Chiplet Design And Heterogeneous Integration Packaging

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Chiplet Design and Heterogeneous Integration Packaging

Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811999171
Total Pages : 542 pages
Book Rating : 4.8/5 (119 download)

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Book Synopsis Chiplet Design and Heterogeneous Integration Packaging by : John H. Lau

Download or read book Chiplet Design and Heterogeneous Integration Packaging written by John H. Lau and published by Springer Nature. This book was released on 2023-03-27 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9819721407
Total Pages : 515 pages
Book Rating : 4.8/5 (197 download)

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Book Synopsis Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology by : John H. Lau

Download or read book Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology written by John H. Lau and published by Springer Nature. This book was released on with total page 515 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Semiconductor Advanced Packaging

Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811613761
Total Pages : 513 pages
Book Rating : 4.8/5 (116 download)

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Book Synopsis Semiconductor Advanced Packaging by : John H. Lau

Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Heterogeneous Integrations

Author : John H. Lau
Publisher : Springer
ISBN 13 : 9811372241
Total Pages : 368 pages
Book Rating : 4.8/5 (113 download)

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Book Synopsis Heterogeneous Integrations by : John H. Lau

Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Author : John H. Lau
Publisher : Springer
ISBN 13 : 9789819721399
Total Pages : 0 pages
Book Rating : 4.7/5 (213 download)

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Book Synopsis Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology by : John H. Lau

Download or read book Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology written by John H. Lau and published by Springer. This book was released on 2024-08-18 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.

3D IC Integration and Packaging

Author : John H. Lau
Publisher : McGraw Hill Professional
ISBN 13 : 007184807X
Total Pages : 512 pages
Book Rating : 4.0/5 (718 download)

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Book Synopsis 3D IC Integration and Packaging by : John H. Lau

Download or read book 3D IC Integration and Packaging written by John H. Lau and published by McGraw Hill Professional. This book was released on 2015-07-06 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to 3D IC integration and packaging technology 3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail. 3D IC Integration and Packaging covers: • 3D integration for semiconductor IC packaging• Through-silicon vias modeling and testing• Stress sensors for thin-wafer handling and strength measurement• Package substrate technologies• Microbump fabrication, assembly, and reliability• 3D Si integration• 2.5D/3D IC integration• 3D IC integration with passive interposer• Thermal management of 2.5D/3D IC integration• Embedded 3D hybrid integration• 3D LED and IC integration• 3D MEMS and IC integration• 3D CMOS image sensors and IC integration• PoP, chip-to-chip interconnects, and embedded fan-out WLP

Hardware Security

Author : Mark Tehranipoor
Publisher : Springer Nature
ISBN 13 : 3031586875
Total Pages : 538 pages
Book Rating : 4.0/5 (315 download)

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Book Synopsis Hardware Security by : Mark Tehranipoor

Download or read book Hardware Security written by Mark Tehranipoor and published by Springer Nature. This book was released on with total page 538 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Emerging Dimensions of Technology Management

Author : K B Akhilesh
Publisher : Springer Science & Business Media
ISBN 13 : 8132207920
Total Pages : 215 pages
Book Rating : 4.1/5 (322 download)

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Book Synopsis Emerging Dimensions of Technology Management by : K B Akhilesh

Download or read book Emerging Dimensions of Technology Management written by K B Akhilesh and published by Springer Science & Business Media. This book was released on 2013-02-12 with total page 215 pages. Available in PDF, EPUB and Kindle. Book excerpt: Technology is the key driver of business. May it be airport, ICT , smart governance, manufacturing or plantations. Technology management opens up opportunities for the business and help achieve leadership positions. This collection of papers provides a glimpse of issues faced in different sectors. These papers also should inspire more researchers to expand the scope of the subject itself.

Packaging for Sustainability

Author : Karli Verghese
Publisher : Springer Science & Business Media
ISBN 13 : 0857299883
Total Pages : 390 pages
Book Rating : 4.8/5 (572 download)

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Book Synopsis Packaging for Sustainability by : Karli Verghese

Download or read book Packaging for Sustainability written by Karli Verghese and published by Springer Science & Business Media. This book was released on 2012-03-18 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging industry is under pressure from regulators, customers and other stakeholders to improve packaging’s sustainability by reducing its environmental and societal impacts. This is a considerable challenge because of the complex interactions between products and their packaging, and the many roles that packaging plays in the supply chain. Packaging for Sustainability is a concise and readable handbook for practitioners who are trying to implement sustainability strategies for packaging. Industry case studies are used throughout the book to illustrate possible applications and scenarios. Packaging for Sustainability draws on the expertise of researchers and industry practitioners to provide information on business benefits, environmental issues and priorities, environmental evaluation tools, design for environment, marketing strategies, and challenges for the future.

