Tungsten and Other Refractory Metals for VLSI Applications

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ISBN 13 :
Total Pages : 600 pages
Book Rating : 4.0/5 ( download)

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Book Synopsis Tungsten and Other Refractory Metals for VLSI Applications by :

Download or read book Tungsten and Other Refractory Metals for VLSI Applications written by and published by . This book was released on 1984 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Tungsten and Other Refractory Metals for VLSI Applications

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ISBN 13 :
Total Pages : 594 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Tungsten and Other Refractory Metals for VLSI Applications by : R. S. Blewer

Download or read book Tungsten and Other Refractory Metals for VLSI Applications written by R. S. Blewer and published by . This book was released on 1986 with total page 594 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Masters Theses in the Pure and Applied Sciences

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Publisher : Springer Science & Business Media
ISBN 13 : 1461519691
Total Pages : 426 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Masters Theses in the Pure and Applied Sciences by : Wade H. Shafer

Download or read book Masters Theses in the Pure and Applied Sciences written by Wade H. Shafer and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 426 pages. Available in PDF, EPUB and Kindle. Book excerpt: Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS)* at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dis semination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volumes were handled by an international publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 38 (thesis year 1993) a total of 13,787 thesis titles from 22 Canadian and 164 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this impor tant annual reference work. While Volume 38 reports theses submitted in 1993, on occasion, certain uni versities do report theses submitted in previous years but not reported at the time.

Advanced Metallization for Future ULSI: Volume 427

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ISBN 13 :
Total Pages : 624 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Advanced Metallization for Future ULSI: Volume 427 by : Materials Research Society. Meeting

Download or read book Advanced Metallization for Future ULSI: Volume 427 written by Materials Research Society. Meeting and published by . This book was released on 1996-11-08 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt: The feature sizes of microelectronic devices have entered the deep submicron regime. The process integration and structure-properties control of the multilevel metal circuitry demand an interdisciplinary interaction and understanding between manufacturing and research. To realize the vision presented in the national technology road map, material and technological challenges will need to be overcome. For example Cu conductor and its barrier metals and low-dielectric constant insulators are at issue. For materials processing, chemical-mechanical planarization and low-temperature filling of high-aspect ratio vias are challenges. For materials examination, the metrology of submicron structures is nontrivial and for materials reliability, the interplay among multiple driving forces and the response in small-dimension microstructures are intriguing. These issues are the focus of this book from MRS. Topics include: road map, technology and metrology of submicron device structures; reliability issues for Cu metallization; Al interconnects and vias; barrier metal; interlevel low-K dielectrics and contact to Si and compound semiconductors.

Scientific and Technical Aerospace Reports

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ISBN 13 :
Total Pages : 692 pages
Book Rating : 4.:/5 (3 download)

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Book Synopsis Scientific and Technical Aerospace Reports by :

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 692 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Dissertation Abstracts International

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ISBN 13 :
Total Pages : 774 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Dissertation Abstracts International by :

Download or read book Dissertation Abstracts International written by and published by . This book was released on 1990 with total page 774 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Chemical Abstracts

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ISBN 13 :
Total Pages : 2540 pages
Book Rating : 4.3/5 (91 download)

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Download or read book Chemical Abstracts written by and published by . This book was released on 2002 with total page 2540 pages. Available in PDF, EPUB and Kindle. Book excerpt:

VLSI Technology

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Publisher : Springer Science & Business Media
ISBN 13 : 3642691927
Total Pages : 464 pages
Book Rating : 4.6/5 (426 download)

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Book Synopsis VLSI Technology by : Yasuo Tarui

Download or read book VLSI Technology written by Yasuo Tarui and published by Springer Science & Business Media. This book was released on 2013-03-12 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: The origin of the development of integrated circuits up to VLSI is found in the invention of the transistor, which made it possible to achieve the ac tion of a vacuum tube in a semiconducting solid. The structure of the tran sistor can be constructed by a manufacturing technique such as the intro duction of a small amount of an impurity into a semiconductor and, in ad dition, most transistor characteristics can be improved by a reduction of dimensions. These are all important factors in the development. Actually, the microfabrication of the integrated circuit can be used for two purposes, namely to increase the integration density and to obtain an improved perfor mance, e. g. a high speed. When one of these two aims is pursued, the result generally satisfies both. We use the Engl ish translation "very large scale integration (VLSIl" for "Cho LSI" in Japanese. In the United States of America, however, similar technology is bei ng developed under the name "very hi gh speed integrated circuits (VHSIl". This also originated from the nature of the integrated circuit which satisfies both purposes. Fortunately, the Japanese word "Cho LSI" has a wider meani ng than VLSI, so it can be used ina broader area. However, VLSI has a larger industrial effect than VHSI.

