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Author :
Publisher :
ISBN 13 :
Total Pages : 392 pages
Book Rating : 4.3/5 (91 download)
Download or read book Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by . This book was released on 2005 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 272 pages
Book Rating : 4.X/5 (4 download)
Download or read book Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1996 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Institute of Electrical and Electronics Engineers
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 312 pages
Book Rating : 4.X/5 (4 download)
Download or read book 1997 IEEE 13th Annual Semiconductor Thermal Measurement & Management Symposium written by Institute of Electrical and Electronics Engineers and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1997 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features coverage of new developments in and applications relating to generation and removal of heat within semiconductor devices, and measurement of junction temperatures under various application and environmental conditions.
Author : Kaveh Azar
Publisher : CRC Press
ISBN 13 : 1000141268
Total Pages : 498 pages
Book Rating : 4.0/5 (1 download)
Download or read book Thermal Measurements in Electronics Cooling written by Kaveh Azar and published by CRC Press. This book was released on 2020-08-26 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: Filled with careful explanations, step-by-step instructions, and useful examples, this handbook focuses on real-world considerations and applications of thermal measurement methods in electronics cooling. Fifteen experts in thermal engineering combine their expertise to create a complete guide to this complex topic. This practical reference covers all aspects of thermal characterization in electronics cooling and thermal management. The first part of the book introduces the concept of electronics cooling and its associated thermal phenomenon and explains why experimental investigation is required. Subsequent chapters explain methods of measuring different parameters and introduce relevant examples. Sources for locating needed equipment, tables, checklists, and to-do lists are included. Sample calculations and methodologies for error analysis ensure that you can put this valuable information to use in your work.
Author : Arman Vassighi
Publisher : Springer Science & Business Media
ISBN 13 : 0387297499
Total Pages : 188 pages
Book Rating : 4.3/5 (872 download)
Download or read book Thermal and Power Management of Integrated Circuits written by Arman Vassighi and published by Springer Science & Business Media. This book was released on 2006-06-01 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
Author : Jemal H. Abawajy
Publisher : Springer
ISBN 13 : 9811317992
Total Pages : 624 pages
Book Rating : 4.8/5 (113 download)
Download or read book Proceedings of the International Conference on Data Engineering 2015 (DaEng-2015) written by Jemal H. Abawajy and published by Springer. This book was released on 2019-08-09 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt: These proceedings gather outstanding research papers presented at the Second International Conference on Data Engineering 2015 (DaEng-2015) and offer a consolidated overview of the latest developments in databases, information retrieval, data mining and knowledge management. The conference brought together researchers and practitioners from academia and industry to address key challenges in these fields, discuss advanced data engineering concepts and form new collaborations. The topics covered include but are not limited to: • Data engineering • Big data • Data and knowledge visualization • Data management • Data mining and warehousing • Data privacy & security • Database theory • Heterogeneous databases • Knowledge discovery in databases • Mobile, grid and cloud computing • Knowledge management • Parallel and distributed data • Temporal data • Web data, services and information engineering • Decision support systems • E-Business engineering and management • E-commerce and e-learning • Geographical information systems • Information management • Information quality and strategy • Information retrieval, integration and visualization • Information security • Information systems and technologies
Author : Márta Rencz
Publisher : MDPI
ISBN 13 : 303943831X
Total Pages : 310 pages
Book Rating : 4.0/5 (394 download)
Download or read book Thermal and Electro-thermal System Simulation 2020 written by Márta Rencz and published by MDPI. This book was released on 2021-01-12 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Author : National Institute of Standards and Technology (U.S.)
Publisher :
ISBN 13 :
Total Pages : 72 pages
Book Rating : 4.:/5 (327 download)
Download or read book Semiconductor Measurement Technology written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 1994 with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Walter Zamboni
Publisher : Springer Nature
ISBN 13 : 3030371611
Total Pages : 749 pages
Book Rating : 4.0/5 (33 download)
Download or read book ELECTRIMACS 2019 written by Walter Zamboni and published by Springer Nature. This book was released on 2020-04-25 with total page 749 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book collects a selection of papers presented at ELECTRIMACS 2019, the 13th international conference of the IMACS TC1 Committee, held in Salerno, Italy, on 21st-23rd May 2019. The conference papers deal with modelling, simulation, analysis, control, power management, design optimization, identification and diagnostics in electrical power engineering. The main application fields include electric machines and electromagnetic devices, power electronics, transportation systems, smart grids, electric and hybrid vehicles, renewable energy systems, energy storage, batteries, supercapacitors and fuel cells, and wireless power transfer. The contributions included in Volume 1 are particularly focused on electrical engineering simulation aspects and innovative applications.
Author :
Publisher : World Scientific
ISBN 13 : 9814520241
Total Pages : 1397 pages
Book Rating : 4.8/5 (145 download)
Download or read book Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) written by and published by World Scientific. This book was released on 2014-10-23 with total page 1397 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Author : Janet Dubbini
Publisher : Universitas Studiorum
ISBN 13 : 8897683681
Total Pages : 125 pages
Book Rating : 4.8/5 (976 download)
Download or read book Proceedings of IX Congress. National Group of Mechanical and Thermal Measurements written by Janet Dubbini and published by Universitas Studiorum. This book was released on 2014-08-30 with total page 125 pages. Available in PDF, EPUB and Kindle. Book excerpt: The ninth Congress of the National Mechanical and Thermal Measurement Group took place in Ancona, Italy, on 11- 13 September 2014. The event aims at creating a lively forum where researchers in the field of Mechanical and Thermal Measurements can present their activities and share current results and technical advances. The papers presented at the event deal with a wide range of subject matters related to the congress theme, including: Automated calibration bench, Biomechanics, Blood pressure FEM model, Calibration, Clinical Measurements, Contact pressure human fingers, Contactless temperature measurement, Cross Correlation, Cuff-arm pressure distribution, Cryotherapy, Damage detection, Distance measurement, Equivalent sampling rate, Fast Fourier Transform, Field of View, Fingertip contact pressure, Flow measurements, Focal Length , Force measurement, Frustrated Total Internal Reflection, FTIR, Hand Held Dynamometer, Heat Flux, Hexapod-design, Historical building monitoring, Infrared, PMV measurement, Infrared Thermography, Laser ablation, Laser Ultrasonics , LDA, Low frequency vibrations etc.
