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Download Effectiveness Of Conformal Coatings On A Plastic Ball Grid Array Pbga Package For Protection Against Moisture Induced Failures full books in PDF, epub, and Kindle. Read online Effectiveness Of Conformal Coatings On A Plastic Ball Grid Array Pbga Package For Protection Against Moisture Induced Failures ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Author :
Publisher :
ISBN 13 :
Total Pages : 1860 pages
Book Rating : 4.3/5 (243 download)
Download or read book Electrical & Electronics Abstracts written by and published by . This book was released on 1997 with total page 1860 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Louis T. Manzione
Publisher : Van Nostrand Reinhold Company
ISBN 13 :
Total Pages : 408 pages
Book Rating : 4.3/5 (91 download)
Download or read book Plastic Packaging of Microelectronic Devices written by Louis T. Manzione and published by Van Nostrand Reinhold Company. This book was released on 1990 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 974 pages
Book Rating : 4.3/5 (194 download)
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author : P. Singh
Publisher : Springer Science & Business Media
ISBN 13 : 9780412105913
Total Pages : 398 pages
Book Rating : 4.1/5 (59 download)
Download or read book Failure Modes and Mechanisms in Electronic Packages written by P. Singh and published by Springer Science & Business Media. This book was released on 1997-11-30 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Author : Ning-Cheng Lee
Publisher : Newnes
ISBN 13 : 0750672188
Total Pages : 282 pages
Book Rating : 4.7/5 (56 download)
Download or read book Reflow Soldering Processes written by Ning-Cheng Lee and published by Newnes. This book was released on 2002-01-11 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Author : Joseph Fjelstad
Publisher : J C Fjelstad & Associates
ISBN 13 : 9780966707502
Total Pages : 217 pages
Book Rating : 4.7/5 (75 download)
Download or read book Flexible Circuit Technology written by Joseph Fjelstad and published by J C Fjelstad & Associates. This book was released on 1998 with total page 217 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explains the design, fabrication and assembly of flexible circuits, and how, when and why they are best used. The second edition is expanded with new ways flexible circuits are being used to solve complex electronic packaging problems. Annotation c. Book News, Inc., Portland, OR (booknews.com).
Author : Dorland
Publisher : Elsevier Health Sciences
ISBN 13 : 0323442544
Total Pages : 481 pages
Book Rating : 4.3/5 (234 download)
Download or read book Dorland's Dictionary of Medical Acronyms and Abbreviations written by Dorland and published by Elsevier Health Sciences. This book was released on 2015-07-24 with total page 481 pages. Available in PDF, EPUB and Kindle. Book excerpt: Medical acronyms and abbreviations offer convenience, but those countless shortcuts can often be confusing. Now a part of the popular Dorland's suite of products, this reference features thousands of terms from across various medical specialties. Its alphabetical arrangement makes for quick reference, and expanded coverage of symbols ensures they are easier to find. Effective communication plays an important role in all medical settings, so turn to this trusted volume for nearly any medical abbreviation you might encounter. - Symbols section makes it easier to locate unusual or seldom-used symbols. - Convenient alphabetical format allows you to find the entry you need more intuitively. - More than 90,000 entries and definitions. - Many new and updated entries including terminology in expanding specialties, such as Nursing; Physical, Occupational, and Speech Therapies; Transcription and Coding; Computer and Technical Fields. - New section on abbreviations to avoid, including Joint Commission abbreviations that are not to be used. - Incorporates updates suggested by the Institute for Safe Medication Practices (ISMP).
