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Author : Karl H. Dietz
Publisher :
ISBN 13 : 9780901150394
Total Pages : 432 pages
Book Rating : 4.1/5 (53 download)
Download or read book Dry Film Photoresist Processing Technology written by Karl H. Dietz and published by . This book was released on 2001 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Sulaiman Khalifeh
Publisher : Elsevier
ISBN 13 : 192788568X
Total Pages : 617 pages
Book Rating : 4.9/5 (278 download)
Download or read book Polymers in Organic Electronics written by Sulaiman Khalifeh and published by Elsevier. This book was released on 2020-04-01 with total page 617 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system.Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers Covers the most common electrical, electronic, and optical properties of electronic polymers Describes the underlying theories on the mechanics of polymer conductivity Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components
Author : Kapil Gupta
Publisher : Springer
ISBN 13 : 3319688014
Total Pages : 195 pages
Book Rating : 4.3/5 (196 download)
Download or read book Micro and Precision Manufacturing written by Kapil Gupta and published by Springer. This book was released on 2017-10-15 with total page 195 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides details on various micro and precision manufacturing and finishing operations performed by conventional and advanced processes, including micro-manufacturing of micro-tools and precision finishing of engineered components. It describes the process mechanism, principles and parameters while performing micro-fabrication and precision finishing operations. The text provides the readers with knowledge of micro and precision manufacturing and encourages them to explore the future venues in this field.
Author : Zhang Lin
Publisher : Trans Tech Publications Ltd
ISBN 13 : 3038267120
Total Pages : 5360 pages
Book Rating : 4.0/5 (382 download)
Download or read book Manufacturing Technology, Electronics, Computer and Information Technology Applications written by Zhang Lin and published by Trans Tech Publications Ltd. This book was released on 2014-11-27 with total page 5360 pages. Available in PDF, EPUB and Kindle. Book excerpt: Collection of selected, peer reviewed papers from the 2014 International Conference on Manufacturing Technology and Electronics Applications (ICMTEA 2014), November 8-9, 2014, Taiyuan, Shanxi, China. The 1181 papers are grouped as follows: Chapter 1: Researching and Designing in Mechanical Engineering, Mechatronics, Automation and Control, Chapter 2: Measurement and Instrumentation, Monitoring, Testing and Detection Technologies, Chapter 3: Numerical Methods, Computation Methods and Algorithms for Modeling, Simulation and Optimization, Data Mining and Data Processing, Chapter 4: Information Technologies, WEB and Networks Engineering, Information Security, Software Application and Development, E-Applications, Chapter 5: Electronics and Microelectronics, Embedded and Integrated Systems, Smart Grids, Power and Energy, Electric and Magnetic Systems, Chapter 6: Communication, Signal and Image Processing, Data Acquisition, Identification and Recognition Technologies, Chapter 7: Materials Science and Applications, Chapter 8: Advanced Information and Innovative Technologies for Management, Logistics, Economics, Marketing, Assessment.
Author :
Publisher : World Scientific
ISBN 13 : 9810530005
Total Pages : 548 pages
Book Rating : 4.8/5 (15 download)
Download or read book Processing and Fabrication of Advanced Materials XIII written by and published by World Scientific. This book was released on 2005 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : G.G. Harman
Publisher : Springer Science & Business Media
ISBN 13 : 9401151350
Total Pages : 295 pages
Book Rating : 4.4/5 (11 download)
Download or read book Microelectronic Interconnections and Assembly written by G.G. Harman and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Author : J.A. Chilton
Publisher : Springer Science & Business Media
ISBN 13 : 9401105693
Total Pages : 351 pages
Book Rating : 4.4/5 (11 download)
Download or read book Special Polymers for Electronics and Optoelectronics written by J.A. Chilton and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Commercially successful fully synthetic polymeric materials were pro duced in the early years of this century, the first example being Bakelite. This was made from phenol and formaldehyde by Leo Bakeland in 1909. Before the end of the 1920s, a large number of other synthetic polymers had been created, including polyvinyl chloride and urea-formaldehyde. Today, there are literally hundreds of synthetic polymers commercially available with ranges of properties making them suitable for applications in many industrial sectors, including the electrical and electronics industries. In many instances the driving force behind the development of new materials actually came from the electronics industry, and today's advanced electronics would be inconceivable without these materials. For many years polymers have been widely used in all sectors of the electronics industry. From the early days of the semiconductor industry to the current state of the art, polymers have provided the enabling technologies that have fuelled the inexorable and rapid development of advanced electronic and optoelectronic devices.
