Thermal And Power Management Of Integrated Circuits

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Thermal and Power Management of Integrated Circuits

Author : Arman Vassighi
Publisher : Springer Science & Business Media
ISBN 13 : 0387297499
Total Pages : 188 pages
Book Rating : 4.3/5 (872 download)

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Book Synopsis Thermal and Power Management of Integrated Circuits by : Arman Vassighi

Download or read book Thermal and Power Management of Integrated Circuits written by Arman Vassighi and published by Springer Science & Business Media. This book was released on 2006-06-01 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Power Management Integrated Circuits

Author : Mona M. Hella
Publisher : CRC Press
ISBN 13 : 1315355981
Total Pages : 376 pages
Book Rating : 4.3/5 (153 download)

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Book Synopsis Power Management Integrated Circuits by : Mona M. Hella

Download or read book Power Management Integrated Circuits written by Mona M. Hella and published by CRC Press. This book was released on 2017-12-19 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Management Integrated Circuits and Technologies delivers a modern treatise on mixed-signal integrated circuit design for power management. Comprised of chapters authored by leading researchers from industry and academia, this definitive text: Describes circuit- and architectural-level innovations that meet advanced power and speed capabilities Explores hybrid inductive-capacitive converters for wide-range dynamic voltage scaling Presents innovative control techniques for single inductor dual output (SIDO) and single inductor multiple output (SIMO) converters Discusses cutting-edge design techniques including switching converters for analog/RF loads Compares the use of GaAs pHEMTs to CMOS devices for efficient high-frequency switching converters Thus, Power Management Integrated Circuits and Technologies provides comprehensive, state-of-the-art coverage of this exciting and emerging field of engineering.

Heat and Power Management for High-performance Integrated Circuits [microform]

Author : Arman Vassighi
Publisher : Library and Archives Canada = Bibliothèque et Archives Canada
ISBN 13 : 9780612945975
Total Pages : 254 pages
Book Rating : 4.9/5 (459 download)

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Book Synopsis Heat and Power Management for High-performance Integrated Circuits [microform] by : Arman Vassighi

Download or read book Heat and Power Management for High-performance Integrated Circuits [microform] written by Arman Vassighi and published by Library and Archives Canada = Bibliothèque et Archives Canada. This book was released on 2004 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Heat Management in Integrated Circuits

Author : Seda Ogrenci-Memik
Publisher :
ISBN 13 : 9781523101009
Total Pages : 253 pages
Book Rating : 4.1/5 (1 download)

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Book Synopsis Heat Management in Integrated Circuits by : Seda Ogrenci-Memik

Download or read book Heat Management in Integrated Circuits written by Seda Ogrenci-Memik and published by . This book was released on 2015 with total page 253 pages. Available in PDF, EPUB and Kindle. Book excerpt: "As integrated circuits get smaller and more complex, power densities are increasing, leading to more heat generation. Dealing with this heat is fast becoming the most important design bottleneck of current and future integrated circuits, where power envelopes are defined by the ability of the system to dissipate the generated heat. Thermal effects are forcing chip designers to apply conservative design margins, creating sub-optimal results. At a larger scale, cooling is the second most costly item in the electricity bills of well-designed high-performance computing and data centers, costing 30-50% of the total. Thermal monitoring and management in integrated circuits is therefore becoming increasingly important. This book covers thermal monitoring and management in integrated circuits, with a focus on devices and materials that are intimately integrated on-chip as opposed to in-package or on-board. The devices and circuits discussed include various designs used for the purpose of converting temperature to a digital measurement and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. Topics covered include an overview of heat in integrated circuits and systems, on-chip temperature sensing, dynamic thermal management, active cooling, and mitigating thermal events at the system-level and above"--Provided by publisher.

Design of Power Management Integrated Circuits

Author : Bernhard Wicht
Publisher : John Wiley & Sons
ISBN 13 : 1119123062
Total Pages : 484 pages
Book Rating : 4.1/5 (191 download)

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Book Synopsis Design of Power Management Integrated Circuits by : Bernhard Wicht