Handbook of Semiconductor Manufacturing Technology

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Publisher : CRC Press
ISBN 13 : 1420017667
Total Pages : 1720 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Handbook of Semiconductor Manufacturing Technology by : Yoshio Nishi

Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

1991 International Symposium on VLSI Technology, Systems and Applications

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ISBN 13 :
Total Pages : 462 pages
Book Rating : 4.E/5 ( download)

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Book Synopsis 1991 International Symposium on VLSI Technology, Systems and Applications by :

Download or read book 1991 International Symposium on VLSI Technology, Systems and Applications written by and published by . This book was released on 1991 with total page 462 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Wafer Bonding

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Publisher : Springer Science & Business Media
ISBN 13 : 3662108275
Total Pages : 510 pages
Book Rating : 4.6/5 (621 download)

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Book Synopsis Wafer Bonding by : Marin Alexe

Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

VLSI Metallization

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Publisher : Artech House Publishers
ISBN 13 :
Total Pages : 548 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis VLSI Metallization by : Krishna Shenai

Download or read book VLSI Metallization written by Krishna Shenai and published by Artech House Publishers. This book was released on 1991 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive collection of reprinted articles presents the most important developments on VLSI contact and interconnect technologies and applications. The book covers important developments in metallization of compound semiconductor technologies, and includes a section on metallization reliability and high speed testing.

International Conference on VLSI and CAD.

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ISBN 13 :
Total Pages : 672 pages
Book Rating : 4.:/5 (31 download)

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Book Synopsis International Conference on VLSI and CAD. by :

Download or read book International Conference on VLSI and CAD. written by and published by . This book was released on 1999 with total page 672 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Surface Modeling Engineering

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Publisher : CRC Press
ISBN 13 : 9780849347696
Total Pages : 348 pages
Book Rating : 4.3/5 (476 download)

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Book Synopsis Surface Modeling Engineering by : Ram Kossowsky

Download or read book Surface Modeling Engineering written by Ram Kossowsky and published by CRC Press. This book was released on 1989-07-31 with total page 348 pages. Available in PDF, EPUB and Kindle. Book excerpt: These volumes present the general parctitioners in engineering with a comprehensive discussion of technological surfaces, their interactions with environments, and the various modification techniques available to improve their performance. In each subject, applications to metals, ceramics, and polymers are emphasized. The interactions with the environment are described: corrosion (chemical), friction and waer (mechanical), and bioreactivity (physiological). Reviews of major modification schemes such as chemical vapor deposition, physical vapor deposition, laser beam interactions, chemical infusion, and ion implantation are presented. In summary, reviews of applications of the modification techniques to optimize the performances of structural components, tools, electronic devices, and implantable medical devices, manufactured out of metals, ceramic, and polymers, are described.

Advanced Metallization for Devices and Circuits--science, Technology, and Manufacturability

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ISBN 13 :
Total Pages : 794 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Advanced Metallization for Devices and Circuits--science, Technology, and Manufacturability by : S. P. Murarka

Download or read book Advanced Metallization for Devices and Circuits--science, Technology, and Manufacturability written by S. P. Murarka and published by . This book was released on 1994 with total page 794 pages. Available in PDF, EPUB and Kindle. Book excerpt:

BiCMOS Technology and Applications

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Publisher : Springer Science & Business Media
ISBN 13 : 1461532183
Total Pages : 412 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis BiCMOS Technology and Applications by : Antonio R. Alvarez

Download or read book BiCMOS Technology and Applications written by Antonio R. Alvarez and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt: BiCMOS Technology and Applications, Second Edition provides a synthesis of available knowledge about the combination of bipolar and MOS transistors in a common integrated circuit - BiCMOS. In this new edition all chapters have been updated and completely new chapters on emerging topics have been added. In addition, BiCMOS Technology and Applications, Second Edition provides the reader with a knowledge of either CMOS or Bipolar technology/design a reference with which they can make educated decisions regarding the viability of BiCMOS in their own application. BiCMOS Technology and Applications, Second Edition is vital reading for practicing integrated circuit engineers as well as technical managers trying to evaluate business issues related to BiCMOS. As a textbook, this book is also appropriate at the graduate level for a special topics course in BiCMOS. A general knowledge in device physics, processing and circuit design is assumed. Given the division of the book, it lends itself well to a two-part course; one on technology and one on design. This will provide advanced students with a good understanding of tradeoffs between bipolar and MOS devices and circuits.

Metals Abstracts

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ISBN 13 :
Total Pages : 740 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Metals Abstracts by :

Download or read book Metals Abstracts written by and published by . This book was released on 1996 with total page 740 pages. Available in PDF, EPUB and Kindle. Book excerpt: