Advanced Wirebond Interconnection Technology

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Advanced Wirebond Interconnection Technology

Author : Shankara K. Prasad
Publisher : Springer Science & Business Media
ISBN 13 : 1402077637
Total Pages : 694 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Advanced Wirebond Interconnection Technology by : Shankara K. Prasad

Download or read book Advanced Wirebond Interconnection Technology written by Shankara K. Prasad and published by Springer Science & Business Media. This book was released on 2006-05-10 with total page 694 pages. Available in PDF, EPUB and Kindle. Book excerpt: From the reviews: "This book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers. Operational issues such as specifying and optimizing wire and automatic bonders for a product line are included. The book is very good with "visual" explanations for quick grasping of the issues. In addition, the fundamental metallurgical or mechanical root causes behind material and process choices are presented. The book has a clear prose style and a very readable font and page layout. The figures, although effective, are simply low resolution screen prints from a personal computer and thus have aliasing and fuzziness. This book has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. The majority of the book dwells on establishing the bonding process for a particular product; determining the "window" of adjustments. The book ends with discussions on establishing quality metrics and reliability assurance tests. Each chapter of the book includes enough tutorial information to allow it to alone with little need to page backwards. A short but good reference section is at the end. If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book." ( CMPT Newsletter, June 2005)

Labs on Chip

Author : Eugenio Iannone
Publisher : CRC Press
ISBN 13 : 1351832069
Total Pages : 1351 pages
Book Rating : 4.3/5 (518 download)

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Book Synopsis Labs on Chip by : Eugenio Iannone

Download or read book Labs on Chip written by Eugenio Iannone and published by CRC Press. This book was released on 2018-09-03 with total page 1351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Labs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas— fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistry—this text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design and Technology offers valuable guidance for the lab-on-chip design decision-making process, while exploring essential elements of labs on chip useful both to the professional who wants to approach a new field and to the specialist who wants to gain a broader perspective.

Direct Copper Interconnection for Advanced Semiconductor Technology

Author : Dongkai Shangguan
Publisher : CRC Press
ISBN 13 : 1040028691
Total Pages : 549 pages
Book Rating : 4.0/5 (4 download)

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Book Synopsis Direct Copper Interconnection for Advanced Semiconductor Technology by : Dongkai Shangguan

Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 549 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Direct Copper Interconnection for Advanced Semiconductor Technology

Author : Dongkai Shangguan
Publisher : CRC Press
ISBN 13 : 9781032528236
Total Pages : 0 pages
Book Rating : 4.5/5 (282 download)

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Book Synopsis Direct Copper Interconnection for Advanced Semiconductor Technology by : Dongkai Shangguan

Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-04 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Materials for Advanced Packaging

Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 974 pages
Book Rating : 4.3/5 (194 download)

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Book Synopsis Materials for Advanced Packaging by : Daniel Lu

Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Copper Wire Bonding

Author : Preeti S Chauhan
Publisher : Springer Science & Business Media
ISBN 13 : 1461457610
Total Pages : 254 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Copper Wire Bonding by : Preeti S Chauhan

Download or read book Copper Wire Bonding written by Preeti S Chauhan and published by Springer Science & Business Media. This book was released on 2013-09-20 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.

Wire Bonding in Microelectronics

Author : George Harman
Publisher : McGraw Hill Professional
ISBN 13 : 007164265X
Total Pages : 448 pages
Book Rating : 4.0/5 (716 download)

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Book Synopsis Wire Bonding in Microelectronics by : George Harman

Download or read book Wire Bonding in Microelectronics written by George Harman and published by McGraw Hill Professional. This book was released on 2009-06-05 with total page 448 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fifine-pitch, specialized-looping, soft-substrate, and extremetemperature wire bonds Copper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation CD includes all the book's full-color figures plus animations

The British National Bibliography

Author : Arthur James Wells
Publisher :
ISBN 13 :
Total Pages : 1264 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis The British National Bibliography by : Arthur James Wells

Download or read book The British National Bibliography written by Arthur James Wells and published by . This book was released on 2004 with total page 1264 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)

Author :
Publisher : World Scientific
ISBN 13 : 9811209642
Total Pages : 1079 pages
Book Rating : 4.8/5 (112 download)

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Book Synopsis Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set) by :

Download or read book Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set) written by and published by World Scientific. This book was released on 2019-08-27 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.

WIRE BONDING IN MICROELECTRONICS, 3/E

Author : George Harman
Publisher : McGraw-Hill Education
ISBN 13 : 9780071476232
Total Pages : 446 pages
Book Rating : 4.4/5 (762 download)

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Book Synopsis WIRE BONDING IN MICROELECTRONICS, 3/E by : George Harman

Download or read book WIRE BONDING IN MICROELECTRONICS, 3/E written by George Harman and published by McGraw-Hill Education. This book was released on 2010-02-10 with total page 446 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fine-pitch, specialized-looping, soft-substrate, and extreme-temperature wire bonds Copper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation CD includes all of the book's full-color figures plus animations.

Antenna-in-Package Technology and Applications

Author : Duixian Liu
Publisher : John Wiley & Sons
ISBN 13 : 1119556635
Total Pages : 416 pages
Book Rating : 4.1/5 (195 download)

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Book Synopsis Antenna-in-Package Technology and Applications by : Duixian Liu

Download or read book Antenna-in-Package Technology and Applications written by Duixian Liu and published by John Wiley & Sons. This book was released on 2020-03-31 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

The International Journal of Microcircuits and Electronic Packaging

Author :
Publisher :
ISBN 13 :
Total Pages : 582 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis The International Journal of Microcircuits and Electronic Packaging by :

Download or read book The International Journal of Microcircuits and Electronic Packaging written by and published by . This book was released on 2000 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Advances in Interconnection Technology."

Author :
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (714 download)

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Book Synopsis Advances in Interconnection Technology." by :

Download or read book Advances in Interconnection Technology." written by and published by . This book was released on 2000 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

American Book Publishing Record

Author :
Publisher :
ISBN 13 :
Total Pages : 784 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis American Book Publishing Record by :

Download or read book American Book Publishing Record written by and published by . This book was released on 2004 with total page 784 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Wireless Interface Technologies for 3D IC and Module Integration

Author : Tadahiro Kuroda
Publisher : Cambridge University Press
ISBN 13 : 110884121X
Total Pages : 337 pages
Book Rating : 4.1/5 (88 download)

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Book Synopsis Wireless Interface Technologies for 3D IC and Module Integration by : Tadahiro Kuroda

Download or read book Wireless Interface Technologies for 3D IC and Module Integration written by Tadahiro Kuroda and published by Cambridge University Press. This book was released on 2021-09-30 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

Solid State Technology

Author :
Publisher :
ISBN 13 :
Total Pages : 440 pages
Book Rating : 4.E/5 ( download)

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Book Synopsis Solid State Technology by :

Download or read book Solid State Technology written by and published by . This book was released on 1987 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Multichip Module Technologies and Alternatives: The Basics

Author : Daryl Ann Doane
Publisher : Springer Science & Business Media
ISBN 13 : 1461531004
Total Pages : 895 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Multichip Module Technologies and Alternatives: The Basics by : Daryl Ann Doane

Download or read book Multichip Module Technologies and Alternatives: The Basics written by Daryl Ann Doane and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 895 pages. Available in PDF, EPUB and Kindle. Book excerpt: Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.