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Author : Lian-Tuu Yeh
Publisher :
ISBN 13 : 9780791887264
Total Pages : 0 pages
Book Rating : 4.8/5 (872 download)
Download or read book Thermal Management of Telecommunications Equipment written by Lian-Tuu Yeh and published by . This book was released on 2023 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : C.J. Hoogendoorn
Publisher : Springer Science & Business Media
ISBN 13 : 9401110824
Total Pages : 334 pages
Book Rating : 4.4/5 (11 download)
Download or read book Thermal Management of Electronic Systems written by C.J. Hoogendoorn and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 334 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.
Author : Yogendra Joshi
Publisher : Springer Science & Business Media
ISBN 13 : 1441971246
Total Pages : 635 pages
Book Rating : 4.4/5 (419 download)
Download or read book Energy Efficient Thermal Management of Data Centers written by Yogendra Joshi and published by Springer Science & Business Media. This book was released on 2012-03-20 with total page 635 pages. Available in PDF, EPUB and Kindle. Book excerpt: Energy Efficient Thermal Management of Data Centers examines energy flow in today's data centers. Particular focus is given to the state-of-the-art thermal management and thermal design approaches now being implemented across the multiple length scales involved. The impact of future trends in information technology hardware, and emerging software paradigms such as cloud computing and virtualization, on thermal management are also addressed. The book explores computational and experimental characterization approaches for determining temperature and air flow patterns within data centers. Thermodynamic analyses using the second law to improve energy efficiency are introduced and used in proposing improvements in cooling methodologies. Reduced-order modeling and robust multi-objective design of next generation data centers are discussed.
Author : David Reay
Publisher : Butterworth-Heinemann
ISBN 13 : 0080982794
Total Pages : 288 pages
Book Rating : 4.0/5 (89 download)
Download or read book Heat Pipes written by David Reay and published by Butterworth-Heinemann. This book was released on 2013-10-01 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat Pipes, 6th Edition, takes a highly practical approach to the design and selection of heat pipes, making it an essential guide for practicing engineers and an ideal text for postgraduate students. This new edition has been revised to include new information on the underlying theory of heat pipes and heat transfer, and features fully updated applications, new data sections, and updated chapters on design and electronics cooling. The book is a useful reference for those with experience and an accessible introduction for those approaching the topic for the first time. Contains all information required to design and manufacture a heat pipe Suitable for use as a professional reference and graduate text Revised with greater coverage of key electronic cooling applications
Author : Fouad Sabry
Publisher : One Billion Knowledgeable
ISBN 13 :
Total Pages : 523 pages
Book Rating : 4.:/5 (661 download)
Download or read book Thermal Copper Pillar Bump written by Fouad Sabry and published by One Billion Knowledgeable. This book was released on 2022-08-31 with total page 523 pages. Available in PDF, EPUB and Kindle. Book excerpt: What Is Thermal Copper Pillar Bump The thermal copper pillar bump is a thermoelectric device that is made from thin-film thermoelectric material and is embedded in flip chip interconnects. It is used in the packaging of electronic and optoelectronic components, such as integrated circuits (chips), laser diodes, and semiconductor optical amplifiers. The thermal bump is also known as the thermal copper pillar bump (SOA). Thermal bumps, as opposed to traditional solder bumps, which provide an electrical path and a mechanical connection to the package, act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. Conventional solder bumps also provide a mechanical connection to the package. A thermal bump has a diameter of 238 micrometers and a height of 60 micrometers. How You Will Benefit (I) Insights, and validations about the following topics: Chapter 1: Thermal copper pillar bump Chapter 2: Solder Chapter 3: Printed circuit board Chapter 4: Ball grid array Chapter 5: Thermoelectric cooling Chapter 6: Flip chip Chapter 7: Thermoelectric materials Chapter 8: Desoldering Chapter 9: Thermal management (electronics) Chapter 10: Power electronic substrate Chapter 11: Flat no-leads package Chapter 12: Thermoelectric generator Chapter 13: Thermal management of high-power LEDs Chapter 14: Microvia Chapter 15: Thick-film technology Chapter 16: Soldering Chapter 17: Failure of electronic components Chapter 18: Glass frit bonding Chapter 19: Decapping Chapter 20: Thermal inductance Chapter 21: Glossary of microelectronics manufacturing terms (II) Answering the public top questions about thermal copper pillar bump. (III) Real world examples for the usage of thermal copper pillar bump in many fields. (IV) 17 appendices to explain, briefly, 266 emerging technologies in each industry to have 360-degree full understanding of thermal copper pillar bump' technologies. Who This Book Is For Professionals, undergraduate and graduate students, enthusiasts, hobbyists, and those who want to go beyond basic knowledge or information for any kind of thermal copper pillar bump.
