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Author :
Publisher : ASM International
ISBN 13 : 1615038507
Total Pages : 479 pages
Book Rating : 4.6/5 (15 download)
Download or read book ISTFA 2011 written by and published by ASM International. This book was released on 2011 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : ASM International
ISBN 13 : 1615037276
Total Pages : 487 pages
Book Rating : 4.6/5 (15 download)
Download or read book ISTFA 2010 written by and published by ASM International. This book was released on 2010-01-01 with total page 487 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : ASM International
ISBN 13 : 1627080228
Total Pages : 634 pages
Book Rating : 4.6/5 (27 download)
Download or read book ISTFA 2013 written by and published by ASM International. This book was released on 2013 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.
Author : ASM International
Publisher : ASM International
ISBN 13 : 1615039953
Total Pages : 643 pages
Book Rating : 4.6/5 (15 download)
Download or read book ISTFA 2012 written by ASM International and published by ASM International. This book was released on 2012 with total page 643 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : ASM International
ISBN 13 : 1627080740
Total Pages : 562 pages
Book Rating : 4.6/5 (27 download)
Download or read book ISTFA 2014 written by and published by ASM International. This book was released on 2014-11-01 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
Author :
Publisher : ASM International
ISBN 13 : 1627081518
Total Pages : pages
Book Rating : 4.6/5 (27 download)
Download or read book ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis written by and published by ASM International. This book was released on 2017-12-01 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Author :
Publisher : ASM International
ISBN 13 : 1627082735
Total Pages : 540 pages
Book Rating : 4.6/5 (27 download)
Download or read book ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis written by and published by ASM International. This book was released on 2019-12-01 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author :
Publisher : ASM International
ISBN 13 : 1627080996
Total Pages : pages
Book Rating : 4.6/5 (27 download)
Download or read book ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis written by and published by ASM International. This book was released on 2018-12-01 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Author : ASM. International
Publisher :
ISBN 13 : 9781615038268
Total Pages : 478 pages
Book Rating : 4.0/5 (382 download)
Download or read book ISTFA 2011 written by ASM. International and published by . This book was released on 2010 with total page 478 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Tejinder Gandhi
Publisher : ASM International
ISBN 13 : 1627082468
Total Pages : 750 pages
Book Rating : 4.6/5 (27 download)
Download or read book Microelectronics Fialure Analysis Desk Reference, Seventh Edition written by Tejinder Gandhi and published by ASM International. This book was released on 2019-11-01 with total page 750 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Author : Farimah Farahmandi
Publisher : Springer Nature
ISBN 13 : 3031268962
Total Pages : 415 pages
Book Rating : 4.0/5 (312 download)
Download or read book CAD for Hardware Security written by Farimah Farahmandi and published by Springer Nature. This book was released on 2023-05-11 with total page 415 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an overview of current hardware security problems and highlights how these issues can be efficiently addressed using computer-aided design (CAD) tools. Authors are from CAD developers, IP developers, SOC designers as well as SoC verification experts. Readers will gain a comprehensive understanding of SoC security vulnerabilities and how to overcome them, through an efficient combination of proactive countermeasures and a wide variety of CAD solutions.
Author : Abdelkhalak El Hami
Publisher : Elsevier
ISBN 13 : 0081004699
Total Pages : 272 pages
Book Rating : 4.0/5 (81 download)
Download or read book Embedded Mechatronic Systems, Volume 2 written by Abdelkhalak El Hami and published by Elsevier. This book was released on 2015-07-16 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: In operation, mechatronics embedded systems are stressed by loads of different causes: climate (temperature, humidity), vibration, electrical and electromagnetic. These stresses in components induce failure mechanisms should be identified and modeled for better control. AUDACE is a collaborative project of the cluster Mov'eo that address issues specific to mechatronic reliability embedded systems. AUDACE means analyzing the causes of failure of components of mechatronic systems onboard. The goal of the project is to optimize the design of mechatronic devices by reliability. The project brings together public sector laboratories that have expertise in analysis and modeling of failure, major groups of mechatronics (Valeo and Thales) in the automotive and aerospace and small and medium enterprises that have skills in characterization and validation tests. Find and develop ways to characterize and validate the design robustness and reliability of complex mechatronic devices Develop ways to characterize physical and chemical phenomena, Identify mechanisms of failure of components of these devices, Analyze the physical and / or chemical mechanisms of failure, in order of importance To model failure mechanisms and design optimization.
Author :
Publisher :
ISBN 13 : 9780615038261
Total Pages : 0 pages
Book Rating : 4.0/5 (382 download)
Download or read book ISTFA 2011 written by and published by . This book was released on 2011 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Abdelkhalak El Hami
Publisher : Elsevier
ISBN 13 : 0081019564
Total Pages : 300 pages
Book Rating : 4.0/5 (81 download)
Download or read book Embedded Mechatronic Systems 2 written by Abdelkhalak El Hami and published by Elsevier. This book was released on 2020-02-28 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: Embedded Mechatronic Systems 2: Analysis of Failures, Modeling, Simulation and Optimization presents advances in research within the field of mechatronic systems, which integrates reliability into the design process. Providing many detailed examples, this book develops a characterization methodology for faults in mechatronic systems. It analyzes the multi-physical modeling of faults, revealing weaknesses in design and failure mechanisms. This development of meta-models enables us to simulate effects on the reliability of conditions of use and manufacture. Provides many detailed examples Develops a characterization methodology for faults in mechatronic systems Analyzes the multi-physical modeling of faults, revealing weaknesses in design and failure mechanisms
Author : Yan Li
Publisher : Springer
ISBN 13 : 3319445863
Total Pages : 463 pages
Book Rating : 4.3/5 (194 download)
Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer. This book was released on 2017-01-20 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Author : Patrick Girard
Publisher : Springer Nature
ISBN 13 : 3031196392
Total Pages : 320 pages
Book Rating : 4.0/5 (311 download)
Download or read book Machine Learning Support for Fault Diagnosis of System-on-Chip written by Patrick Girard and published by Springer Nature. This book was released on 2023-03-13 with total page 320 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a state-of-the-art guide to Machine Learning (ML)-based techniques that have been shown to be highly efficient for diagnosis of failures in electronic circuits and systems. The methods discussed can be used for volume diagnosis after manufacturing or for diagnosis of customer returns. Readers will be enabled to deal with huge amount of insightful test data that cannot be exploited otherwise in an efficient, timely manner. After some background on fault diagnosis and machine learning, the authors explain and apply optimized techniques from the ML domain to solve the fault diagnosis problem in the realm of electronic system design and manufacturing. These techniques can be used for failure isolation in logic or analog circuits, board-level fault diagnosis, or even wafer-level failure cluster identification. Evaluation metrics as well as industrial case studies are used to emphasize the usefulness and benefits of using ML-based diagnosis techniques.
Author : Stanley T. Peters
Publisher : ASM International
ISBN 13 : 1615038523
Total Pages : 175 pages
Book Rating : 4.6/5 (15 download)
Download or read book Composite Filament Winding written by Stanley T. Peters and published by ASM International. This book was released on 2011-01-01 with total page 175 pages. Available in PDF, EPUB and Kindle. Book excerpt: Printbegrænsninger: Der kan printes 10 sider ad gangen og max. 40 sider pr. session