Download or read book Design of Power Management Integrated Circuits written by Bernhard Wicht and published by John Wiley & Sons. This book was released on 2024-07-22 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: Comprehensive resource on power management ICs affording new levels of functionality and applications with cost reduction in various fields Design of Power Management Integrated Circuits is a comprehensive reference for power management IC design, covering the circuit design of main power management circuits like linear and switched-mode voltage regulators, along with sub-circuits such as power switches, gate drivers and their supply, level shifters, the error amplifier, current sensing, and control loop design. Circuits for protection and diagnostics, as well as aspects of the physical design like lateral and vertical power delivery, pin-out, floor planning, grounding/supply guidelines, and packaging, are also addressed. A full chapter is dedicated to the design of integrated passives. The text illustrates the application of power management integrated circuits (PMIC) to growth areas like computing, the internet of Things, mobility, and renewable energy. Includes numerous real-world examples, case studies, and exercises illustrating key design concepts and techniques. Offering a unique insight into this rapidly evolving technology through the author's experience developing PMICs in both the industrial and academic environment, Design of Power Management Integrated Circuits includes information on: Capacitive, inductive and hybrid DC-DC converters and their essential circuit blocks, covering error amplifiers, comparators, and ramp generators Sensing, protection, and diagnostics, covering thermal protection, inductive loads and clamping structures, under-voltage, reference and power-on reset generation Integrated MOS, MOM and MIM capacitors, integrated inductors Control loop design and PWM generation ensuring stability and fast transient response; subharmonic oscillations in current mode control (analysis and circuit design for slope compensation) DC behavior and DC-related circuit design, covering power efficiency, line and load regulation, error amplifier, dropout, and power transistor sizing Commonly used level shifters (including sizing rules) and cascaded (tapered) driver sizing and optimization guidelines Optimizing the physical design considering packaging, floor planning, EMI, pinout, PCB design and thermal design Design of Power Management Integrated Circuits is an essential resource on the subject for circuit designers/IC designers, system engineers, and application engineers, along with advanced undergraduate students and graduate students in related programs of study.

Heat Management in Integrated Circuits

Author : Seda Ogrenci-Memik
Publisher : IET
ISBN 13 : 1849199345
Total Pages : 264 pages
Book Rating : 4.8/5 (491 download)

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Book Synopsis Heat Management in Integrated Circuits by : Seda Ogrenci-Memik

Download or read book Heat Management in Integrated Circuits written by Seda Ogrenci-Memik and published by IET. This book was released on 2015-12 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat Management in Integrated Circuits focuses on devices and materials that are intimately integrated on-chip (as opposed to in package or on-board) for the purposes of thermal monitoring and thermal management, i.e., cooling. The devices and circuits cover various designs used for the purpose of converting temperature to a digital measurement, heat to electricity, and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. The book includes fundamental operating principles that touch upon physics of materials that are used to construct sensing, harvesting, and cooling devices, which will be followed by circuit and system design aspects that enable successful functioning of these devices as an on-chip system. Finally, the author discusses the use of these devices and systems for thermal management and the role they play in enabling energy-efficient and sustainable high performance computing systems.

Three-Dimensional Integrated Circuit Design

Author : Vasilis F. Pavlidis
Publisher : Newnes
ISBN 13 : 0124104843
Total Pages : 768 pages
Book Rating : 4.1/5 (241 download)

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Book Synopsis Three-Dimensional Integrated Circuit Design by : Vasilis F. Pavlidis

Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

Power Management Techniques for Integrated Circuit Design

Author : Ke-Horng Chen
Publisher : John Wiley & Sons
ISBN 13 : 1118896815
Total Pages : 562 pages
Book Rating : 4.1/5 (188 download)

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Book Synopsis Power Management Techniques for Integrated Circuit Design by : Ke-Horng Chen

Download or read book Power Management Techniques for Integrated Circuit Design written by Ke-Horng Chen and published by John Wiley & Sons. This book was released on 2016-09-26 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book begins with the premise that energy demands are directing scientists towards ever-greener methods of power management, so highly integrated power control ICs (integrated chip/circuit) are increasingly in demand for further reducing power consumption. A timely and comprehensive reference guide for IC designers dealing with the increasingly widespread demand for integrated low power management Includes new topics such as LED lighting, fast transient response, DVS-tracking and design with advanced technology nodes Leading author (Chen) is an active and renowned contributor to the power management IC design field, and has extensive industry experience Accompanying website includes presentation files with book illustrations, lecture notes, simulation circuits, solution manuals, instructors’ manuals, and program downloads

Power Management Integrated Circuits

Author : Mona M. Hella
Publisher :
ISBN 13 : 9781523107353
Total Pages : 400 pages
Book Rating : 4.1/5 (73 download)

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Book Synopsis Power Management Integrated Circuits by : Mona M. Hella

Download or read book Power Management Integrated Circuits written by Mona M. Hella and published by . This book was released on 2016 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Thermal Testing of Integrated Circuits

Author : J. Altet
Publisher : Springer Science & Business Media
ISBN 13 : 1475736355
Total Pages : 212 pages
Book Rating : 4.4/5 (757 download)

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Book Synopsis Thermal Testing of Integrated Circuits by : J. Altet

Download or read book Thermal Testing of Integrated Circuits written by J. Altet and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt: Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.