Author : Jun Dai
Publisher : Springer Science & Business Media
ISBN 13 : 1461456029
Total Pages : 186 pages
Book Rating : 4.4/5 (614 download)
Download or read book Optimum Cooling of Data Centers written by Jun Dai and published by Springer Science & Business Media. This book was released on 2013-11-20 with total page 186 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the use of free air cooling to improve the efficiency of, and cooling of, equipment for use in telecom infrastructures. Discussed at length is the cooling of communication installation rooms such as data centers or base stations, and this is intended as a valuable tool for the people designing and manufacturing key parts of communication networks. This book provides an introduction to current cooling methods used for energy reduction, and also compares present cooling methods in use in the field. The qualification methods and standard reliability assessments are reviewed, and their inability to assess the risks of free air cooling is discussed. The method of identifying the risks associated with free air cooling on equipment performance and reliability is introduced. A novel method of assessment for free air cooling is also proposed that utilizes prognostics and health management (PHM). This book also: Describes how the implementation of free air cooling can save energy for cooling within the telecommunications infrastructure. Analyzes the potential risks and failures of mechanisms possible in the implementation of free air cooling, which benefits manufacturers and equipment designers. Presents prognostics-based assessments to identify and mitigate the risks of telecommunications equipment under free air cooling conditions, which can provide the early warning of equipment failures at operation stage without disturbing the data centers' service. Optimum Cooling for Data Centers is an ideal book for researchers and engineers interested in designing and manufacturing equipment for use in telecom infrastructures.
Author : Xingcun Colin Tong
Publisher : Springer Science & Business Media
ISBN 13 : 1441977597
Total Pages : 633 pages
Book Rating : 4.4/5 (419 download)
Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Author : Clemens J.M. Lasance
Publisher : Springer Science & Business Media
ISBN 13 : 1461450918
Total Pages : 551 pages
Book Rating : 4.4/5 (614 download)
Download or read book Thermal Management for LED Applications written by Clemens J.M. Lasance and published by Springer Science & Business Media. This book was released on 2013-09-17 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.
Author : Kaveh Azar
Publisher : Advanced Thermal Solutions
ISBN 13 : 0984627928
Total Pages : 182 pages
Book Rating : 4.9/5 (846 download)
Download or read book Qpedia Thermal Management eMagazine, Volume 4 written by Kaveh Azar and published by Advanced Thermal Solutions. This book was released on 2011 with total page 182 pages. Available in PDF, EPUB and Kindle. Book excerpt: The complete editorial contents of Qpedia Thermal 4, Issues 1 - 12 features 48 in-depth articles that discuss critical case studies, calculations and analysis for thermal engineering professionals and academia.
Author : E. Beyne
Publisher : Springer Science & Business Media
ISBN 13 : 9401155062
Total Pages : 358 pages
Book Rating : 4.4/5 (11 download)
Download or read book Thermal Management of Electronic Systems II written by E. Beyne and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.
Author :
Publisher :
ISBN 13 :
Total Pages : 704 pages
Book Rating : 4.0/5 ( download)
Download or read book Official Gazette of the United States Patent and Trademark Office written by and published by . This book was released on 2002 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Jörg Henkel
Publisher : Springer Nature
ISBN 13 : 303052017X
Total Pages : 606 pages
Book Rating : 4.0/5 (35 download)
Download or read book Dependable Embedded Systems written by Jörg Henkel and published by Springer Nature. This book was released on 2020-12-09 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems.