Author : Ho-Ming Tong
Publisher : Springer Science & Business Media
ISBN 13 : 1441957685
Total Pages : 562 pages
Book Rating : 4.4/5 (419 download)
Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Author : Tae-Kyu Lee
Publisher : Springer
ISBN 13 : 1461492661
Total Pages : 266 pages
Book Rating : 4.4/5 (614 download)
Download or read book Fundamentals of Lead-Free Solder Interconnect Technology written by Tae-Kyu Lee and published by Springer. This book was released on 2014-11-05 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Author : American Welding Society. Committee on Brazing and Soldering
Publisher :
ISBN 13 :
Total Pages : 192 pages
Book Rating : 4.E/5 ( download)
Download or read book Soldering Manual written by American Welding Society. Committee on Brazing and Soldering and published by . This book was released on 1959 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : James J. Licari
Publisher : William Andrew
ISBN 13 : 1437778909
Total Pages : 415 pages
Book Rating : 4.4/5 (377 download)
Download or read book Adhesives Technology for Electronic Applications written by James J. Licari and published by William Andrew. This book was released on 2011-06-24 with total page 415 pages. Available in PDF, EPUB and Kindle. Book excerpt: Approx.512 pagesApprox.512 pages
Author : Marius Bazu
Publisher : John Wiley & Sons
ISBN 13 : 1119990009
Total Pages : 372 pages
Book Rating : 4.1/5 (199 download)
Download or read book Failure Analysis written by Marius Bazu and published by John Wiley & Sons. This book was released on 2011-03-08 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Author : Andrew Huang
Publisher : Penguin Random House LLC (No Starch)
ISBN 13 : 9781593270292
Total Pages : 292 pages
Book Rating : 4.2/5 (72 download)
Download or read book Hacking the Xbox written by Andrew Huang and published by Penguin Random House LLC (No Starch). This book was released on 2003 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides step-by-step instructions on basic hacking techniques and reverse engineering skills along with information on Xbox security, hardware, and software.
Author : Kim S. Siow
Publisher : Springer
ISBN 13 : 3319992562
Total Pages : 292 pages
Book Rating : 4.3/5 (199 download)
Download or read book Die-Attach Materials for High Temperature Applications in Microelectronics Packaging written by Kim S. Siow and published by Springer. This book was released on 2019-01-29 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Author : Guang-Zhong Yang
Publisher : Springer
ISBN 13 : 331969748X
Total Pages : 649 pages
Book Rating : 4.3/5 (196 download)
Download or read book Implantable Sensors and Systems written by Guang-Zhong Yang and published by Springer. This book was released on 2018-03-27 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Implantable sensing, whether used for transient or long-term monitoring of in vivo physiological, bio-electrical, bio-chemical and metabolic changes, is a rapidly advancing field of research and development. Underpinned by increasingly small, smart and energy efficient designs, they become an integral part of surgical prostheses or implants for both acute and chronic conditions, supporting optimised, context aware sensing, feedback, or stimulation with due consideration of system level impact. From sensor design, fabrication, on-node processing with application specific integrated circuits, to power optimisation, wireless data paths and security, this book provides a detailed explanation of both the theories and practical considerations of developing novel implantable sensors. Other topics covered by the book include sensor embodiment and flexible electronics, implantable optical sensors and power harvesting. Implantable Sensors and Systems – from Theory to Practice is an important reference for those working in the field of medical devices. The structure of the book is carefully prepared so that it can also be used as an introductory reference for those about to enter into this exciting research and developing field.
Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811613761
Total Pages : 513 pages
Book Rating : 4.8/5 (116 download)
Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Author : Daniel Filippini
Publisher : Springer Science & Business Media
ISBN 13 : 3642346480
Total Pages : 429 pages
Book Rating : 4.6/5 (423 download)
Download or read book Autonomous Sensor Networks written by Daniel Filippini and published by Springer Science & Business Media. This book was released on 2012-11-27 with total page 429 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume surveys recent research on autonomous sensor networks from the perspective of enabling technologies that support medical, environmental and military applications. State of the art, as well as emerging concepts in wireless sensor networks, body area networks and ambient assisted living introduce the reader to the field, while subsequent chapters deal in depth with established and related technologies, which render their implementation possible. These range from smart textiles and printed electronic devices to implanted devices and specialized packaging, including the most relevant technological features. The last four chapters are devoted to customization, implementation difficulties and outlook for these technologies in specific applications.