Author :
Publisher : ASM International
ISBN 13 : 1615038507
Total Pages : 479 pages
Book Rating : 4.6/5 (15 download)
Download or read book ISTFA 2011 written by and published by ASM International. This book was released on 2011 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Marco Aurelio Dos Santos Bernardes
Publisher : BoD – Books on Demand
ISBN 13 : 9533074809
Total Pages : 746 pages
Book Rating : 4.5/5 (33 download)
Download or read book Biofuel's Engineering Process Technology written by Marco Aurelio Dos Santos Bernardes and published by BoD – Books on Demand. This book was released on 2011-08-01 with total page 746 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aspires to be a comprehensive summary of current biofuels issues and thereby contribute to the understanding of this important topic. Readers will find themes including biofuels development efforts, their implications for the food industry, current and future biofuels crops, the successful Brazilian ethanol program, insights of the first, second, third and fourth biofuel generations, advanced biofuel production techniques, related waste treatment, emissions and environmental impacts, water consumption, produced allergens and toxins. Additionally, the biofuel policy discussion is expected to be continuing in the foreseeable future and the reading of the biofuels features dealt with in this book, are recommended for anyone interested in understanding this diverse and developing theme.
Author : United States International Trade Commission
Publisher :
ISBN 13 :
Total Pages : 122 pages
Book Rating : 4.3/5 ( download)
Download or read book Dry Film Photoresist from Japan written by United States International Trade Commission and published by . This book was released on 1993 with total page 122 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Philip Garrou
Publisher : John Wiley & Sons
ISBN 13 : 3527334661
Total Pages : 484 pages
Book Rating : 4.5/5 (273 download)
Download or read book Handbook of 3D Integration, Volume 3 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2014-07-21 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
Author :
Publisher :
ISBN 13 :
Total Pages : 1306 pages
Book Rating : 4.:/5 (31 download)
Download or read book Proceedings written by and published by . This book was released on 1999 with total page 1306 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Tadahiro Ohmi
Publisher : CRC Press
ISBN 13 : 1420026860
Total Pages : 400 pages
Book Rating : 4.4/5 (2 download)
Download or read book Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing written by Tadahiro Ohmi and published by CRC Press. This book was released on 2018-10-03 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: As science pushes closer toward the atomic size scale, new challenges arise to slow the pace of the miniaturization that has transformed our society and fueled the information age. New technologies are necessary to surpass these obstacles and realize the tremendous growth predicted by Moore's law. Assembled from the works of pioneering researchers, Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing presents new developments and technologies for producing the next generation of electronic circuits and displays. This book introduces radical-reaction-based semiconductor manufacturing technologies that overcome the limitations of the existing molecule-reaction-based technologies. It systematically details the procedures and underlying concepts involved in wet process technologies and applications. Following an introduction to semiconductor surface chemical electronics, expert contributors discuss the principles and technology of high-performance wet cleaning; etching technologies and processes; antistatic technology; wet vapor resist stripping technology; and process and safety technologies including waste reclamation, chemical composition control, and ultrapure water and liquid chemical supply systems and materials for fluctuation-free facilities. Currently, large production runs are needed to balance the costs of acquiring and tuning equipment for specialized operating conditions. Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing explains the technologies and processes used to meet the demand for variety and low volumes that exists in today's digital electronics marketplace.
Author : Peter J. Hesketh
Publisher : The Electrochemical Society
ISBN 13 : 1566775108
Total Pages : 517 pages
Book Rating : 4.5/5 (667 download)
Download or read book Chemical Sensors 7 -and- MEMS/NEMS 7 written by Peter J. Hesketh and published by The Electrochemical Society. This book was released on 2006 with total page 517 pages. Available in PDF, EPUB and Kindle. Book excerpt: The latest developments in chemical and biological sensor research and development. Topics include: 1. new selective species recognition surfaces and materials; 2. molecular recognition materials and approaches to minimize non-specific binding; 3. semi-selective species recognition materials; 4. novel methods for signal processing, signal amplification, and detection; 5. detection systems for multiple analytes in complex samples; 6. sensor arrays; and 7. analytical systems and approaches.
Author : Haleh Ardebili
Publisher : William Andrew
ISBN 13 : 0128119799
Total Pages : 508 pages
Book Rating : 4.1/5 (281 download)
Download or read book Encapsulation Technologies for Electronic Applications written by Haleh Ardebili and published by William Andrew. This book was released on 2018-10-23 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them
Author :
Publisher :
ISBN 13 :
Total Pages : 1008 pages
Book Rating : 4.:/5 (318 download)
Download or read book Proceedings of the Technical Program written by and published by . This book was released on 1990 with total page 1008 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : William Greig
Publisher : Springer Science & Business Media
ISBN 13 : 0387339132
Total Pages : 312 pages
Book Rating : 4.3/5 (873 download)
Download or read book Integrated Circuit Packaging, Assembly and Interconnections written by William Greig and published by Springer Science & Business Media. This book was released on 2007-04-24 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