Author : Greg F. Naterer
Publisher : CRC Press
ISBN 13 : 1351262238
Total Pages : 537 pages
Book Rating : 4.3/5 (512 download)
Download or read book Advanced Heat Transfer written by Greg F. Naterer and published by CRC Press. This book was released on 2018-05-03 with total page 537 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Heat Transfer, Second Edition provides a comprehensive presentation of intermediate and advanced heat transfer, and a unified treatment including both single and multiphase systems. It provides a fresh perspective, with coverage of new emerging fields within heat transfer, such as solar energy and cooling of microelectronics. Conductive, radiative and convective modes of heat transfer are presented, as are phase change modes. Using the latest solutions methods, the text is ideal for the range of engineering majors taking a second-level heat transfer course/module, which enables them to succeed in later coursework in energy systems, combustion, and chemical reaction engineering.
Author : Gerald L. Ginsberg
Publisher : Springer Science & Business Media
ISBN 13 : 1461535425
Total Pages : 285 pages
Book Rating : 4.4/5 (615 download)
Download or read book Electronic Equipment Packaging Technology written by Gerald L. Ginsberg and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 285 pages. Available in PDF, EPUB and Kindle. Book excerpt: The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.
Author : Daniel Minoli
Publisher : CRC Press
ISBN 13 : 1466509015
Total Pages : 503 pages
Book Rating : 4.4/5 (665 download)
Download or read book Designing Green Networks and Network Operations written by Daniel Minoli and published by CRC Press. This book was released on 2011-06-06 with total page 503 pages. Available in PDF, EPUB and Kindle. Book excerpt: In recent years, socio-political trends toward environmental responsibility and the pressing need to reduce Run-the-Engine (RTE) costs have resulted in the concept of Green IT. Although a significant amount of energy is used to operate routing, switching, and transmission equipment, comparatively less attention has been paid to Green Networking. A clear and concise introduction to green networks and green network operations, Designing Green Networks and Network Operations: Saving Run-the-Engine Costs guides you through the techniques available to achieve efficiency goals for corporate and carrier networks, including deploying more efficient hardware, blade form-factor routers and switches, and pursuing consolidation, virtualization, and network and cloud computing. The book: Delineates techniques to minimize network power, cooling, floor space, and online storage while optimizing service performance, capacity, and availability Discusses virtualization, network computing, and Web services as approaches for green data centers and networks Emphasizes best practices and compliance with international standards for green operations Extends the green data center techniques to the networking environment Incorporates green principles in the intranet, extranet, and the entire IT infrastructures Reviews networking, power management, HVAC and CRAC basics Presents methodical steps toward a seamless migration to Green IT and Green Networking
Author : Younes Shabany
Publisher : CRC Press
ISBN 13 : 1439814686
Total Pages : 526 pages
Book Rating : 4.4/5 (398 download)
Download or read book Heat Transfer written by Younes Shabany and published by CRC Press. This book was released on 2009-12-17 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Author : Hussam Jouhara
Publisher : Butterworth-Heinemann
ISBN 13 : 0128234652
Total Pages : 353 pages
Book Rating : 4.1/5 (282 download)
Download or read book Heat Pipes written by Hussam Jouhara and published by Butterworth-Heinemann. This book was released on 2023-10-27 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat Pipes: Theory, Design and Applications, Seventh Edition, takes a highly practical approach to the design and selection of heat pipes, making it an essential guide for practicing engineers and an ideal text for postgraduate students. The expanded author team consolidate and update the theoretical background included in previous editions, and include new sections on recent developments in manufacturing methods, wick design and additional applications. The book serves as an introduction to the theory, design and application of the range of passive, two-phase, heat-transfer devices known as heat pipes, serving as an essential reference for those seeking a sound understanding of the principles of heat pipe technology. It provides an introduction to the basic principles of operation and design data which would permit the reader to design and fabricate a basic heat pipe. It also provides details of the various more complex configurations and designs currently available to assist in selecting such devices.This new edition has been fully updated to reflect the latest research and technologies and includes four brand new chapters on various types of heat pipe, theoretical principles of heat transfer and fluid mechanics, additive manufacturing and heat pipe heat exchangers. Fully revised with brand new chapters on Additive Manufacturing and Heat Exchangers Guides the reader through the design and fabrication of a heat pipe Includes detail on more complex configurations and designs available to assist in the election of devices
