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Author :
Publisher :
ISBN 13 :
Total Pages : 488 pages
Book Rating : 4.:/5 (775 download)
Download or read book 2011 International Symposium on Advanced Packaging Materials (APM) written by and published by . This book was released on 2011 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yixiong Huang
Publisher :
ISBN 13 : 9781467301473
Total Pages : 488 pages
Book Rating : 4.3/5 (14 download)
Download or read book 2011 International Symposium on Advanced Packaging Materials (APM 2011) written by Yixiong Huang and published by . This book was released on 2011 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 974 pages
Book Rating : 4.3/5 (194 download)
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Download or read book Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007. APM 2007. 12th International Symposium on written by and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Cher Ming Tan
Publisher : Woodhead Publishing
ISBN 13 : 012822407X
Total Pages : 190 pages
Book Rating : 4.1/5 (282 download)
Download or read book Reliability and Failure Analysis of High-Power LED Packaging written by Cher Ming Tan and published by Woodhead Publishing. This book was released on 2022-09-24 with total page 190 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them Describes the chemistry underlying the material degradation and its impact on LEDs Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
Author : Dongkai Shangguan
Publisher : CRC Press
ISBN 13 : 1040028640
Total Pages : 463 pages
Book Rating : 4.0/5 (4 download)
Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
Author : Wen Jin
Publisher : Trans Tech Publications Ltd
ISBN 13 : 3038260274
Total Pages : 840 pages
Book Rating : 4.0/5 (382 download)
Download or read book Advanced Engineering and Materials written by Wen Jin and published by Trans Tech Publications Ltd. This book was released on 2013-02-13 with total page 840 pages. Available in PDF, EPUB and Kindle. Book excerpt: Selected, peer reviewed papers from the 2013 International Conference on Mechanical Engineering and Materials (ICMEM 2013), January 27-28, 2013, Sanya, China. The papers are grouped as follows: Chapter 1: Advanced Material Science and Engineering, Material Processing and Manufacturing Technology; Chapter 2: Applied Mechanics and Mechanical Engineering; Chapter 3: Manufacturing Engineering, Design, Modeling and Simulation in Manufacture and Industry; Chapter 4: Control and Automation, Applications of Tracking and Information Technologies.
Author : George Youssef
Publisher : Elsevier
ISBN 13 : 0128210796
Total Pages : 320 pages
Book Rating : 4.1/5 (282 download)
Download or read book Applied Mechanics of Polymers written by George Youssef and published by Elsevier. This book was released on 2021-12-02 with total page 320 pages. Available in PDF, EPUB and Kindle. Book excerpt: Applied Mechanics of Polymers: Properties, Processing, and Behavior provides readers with an overview of the properties, mechanical behaviors and modeling techniques for accurately predicting the behaviors of polymeric materials. The book starts with an introduction to polymers, covering their history, chemistry, physics, and various types and applications. In addition, it covers the general properties of polymers and the common processing and manufacturing processes involved with them. Subsequent chapters delve into specific mechanical behaviors of polymers such as linear elasticity, hyperelasticity, creep, viscoelasticity, failure, and fracture. The book concludes with chapters discussing electroactive polymers, hydrogels, and the mechanical characterization of polymers. This is a useful reference text that will benefit graduate students, postdocs, researchers, and engineers in the mechanics of materials, polymer science, mechanical engineering and material science. Additional resources related to the book can be found at polymersmechanics.com. Provides examples of real-world applications that demonstrate the use of models in designing polymer-based components Includes access to a companion site from where readers can download FEA and MATLAB code, FEA simulation files, videos and other supplemental material Features end-of-chapter summaries with design and analysis guidelines, practice problem sets based on real-life situations, and both analytical and computational examples to bridge academic and industrial applications
Author : King-Ning Tu
Publisher : John Wiley & Sons
ISBN 13 : 111941833X
Total Pages : 336 pages
Book Rating : 4.1/5 (194 download)
Download or read book Electronic Packaging Science and Technology written by King-Ning Tu and published by John Wiley & Sons. This book was released on 2021-12-14 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.
Author : Jürgen Wittmann
Publisher : Springer Nature
ISBN 13 : 3030252574
Total Pages : 184 pages
Book Rating : 4.0/5 (32 download)
Download or read book Integrated High-Vin Multi-MHz Converters written by Jürgen Wittmann and published by Springer Nature. This book was released on 2019-09-03 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with guidelines for designing integrated multi-MHz-switching converters for input voltages/system supplies up to 50V or higher. Coverage includes converter theory, converter architectures, circuit design, efficiency, sizing of passives, technology aspects, etc. The author discusses new circuit designs, new architectures and new switching concepts, including dead-time control and soft-switching techniques that overcome current limitations of these converters. The discussion includes technology related issues and helps readers to choose the right technology for fast-switching converters. This book discusses benefits and drawbacks in terms of integration, size and cost, efficiency and complexity, and enables readers to make trade-offs in design, given different converter parameters. Describes a study for increasing switching frequencies up to 30 MHz at input voltages up to 50V or higher in the scaling of the size of switching converter passives; Analyzes various buck converter implementations and shows that a preference due to higher efficiency depends on the operating point, on the available switch technologies, and on the implementation of the high-side supply generation; Describes an efficiency model based on a four-phase model, which enables separation of loss causes and loss locations.
Author : K. L. Mittal
Publisher : John Wiley & Sons
ISBN 13 : 1118831349
Total Pages : 293 pages
Book Rating : 4.1/5 (188 download)
Download or read book Adhesion in Microelectronics written by K. L. Mittal and published by John Wiley & Sons. This book was released on 2014-08-25 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings
Author : Mohd Arif Anuar Mohd Salleh
Publisher : Springer Nature
ISBN 13 : 3030934411
Total Pages : 332 pages
Book Rating : 4.0/5 (39 download)
Download or read book Recent Progress in Lead-Free Solder Technology written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2022-03-01 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
Author : Aida Todri-Sanial
Publisher : Springer
ISBN 13 : 3319297465
Total Pages : 340 pages
Book Rating : 4.3/5 (192 download)
Download or read book Carbon Nanotubes for Interconnects written by Aida Todri-Sanial and published by Springer. This book was released on 2016-07-09 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Author : Peter Ramm
Publisher : John Wiley & Sons
ISBN 13 : 3527644237
Total Pages : 435 pages
Book Rating : 4.5/5 (276 download)
Download or read book Handbook of Wafer Bonding written by Peter Ramm and published by John Wiley & Sons. This book was released on 2011-11-17 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Download or read book Advanced Packaging Materials written by and published by . This book was released on 1995 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Atul Tiwari
Publisher : John Wiley & Sons
ISBN 13 : 1118938445
Total Pages : 646 pages
Book Rating : 4.1/5 (189 download)
Download or read book Concise Encyclopedia of High Performance Silicones written by Atul Tiwari and published by John Wiley & Sons. This book was released on 2014-04-03 with total page 646 pages. Available in PDF, EPUB and Kindle. Book excerpt: The encyclopedia will be an invaluable source of information for researchers and students from diverse backgrounds including physics, chemistry, materials science and surface engineering, biotechnology, pharmacy, medical science, and biomedical engineering.
Author : Georgia) International Symposium on Advanced Packaging Materials (2001 : Braselton
Publisher : International Society of Hybrid
ISBN 13 : 9780930815646
Total Pages : 0 pages
Book Rating : 4.8/5 (156 download)
Download or read book Advanced Packaging Materials, 2001 written by Georgia) International Symposium on Advanced Packaging Materials (2001 : Braselton and published by International Society of Hybrid. This book was released on 2001-03 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