Designing 2D and 3D Network-on-Chip Architectures

Author : Konstantinos Tatas
Publisher : Springer Science & Business Media
ISBN 13 : 1461442745
Total Pages : 271 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Designing 2D and 3D Network-on-Chip Architectures by : Konstantinos Tatas

Download or read book Designing 2D and 3D Network-on-Chip Architectures written by Konstantinos Tatas and published by Springer Science & Business Media. This book was released on 2013-10-08 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.

Towards a Design Flow for Reversible Logic

Author : Robert Wille
Publisher : Springer Science & Business Media
ISBN 13 : 9048195799
Total Pages : 192 pages
Book Rating : 4.0/5 (481 download)

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Book Synopsis Towards a Design Flow for Reversible Logic by : Robert Wille

Download or read book Towards a Design Flow for Reversible Logic written by Robert Wille and published by Springer Science & Business Media. This book was released on 2010-07-28 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of computing machines found great success in the last decades. But the ongoing miniaturization of integrated circuits will reach its limits in the near future. Shrinking transistor sizes and power dissipation are the major barriers in the development of smaller and more powerful circuits. Reversible logic p- vides an alternative that may overcome many of these problems in the future. For low-power design, reversible logic offers signi?cant advantages since zero power dissipation will only be possible if computation is reversible. Furthermore, quantum computation pro?ts from enhancements in this area, because every quantum circuit is inherently reversible and thus requires reversible descriptions. However, since reversible logic is subject to certain restrictions (e.g. fanout and feedback are not directly allowed), the design of reversible circuits signi?cantly differs from the design of traditional circuits. Nearly all steps in the design ?ow (like synthesis, veri?cation, or debugging) must be redeveloped so that they become applicable to reversible circuits as well. But research in reversible logic is still at the beginning. No continuous design ?ow exists so far. Inthisbook,contributionstoadesign?owforreversiblelogicarepresented.This includes advanced methods for synthesis, optimization, veri?cation, and debugging.

Advanced Transaction Models and Architectures

Author : Sushil Jajodia
Publisher : Springer Science & Business Media
ISBN 13 : 1461562171
Total Pages : 380 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Advanced Transaction Models and Architectures by : Sushil Jajodia

Download or read book Advanced Transaction Models and Architectures written by Sushil Jajodia and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt: Motivation Modem enterprises rely on database management systems (DBMS) to collect, store and manage corporate data, which is considered a strategic corporate re source. Recently, with the proliferation of personal computers and departmen tal computing, the trend has been towards the decentralization and distribution of the computing infrastructure, with autonomy and responsibility for data now residing at the departmental and workgroup level of the organization. Users want their data delivered to their desktops, allowing them to incor porate data into their personal databases, spreadsheets, word processing doc uments, and most importantly, into their daily tasks and activities. They want to be able to share their information while retaining control over its access and distribution. There are also pressures from corporate leaders who wish to use information technology as a strategic resource in offering specialized value-added services to customers. Database technology is being used to manage the data associated with corporate processes and activities. Increasingly, the data being managed are not simply formatted tables in relational databases, but all types of ob jects, including unstructured text, images, audio, and video. Thus, the database management providers are being asked to extend the capabilities of DBMS to include object-relational models as well as full object-oriented database man agement systems.

Emerging Memory Technologies

Author : Yuan Xie
Publisher : Springer Science & Business Media
ISBN 13 : 144199551X
Total Pages : 321 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Emerging Memory Technologies by : Yuan Xie

Download or read book Emerging Memory Technologies written by Yuan Xie and published by Springer Science & Business Media. This book was released on 2013-10-21 with total page 321 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explores the design implications of emerging, non-volatile memory (NVM) technologies on future computer memory hierarchy architecture designs. Since NVM technologies combine the speed of SRAM, the density of DRAM, and the non-volatility of Flash memory, they are very attractive as the basis for future universal memories. This book provides a holistic perspective on the topic, covering modeling, design, architecture and applications. The practical information included in this book will enable designers to exploit emerging memory technologies to improve significantly the performance/power/reliability of future, mainstream integrated circuits.

Interconnect Technologies for Integrated Circuits and Flexible Electronics

Author : Yash Agrawal
Publisher : Springer Nature
ISBN 13 : 9819944767
Total Pages : 286 pages
Book Rating : 4.8/5 (199 download)

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Book Synopsis Interconnect Technologies for Integrated Circuits and Flexible Electronics by : Yash Agrawal

Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer Nature. This book was released on 2023-10-17 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.

