Recovery Act Geothermal Technologies Program

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ISBN 13 :
Total Pages : 21 pages
Book Rating : 4.:/5 (16 download)

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Download or read book Recovery Act written by and published by . This book was released on 2013 with total page 21 pages. Available in PDF, EPUB and Kindle. Book excerpt: The U.S. Department of Energy is leading the development of alternative energy sources that will ensure the long-term energy independence of our nation. One of the key renewable resources currently being advanced is geothermal energy. To tap into the large potential offered by generating power from the heat of the earth, and for geothermal energy to be more widely used, it will be necessary to drill deeper wells to reach the hot, dry rock located up to 10 km beneath the earth’s surface. In this instance, water will be introduced into the well to create a geothermal reservoir. A geothermal well produced in this manner is referred to as an enhanced geothermal system (EGS). EGS reservoirs are typically at depths of 3 to 10 km, and the temperatures at these depths have become a limiting factor in the application of existing downhole technologies. These high temperatures are especially problematic for electronic systems such as downhole data-logging tools, which are used to map and characterize the fractures and high-permeability regions in underground formations. Information provided by these tools is assessed so that underground formations capable of providing geothermal energy can be identified, and the subsequent drilling operations can be accurately directed to those locations. The mapping of geothermal resources involves the design and fabrication of sensor packages, including the electronic control modules, to quantify downhole conditions (300°C temperature, high pressure, seismic activity, et cetera). Because of the extreme depths at which these measurements are performed, it is most desirable to perform the sensor signal processing downhole and then transmit the information to the surface. This approach necessitates the use of high-temperature electronics that can operate in the downhole environment. Downhole signal processing in EGS wells will require the development and demonstration of circuit boards that can withstand the elevated temperatures found at these depths. At present, the highest-temperature commercially available circuit boards are based on polyimide materials, and those have maximum use temperatures of 200 to 250°C. In addition to thermal stability, downhole electronics must also be fabricated into high-aspect-ratio packages. For example, the multilayer assemblies produced at SNL were approximately 2.5 cm wide and 50 cm long. Because of this very high form factor, glass-fiber-reinforced polymers are much more desirable than multilayer ceramic modules (MCM). MCMs have many advantages for some applications, but are susceptible to damage induced by the mechanical and vibrational loads commonly experienced by data-logging tools. Thus, as EGS technology continues to advance, there is a strong need for multilayer electronics that can provide the necessary thermal performance while also being compatible with high-form-factor circuit designs. This project involved the design and development of high-temperature circuit materials, as well as the fabrication and testing of circuit components. The material development included the evaluation of various polymer/fiberglass composites, whereas the circuit components were tested using conventional microelectronic evaluation techniques. This effort targeted development of a new class of high-temperature multilayer circuit boards for use in downhole data-logging applications where temperatures are on the order of 300°C. This is consistent with DOE’s multiyear plan for advancing technologies for use in enhanced geothermal systems. Organic and inorganic polymer systems, both with glass reinforcements, were considered to provide the following performance at elevated temperatures: • Mechanical strength and durability • High dielectric strength and electrical resistivity • Thermal stability • Strong adhesion to copper to ensure the reliability of the multilayer assemblies • Processing characteristics that are consistent with state-of-the-art multilayer circuit board manufacturing pages.