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Thermal Design Of Electronic Equipment
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Book Synopsis Thermal Design of Electronic Equipment by : Ralph Remsburg
Download or read book Thermal Design of Electronic Equipment written by Ralph Remsburg and published by CRC Press. This book was released on 2017-12-19 with total page 395 pages. Available in PDF, EPUB and Kindle. Book excerpt: In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Book Synopsis Advanced Thermal Design of Electronic Equipment by : Ralph Remsburg
Download or read book Advanced Thermal Design of Electronic Equipment written by Ralph Remsburg and published by Springer Science & Business Media. This book was released on 2011-06-27 with total page 589 pages. Available in PDF, EPUB and Kindle. Book excerpt: The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli cation of advanced thermal management techniques requires a background in fluid dynamics.
Book Synopsis Cooling of Electronic Systems by : Sadik Kakaç
Download or read book Cooling of Electronic Systems written by Sadik Kakaç and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 953 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Book Synopsis Practical Thermal Design for Electronic Equipment by : Sung Jin Kim
Download or read book Practical Thermal Design for Electronic Equipment written by Sung Jin Kim and published by CRC Press. This book was released on 1998-01-01 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: Very Large Scale Integration (VLSI) technology has raised significant considerations of thermal control. This practical reference for thermal and design engineers addresses topics related to thermal cooling of electronic equipment. The text includes numerous examples and calculations from engineering applications and provides design guides for packaging and thermal engineers. It also examines the advancement of technologies in the electronic industry and addresses such questions as: what is the life expectancy of an air moving device?; how does one thermally characterize an electronic component?; how does one choose and optimize heat sink?; and what are the limitations of numerical simulation tools?
Download or read book Heat Transfer written by Younes Shabany and published by CRC Press. This book was released on 2009-12-17 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Book Synopsis Thermal Management of Microelectronic Equipment by : Lian-Tuu Yeh
Download or read book Thermal Management of Microelectronic Equipment written by Lian-Tuu Yeh and published by Asme Press Book Series on Elec. This book was released on 2002 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
Book Synopsis Air Cooling Technology for Electronic Equipment by : Sung Jin Kim
Download or read book Air Cooling Technology for Electronic Equipment written by Sung Jin Kim and published by CRC Press. This book was released on 2020-07-24 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
Book Synopsis Cooling of Electronic Equipment by : Allan W. Scott
Download or read book Cooling of Electronic Equipment written by Allan W. Scott and published by Wiley-Interscience. This book was released on 1974 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Design and Analysis of Heat Sinks by : Allan D. Kraus
Download or read book Design and Analysis of Heat Sinks written by Allan D. Kraus and published by Wiley-Interscience. This book was released on 1995-10-03 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: A powerful methodology for producing superior thermal performance at low cost with minimum added mass . . . Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost-effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities. Other topics covered include: Fundamentals of heat transfer Thermal modeling of electronic packages Mathematical tools for heat-sink analysis and design Prevailing thermal transport processes Models for a variety of fin geometries Simple "transfer function" relations for single fin, cascaded fin, and fin array heat sinks Thermal characterization and optimization of plate-fin heat sinks Completely self-contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering.
Book Synopsis Heat Transfer Equipment Design by : R. K. Shah
Download or read book Heat Transfer Equipment Design written by R. K. Shah and published by CRC Press. This book was released on 1988-07-01 with total page 1104 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Thermal System Design and Simulation by : P.L. Dhar
Download or read book Thermal System Design and Simulation written by P.L. Dhar and published by Academic Press. This book was released on 2016-10-25 with total page 620 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal System Design and Simulation covers the fundamental analyses of thermal energy systems that enable users to effectively formulate their own simulation and optimal design procedures. This reference provides thorough guidance on how to formulate optimal design constraints and develop strategies to solve them with minimal computational effort. The book uniquely illustrates the methodology of combining information flow diagrams to simplify system simulation procedures needed in optimal design. It also includes a comprehensive presentation on dynamics of thermal systems and the control systems needed to ensure safe operation at varying loads. Designed to give readers the skills to develop their own customized software for simulating and designing thermal systems, this book is relevant for anyone interested in obtaining an advanced knowledge of thermal system analysis and design. Contains detailed models of simulation for equipment in the most commonly used thermal engineering systems Features illustrations for the methodology of using information flow diagrams to simplify system simulation procedures Includes comprehensive global case studies of simulation and optimization of thermal systems
Book Synopsis Cooling Techniques for Electronic Equipment by : Dave S. Steinberg
Download or read book Cooling Techniques for Electronic Equipment written by Dave S. Steinberg and published by Wiley-Interscience. This book was released on 1991-10-22 with total page 518 pages. Available in PDF, EPUB and Kindle. Book excerpt: Details infallible techniques for designing electronic hardware to withstand severe thermal environments. Using both SI and English units throughout, it presents methods for the development of various reliable electronic systems without the need of high-speed computers. It also offers mathematical modeling applications, using analog resistor networks, to provide the breakup of complex systems into numerous individual thermal resistors and nodes for those who prefer high-speed digital computer solutions to thermal problems.
Book Synopsis Thermal Management of Electronic Systems by : C.J. Hoogendoorn
Download or read book Thermal Management of Electronic Systems written by C.J. Hoogendoorn and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 334 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.
Book Synopsis Thermal Computations for Electronics by : Gordon Ellison
Download or read book Thermal Computations for Electronics written by Gordon Ellison and published by CRC Press. This book was released on 2010-11-08 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: A total revision of the author’s previous work, Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling is a versatile reference that was carefully designed to help readers master mathematical calculation, prediction, and application methods for conductive, radiative, and convective heat transfer in electronic equipment. Presenting material in a way that is practical and useful to engineers and scientists, as well as engineering students, this book provides very detailed text examples and their solutions. This approach helps users at all levels of comprehension to strengthen their grasp of the subject and detect their own calculation errors. The beginning of this book is largely devoted to prediction of airflow and well-mixed air temperatures in systems and heat sinks, after which it explores convective heat transfer from heat sinks, circuit boards, and components. Applying a systematic presentation of information to enhance understanding and computational practice, this book: Provides complete mathematical derivations and supplements formulae with design plots Offers complete exercise solutions (MathcadTM worksheets and PDF images of Mathcad worksheets), lecture aids (landscape-formatted PDF files), and text-example Mathcad worksheets for professors adopting this book Addresses topics such as methods for multi-surface radiation exchange, conductive heat transfer in electronics, and finite element theory with a variational calculus method explained for heat conduction Presents mathematical descriptions of large thermal network problem formulation Discusses comprehensive thermal spreading resistance theory, and includes steady-state and time-dependent problems This reference is useful as a professional resource and also ideal for use in a complete course on the subject of electronics cooling, with its suggested course schedule and other helpful advice for instructors. Selected sections may be used as application examples in a traditional heat transfer course or to help professionals improve practical computational applications.
Book Synopsis High Temperature Electronics by : F. Patrick McCluskey
Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 2018-05-04 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Book Synopsis Design Manual of Natural Methods of Cooling Electronic Equipment by : James P. Welsh
Download or read book Design Manual of Natural Methods of Cooling Electronic Equipment written by James P. Welsh and published by . This book was released on 1962 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Design Manual of Natural Methods of Cooling Electronic Equipment by : United States. Ships Bureau
Download or read book Design Manual of Natural Methods of Cooling Electronic Equipment written by United States. Ships Bureau and published by . This book was released on 1962 with total page 208 pages. Available in PDF, EPUB and Kindle. Book excerpt:
