrier metal; interlevel low-K dielectrics and contact to Si and compound semiconductors.
Author : Terry O. Herndon
Publisher :
ISBN 13 : 9781566770071
Total Pages : pages
Book Rating : 4.7/5 (7 download)
Download or read book Interconnection and Contact Metallization for ULSI written by Terry O. Herndon and published by . This book was released on 1992 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
![Download Proceedings of the Symposia on Patterning Science and Technology II [and] Interconnection and Contact Metallization for ULSI PDF Online Free](https://books.google.com/books/content/images/frontcover/kfZKqK6ouj0C?fife=w200-h370)
Author : Wayne Greene
Publisher :
ISBN 13 :
Total Pages : 400 pages
Book Rating : 4.:/5 (319 download)
Download or read book Proceedings of the Symposia on Patterning Science and Technology II [and] Interconnection and Contact Metallization for ULSI written by Wayne Greene and published by . This book was released on 1992 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : T. O. Herndon
Publisher :
ISBN 13 :
Total Pages : 520 pages
Book Rating : 4.:/5 (2 download)
Download or read book Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, and Thin Insulator Materials written by T. O. Herndon and published by . This book was released on 1993 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : P. C. Andricacos
Publisher :
ISBN 13 :
Total Pages : 274 pages
Book Rating : 4.:/5 (841 download)
Download or read book Electrochemical Processing in ULSI Fabrication I and Interconnect and Contact Metallization written by P. C. Andricacos and published by . This book was released on 1999 with total page 274 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Robin Cheung
Publisher : Materials Research Society
ISBN 13 : 9781558994126
Total Pages : 765 pages
Book Rating : 4.9/5 (941 download)
Download or read book Advanced Metallization and Interconnect Systems for ULSI Applications in 1997: written by Robin Cheung and published by Materials Research Society. This book was released on 2000-02-01 with total page 765 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Harzara S. Rathore
Publisher : The Electrochemical Society
ISBN 13 : 9781566771849
Total Pages : 292 pages
Book Rating : 4.7/5 (718 download)
Download or read book Proceedings of the Symposium on Interconnect and Contact Metallization written by Harzara S. Rathore and published by The Electrochemical Society. This book was released on 1998 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Russell C. Ellwanger
Publisher : Materials Research Society
ISBN 13 : 9781558993419
Total Pages : 767 pages
Book Rating : 4.9/5 (934 download)
Download or read book Advanced Metallization and Interconnect Systems for ULSI Applications in 1995: written by Russell C. Ellwanger and published by Materials Research Society. This book was released on 2000-02-01 with total page 767 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Syd R. Wilson
Publisher : William Andrew
ISBN 13 :
Total Pages : 922 pages
Book Rating : 4.3/5 (91 download)
Download or read book Handbook of Multilevel Metallization for Integrated Circuits written by Syd R. Wilson and published by William Andrew. This book was released on 1993 with total page 922 pages. Available in PDF, EPUB and Kindle. Book excerpt: It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These teams must view multilevel metallization as a system rather than a collection of isolated process modules.