Design of 3D Integrated Circuits and Systems

Author : Rohit Sharma
Publisher : CRC Press
ISBN 13 : 1351831593
Total Pages : 328 pages
Book Rating : 4.3/5 (518 download)

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Book Synopsis Design of 3D Integrated Circuits and Systems by : Rohit Sharma

Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Handbook of 3D Integration, Volume 4

Author : Paul D. Franzon
Publisher : John Wiley & Sons
ISBN 13 : 3527697063
Total Pages : 582 pages
Book Rating : 4.5/5 (276 download)

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Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon

Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-01-25 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Advances In 3d Integrated Circuits And Systems

Author : Yu Hao
Publisher : World Scientific
ISBN 13 : 9814699039
Total Pages : 392 pages
Book Rating : 4.8/5 (146 download)

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Book Synopsis Advances In 3d Integrated Circuits And Systems by : Yu Hao

Download or read book Advances In 3d Integrated Circuits And Systems written by Yu Hao and published by World Scientific. This book was released on 2015-08-28 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

Adaptive Cooling of Integrated Circuits Using Digital Microfluidics

Author : Philip Y. Paik
Publisher : Artech House Publishers
ISBN 13 :
Total Pages : 216 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Adaptive Cooling of Integrated Circuits Using Digital Microfluidics by : Philip Y. Paik

Download or read book Adaptive Cooling of Integrated Circuits Using Digital Microfluidics written by Philip Y. Paik and published by Artech House Publishers. This book was released on 2007 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thanks to increasing power consumption and component density, localized hot spots are becoming a serious challenge in IC (integrated circuit) chip design - so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling principles and current bulk cooling methods, the book brings engineers up to speed on emerging droplet-based architectures. Amply illustrated, this milestone work will prove invaluable in tackling IC heat issues that existing methods can no longer address.

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Author : Sung Kyu Lim
Publisher : Springer Science & Business Media
ISBN 13 : 1441995420
Total Pages : 573 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Design for High Performance, Low Power, and Reliable 3D Integrated Circuits by : Sung Kyu Lim

Download or read book Design for High Performance, Low Power, and Reliable 3D Integrated Circuits written by Sung Kyu Lim and published by Springer Science & Business Media. This book was released on 2012-11-27 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.

Power Management Integrated Circuits

Author : Mona M. Hella
Publisher : CRC Press
ISBN 13 : 1482228947
Total Pages : 329 pages
Book Rating : 4.4/5 (822 download)

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Book Synopsis Power Management Integrated Circuits by : Mona M. Hella

Download or read book Power Management Integrated Circuits written by Mona M. Hella and published by CRC Press. This book was released on 2017-12-19 with total page 329 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Management Integrated Circuits and Technologies delivers a modern treatise on mixed-signal integrated circuit design for power management. Comprised of chapters authored by leading researchers from industry and academia, this definitive text: Describes circuit- and architectural-level innovations that meet advanced power and speed capabilities Explores hybrid inductive-capacitive converters for wide-range dynamic voltage scaling Presents innovative control techniques for single inductor dual output (SIDO) and single inductor multiple output (SIMO) converters Discusses cutting-edge design techniques including switching converters for analog/RF loads Compares the use of GaAs pHEMTs to CMOS devices for efficient high-frequency switching converters Thus, Power Management Integrated Circuits and Technologies provides comprehensive, state-of-the-art coverage of this exciting and emerging field of engineering.

Modeling of Electrical Overstress in Integrated Circuits

Author : Carlos H. Diaz
Publisher : Springer Science & Business Media
ISBN 13 : 1461527880
Total Pages : 165 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Modeling of Electrical Overstress in Integrated Circuits by : Carlos H. Diaz

Download or read book Modeling of Electrical Overstress in Integrated Circuits written by Carlos H. Diaz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 165 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electrical overstress (EOS) and Electrostatic discharge (ESD) pose one of the most dominant threats to integrated circuits (ICs). These reliability concerns are becoming more serious with the downward scaling of device feature sizes. Modeling of Electrical Overstress in Integrated Circuits presents a comprehensive analysis of EOS/ESD-related failures in I/O protection devices in integrated circuits. The design of I/O protection circuits has been done in a hit-or-miss way due to the lack of systematic analysis tools and concrete design guidelines. In general, the development of on-chip protection structures is a lengthy expensive iterative process that involves tester design, fabrication, testing and redesign. When the technology is changed, the same process has to be repeated almost entirely. This can be attributed to the lack of efficient CAD tools capable of simulating the device behavior up to the onset of failure which is a 3-D electrothermal problem. For these reasons, it is important to develop and use an adequate measure of the EOS robustness of integrated circuits in order to address the on-chip EOS protection issue. Fundamental understanding of the physical phenomena leading to device failures under ESD/EOS events is needed for the development of device models and CAD tools that can efficiently describe the device behavior up to the onset of thermal failure. Modeling of Electrical Overstress in Integrated Circuits is for VLSI designers and reliability engineers, particularly those who are working on the development of EOS/ESD analysis tools. CAD engineers working on development of circuit level and device level electrothermal simulators will also benefit from the material covered. This book will also be of interest to researchers and first and second year graduate students working in semiconductor devices and IC reliability fields.