Scaling Issues and Design of MEMS

Author : Salvatore Baglio
Publisher : John Wiley & Sons
ISBN 13 : 9780470034088
Total Pages : 244 pages
Book Rating : 4.0/5 (34 download)

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Book Synopsis Scaling Issues and Design of MEMS by : Salvatore Baglio

Download or read book Scaling Issues and Design of MEMS written by Salvatore Baglio and published by John Wiley & Sons. This book was released on 2008-07-31 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt: This accessible volume delivers a complete design methodology for microelectromechanical systems (MEMS). Focusing on the scaling of an autonomous micro-system, it explains the real-world problems and theoretical concepts of several different aspects inherent to the miniaturization of sensors and actuators. It reports on the analysis of dimensional scaling, the modelling, design and experimental characterization of a wide range of specific devices and applications, including: temperature microsensors based on an integrated complementary metal-oxide-semiconductor (CMOS) thermocouple; mechanical sensors; inductive microsensors for the detection of magnetic particles; electrostatic, thermal and magnetic actuators. With an original approach, this informative text encompasses the entire range of themes currently at the forefront of MEMS, including an analysis of the importantissue of energy sources in MEMS. In addition, the book explores contemporary research into the design of complete MEMS with a case study on colonies of microbots. Scaling Issues and Design of MEMS aims to improve the reader’s basic knowledge on modelling issues of complex micro devices, and to encourage new thinking about scaling effects. It will provide support for practising engineers working within the defence industry and will also be of welcome interest to graduate students and researchers with a background in electronic engineering, physics, chemistry, biology and materials science.

Environmentally Degradable Materials Based on Multicomponent Polymeric Systems

Author : Cornelia Vasile
Publisher : BRILL
ISBN 13 : 9004164103
Total Pages : 660 pages
Book Rating : 4.0/5 (41 download)

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Book Synopsis Environmentally Degradable Materials Based on Multicomponent Polymeric Systems by : Cornelia Vasile

Download or read book Environmentally Degradable Materials Based on Multicomponent Polymeric Systems written by Cornelia Vasile and published by BRILL. This book was released on 2009-12-21 with total page 660 pages. Available in PDF, EPUB and Kindle. Book excerpt: Environmentally Degradable Materials (EDPs) should replace petroleum-based plastics where recycling is not viable for logistic or labor cost reason. This book discusses the general background of obtaining such systems, compatibilization methodologies, control of the rate of degradation and final products after degradation, life time assessment, toxicological aspects, applications and market aspects. This book is a complete guide to the subject of biodegradable materials based on multi-component polymeric systems, mainly such as hydrogels, and interpenetrating polymeric networks. This book is a complete guide to the subject of biodegradable materials based on multicomponent polymeric systems such as mainly hydrogels, interpenetrating polymeric networks.

Handbook of FPGA Design Security

Author : Ted Huffmire
Publisher : Springer Science & Business Media
ISBN 13 : 9048191572
Total Pages : 191 pages
Book Rating : 4.0/5 (481 download)

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Book Synopsis Handbook of FPGA Design Security by : Ted Huffmire

Download or read book Handbook of FPGA Design Security written by Ted Huffmire and published by Springer Science & Business Media. This book was released on 2010-06-18 with total page 191 pages. Available in PDF, EPUB and Kindle. Book excerpt: The purpose of this book is to provide a practical approach to managing security in FPGA designs for researchers and practitioners in the electronic design automation (EDA) and FPGA communities, including corporations, industrial and government research labs, and academics. This book combines theoretical underpinnings with a practical design approach and worked examples for combating real world threats. To address the spectrum of lifecycle and operational threats against FPGA systems, a holistic view of FPGA security is presented, from formal top level speci?cation to low level policy enforcement mechanisms, which integrates recent advances in the ?elds of computer security theory, languages, compilers, and hardware. The net effect is a diverse set of static and runtime techniques that, working in coope- tion, facilitate the composition of robust, dependable, and trustworthy systems using commodity components. We wish to acknowledge the many people who helped us ensure the success of ourworkonrecon?gurablehardwaresecurity.Inparticular,wewishtothankAndrei Paun and Jason Smith of Louisiana Tech University for providing us with a Lin- compatible version of Grail+. We also wish to thank those who gave us comments on drafts of this book, including Marco Platzner of the University of Paderborn, and Ali Irturk and Jason Oberg of the University of California, San Diego. This research was funded in part by National Science Foundation Grant CNS-0524771 and NSF Career Grant CCF-0448654.