Author : Muhannad S. Bakir
Publisher : Artech House
ISBN 13 : 1596932473
Total Pages : 551 pages
Book Rating : 4.5/5 (969 download)
Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Author : Shripad Revankar
Publisher : Springer Nature
ISBN 13 : 9811578311
Total Pages : 676 pages
Book Rating : 4.8/5 (115 download)
Download or read book Proceedings of International Conference on Thermofluids written by Shripad Revankar and published by Springer Nature. This book was released on 2020-11-21 with total page 676 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents selected and peer-reviewed proceedings of the International Conference on Thermofluids (KIIT Thermo 2020). It focuses on the latest studies and findings in the areas of fluid dynamics, heat transfer, thermodynamics, and combustion. Some of the topics covered in the book include electronic cooling, HVAC system analysis, inverse heat transfer, combustion, nano-fluids, multiphase flow, high-speed flow, and shock waves. The book includes both experimental and numerical studies along with a few review chapters from experienced researchers, and is expected to lead to new research in this important area. This book is of interest to students, researchers as well as practitioners working in the areas of fluid dynamics, thermodynamics, and combustion.
Author : Qi Liu
Publisher : Springer Nature
ISBN 13 : 9811584621
Total Pages : 1770 pages
Book Rating : 4.8/5 (115 download)
Download or read book The 10th International Conference on Computer Engineering and Networks written by Qi Liu and published by Springer Nature. This book was released on 2020-10-05 with total page 1770 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a collection of the papers accepted by the CENet2020 – the 10th International Conference on Computer Engineering and Networks held on October 16-18, 2020 in Xi’an, China. The topics focus but are not limited to Internet of Things and Smart Systems, Artificial Intelligence and Applications, Communication System Detection, Analysis and Application, and Medical Engineering and Information Systems. Each part can be used as an excellent reference by industry practitioners, university faculties, research fellows and undergraduates as well as graduate students who need to build a knowledge base of the most current advances and state-of-practice in the topics covered by this conference proceedings. This will enable them to produce, maintain, and manage systems with high levels of trustworthiness and complexity.
Author : Krzysztof Iniewski
Publisher : John Wiley & Sons
ISBN 13 : 1118181476
Total Pages : 632 pages
Book Rating : 4.1/5 (181 download)
Download or read book Advanced Circuits for Emerging Technologies written by Krzysztof Iniewski and published by John Wiley & Sons. This book was released on 2012-04-17 with total page 632 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book will address the-state-of-the-art in integrated circuit design in the context of emerging systems. New exciting opportunities in body area networks, wireless communications, data networking, and optical imaging are discussed. Emerging materials that can take system performance beyond standard CMOS, like Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP) are explored. Three-dimensional (3-D) CMOS integration and co-integration with sensor technology are described as well. The book is a must for anyone serious about circuit design for future technologies. The book is written by top notch international experts in industry and academia. The intended audience is practicing engineers with integrated circuit background. The book will be also used as a recommended reading and supplementary material in graduate course curriculum. Intended audience is professionals working in the integrated circuit design field. Their job titles might be : design engineer, product manager, marketing manager, design team leader, etc. The book will be also used by graduate students. Many of the chapter authors are University Professors.
Author : Bogdan M. Wilamowski
Publisher : CRC Press
ISBN 13 : 0429584776
Total Pages : 6257 pages
Book Rating : 4.4/5 (295 download)
Download or read book The Industrial Electronics Handbook - Five Volume Set written by Bogdan M. Wilamowski and published by CRC Press. This book was released on 2011-03-04 with total page 6257 pages. Available in PDF, EPUB and Kindle. Book excerpt: Industrial electronics systems govern so many different functions that vary in complexity-from the operation of relatively simple applications, such as electric motors, to that of more complicated machines and systems, including robots and entire fabrication processes. The Industrial Electronics Handbook, Second Edition combines traditional and new
Author : Ravi Pratap Singh
Publisher : Springer Nature
ISBN 13 : 3030734951
Total Pages : 689 pages
Book Rating : 4.0/5 (37 download)
Download or read book Proceedings of the International Conference on Industrial and Manufacturing Systems (CIMS-2020) written by Ravi Pratap Singh and published by Springer Nature. This book was released on 2021-07-24 with total page 689 pages. Available in PDF, EPUB and Kindle. Book excerpt: In order to deal with the societal challenges novel technology plays an important role. For the advancement of technology, Department of Industrial and Production Engineering under the aegis of NIT Jalandhar is organizing an “International Conference on Industrial and Manufacturing Systems” (CIMS-2020) from 26th -28th June, 2020. The present conference aims at providing a leading forum for sharing original research contributions and real-world developments in the field of Industrial and Manufacturing Systems so as to contribute its share for technological advancements. This volume encloses various manuscripts having its roots in the core of industrial and production engineering. Globalization provides all around development and this development is impossible without technological contributions. CIMS-2020, gathered the spirits of various academicians, researchers, scientists and practitioners, answering the vivid issues related to optimisation in the various problems of industrial and manufacturing systems.
