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Ulsi Process Integration 6
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Book Synopsis ULSI Process Integration 6 by : C. Claeys
Download or read book ULSI Process Integration 6 written by C. Claeys and published by The Electrochemical Society. This book was released on 2009-09 with total page 547 pages. Available in PDF, EPUB and Kindle. Book excerpt: ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
Book Synopsis ULSI Process Integration 6 by : C. L. Claeys
Download or read book ULSI Process Integration 6 written by C. L. Claeys and published by . This book was released on 2009 with total page 533 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis ULSI Process Integration 5 by : Cor L. Claeys
Download or read book ULSI Process Integration 5 written by Cor L. Claeys and published by The Electrochemical Society. This book was released on 2007 with total page 509 pages. Available in PDF, EPUB and Kindle. Book excerpt: The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.
Book Synopsis ULSI Process Integration 9 by : C. Claeys
Download or read book ULSI Process Integration 9 written by C. Claeys and published by The Electrochemical Society. This book was released on 2015 with total page 335 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis ULSI Process Integration by : Cor L. Claeys
Download or read book ULSI Process Integration written by Cor L. Claeys and published by The Electrochemical Society. This book was released on 1999 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :Electrochemical Society. Meeting Publisher :The Electrochemical Society ISBN 13 :9781566773768 Total Pages :620 pages Book Rating :4.7/5 (737 download)
Book Synopsis ULSI Process Integration III by : Electrochemical Society. Meeting
Download or read book ULSI Process Integration III written by Electrochemical Society. Meeting and published by The Electrochemical Society. This book was released on 2003 with total page 620 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis ULSI Process Integration 7 by : C. Claeys
Download or read book ULSI Process Integration 7 written by C. Claeys and published by The Electrochemical Society. This book was released on 2011 with total page 429 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis ULSI Process Integration II by : Cor L. Claeys
Download or read book ULSI Process Integration II written by Cor L. Claeys and published by The Electrochemical Society. This book was released on 2001 with total page 636 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis SiGe, Ge, and Related Compounds 6: Materials, Processing, and Devices by : D. Harame
Download or read book SiGe, Ge, and Related Compounds 6: Materials, Processing, and Devices written by D. Harame and published by The Electrochemical Society. This book was released on with total page 1042 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis ULSI Semiconductor Technology Atlas by : Chih-Hang Tung
Download or read book ULSI Semiconductor Technology Atlas written by Chih-Hang Tung and published by John Wiley & Sons. This book was released on 2003-10-06 with total page 688 pages. Available in PDF, EPUB and Kindle. Book excerpt: More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems. The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts: * Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation * Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization * Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development * Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with: * More than 1,100 TEM images to illustrate the science of ULSI * A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues * Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs
Book Synopsis Developments in Surface Contamination and Cleaning - Vol 2 by : Rajiv Kohli
Download or read book Developments in Surface Contamination and Cleaning - Vol 2 written by Rajiv Kohli and published by William Andrew. This book was released on 2009-10-02 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Rajiv Kohli and Kash Mittal have brought together the work of experts from different industry sectors and backgrounds to provide a state-of-the-art survey and best practice guidance for scientists and engineers engaged in surface cleaning or handling the consequences of surface contamination. Topics covered include: A systems analysis approach to contamination control Physical factors that influence the behavior of particle deposition in enclosures An overview of current yield models and description of advanced models Types of strippable coatings, their properties and applications of these coatings for removal of surface contaminants In-depth coverage of ultrasonic cleaning Contamination and cleaning issues at the nanoscale Experimental results illustrating the impact of model parameters on the removal of particle contamination The expert contributions in this book provide a valuable source of information on the current status and recent developments in surface contamination and cleaning. The book will be of value to industry, government and academic personnel involved in research and development, manufacturing, process and quality control, and procurement specifications across sectors including microelectronics, aerospace, optics, xerography and joining (adhesive bonding). ABOUT THE EDITORS Rajiv Kohli is a leading expert with The Aerospace Corporation in contaminant particle behavior, surface cleaning, and contamination control. At the NASA Johnson Space Center in Houston, Texas, he provides technical support for contamination control related to ground-based and manned spaceflight hardware for the Space Shuttle, the International Space Station, and the new Constellation Program that is designed to meet the United States Vision for Space Exploration. Kashmiri Lal "Kash" Mittal was associated with IBM from 1972 to 1994. Currently, he is teaching and consulting in the areas of surface contamination and cleaning, and in adhesion science and technology. He is the Editor-in-Chief of the Journal of Adhesion Science and Technology and is the editor of 98 published books, many of them dealing with surface contamination and cleaning. Also available Developments in Surface Contamination and Cleaning, Volume 1: Fundamentals and Applied Aspects (edited by Rajiv Kohli & K.L. Mittal). ISBN: 9780815515555. · Provides guidance on best-practice cleaning techniques and the avoidance of surface contamination · Covers contamination and cleaning issues at the nanoscale · Includes an in-depth look at ultrasonic cleaning
Book Synopsis Solid State Topics (General) - 218th ECS Meeting by : K. B. Sundaram
Download or read book Solid State Topics (General) - 218th ECS Meeting written by K. B. Sundaram and published by The Electrochemical Society. This book was released on 2011-03 with total page 131 pages. Available in PDF, EPUB and Kindle. Book excerpt: The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Solid State Topics General Session¿, held during the 218th meeting of The Electrochemical Society, in Las Vegas, Nevada from October 10 to 15, 2010.
Book Synopsis Handbook of Silicon Based MEMS Materials and Technologies by : Markku Tilli
Download or read book Handbook of Silicon Based MEMS Materials and Technologies written by Markku Tilli and published by Elsevier. This book was released on 2020-04-17 with total page 1028 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors
Book Synopsis Advanced Interconnects for ULSI Technology by : Mikhail Baklanov
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-02-17 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Book Synopsis Sinep 2009. 1st International Workshop on Si Based Nano-Electronics and -Photonics by : Steafno Chiussi
Download or read book Sinep 2009. 1st International Workshop on Si Based Nano-Electronics and -Photonics written by Steafno Chiussi and published by Netbiblo. This book was released on 2009-06 with total page 162 pages. Available in PDF, EPUB and Kindle. Book excerpt: The main objective of this International Workshop in Vigo is to target this major problem by bringing together scientists and engineers specialized on various different topics related to group IV semiconductors. In five consecutive sessions dedicated to - Group IV materials: CMOS and further extension of the roadmap - Group IV materials: Nano-photonics - Material aspects and characterization on nano-scale - Nanostructures and material processing on atomic scale
Book Synopsis Proceedings of the ... Symposium on Automated Integrated Circuits Manufacturing by :
Download or read book Proceedings of the ... Symposium on Automated Integrated Circuits Manufacturing written by and published by . This book was released on 1990 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the Fifth Symposium on Automated Integrated Circuits Manufacturing by : Vaughn E. Akins
Download or read book Proceedings of the Fifth Symposium on Automated Integrated Circuits Manufacturing written by Vaughn E. Akins and published by . This book was released on 1990 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt:
