Read Books Online and Download eBooks, EPub, PDF, Mobi, Kindle, Text Full Free.
Proceedings Of The Ieee 2005 International Interconnect Technology Conference
Download Proceedings Of The Ieee 2005 International Interconnect Technology Conference full books in PDF, epub, and Kindle. Read online Proceedings Of The Ieee 2005 International Interconnect Technology Conference ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Book Synopsis Advanced Interconnects for ULSI Technology by : Mikhail Baklanov
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-04-02 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Book Synopsis Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications by : Yosi Shacham-Diamand
Download or read book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Book Synopsis Communication Architectures for Systems-on-Chip by : José L. Ayala
Download or read book Communication Architectures for Systems-on-Chip written by José L. Ayala and published by CRC Press. This book was released on 2018-09-03 with total page 449 pages. Available in PDF, EPUB and Kindle. Book excerpt: A presentation of state-of-the-art approaches from an industrial applications perspective, Communication Architectures for Systems-on-Chip shows professionals, researchers, and students how to attack the problem of data communication in the manufacture of SoC architectures. With its lucid illustration of current trends and research improving the performance, quality, and reliability of transactions, this is an essential reference for anyone dealing with communication mechanisms for embedded systems, systems-on-chip, and multiprocessor architectures—or trying to overcome existing limitations. Exploring architectures currently implemented in manufactured SoCs—and those being proposed—this book analyzes a wide range of applications, including: Well-established communication buses Less common networks-on-chip Modern technologies that include the use of carbon nanotubes (CNTs) Optical links used to speed up data transfer and boost both security and quality of service (QoS) The book’s contributors pay special attention to newer problems, including how to protect transactions of critical on-chip information (personal data, security keys, etc.) from an external attack. They examine mechanisms, revise communication protocols involved, and analyze overall impact on system performance.
Book Synopsis Handbook of Thin Film Deposition by : Krishna Seshan
Download or read book Handbook of Thin Film Deposition written by Krishna Seshan and published by William Andrew. This book was released on 2018-02-23 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. - Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes - Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries - Features a new chapter discussing Gates Dielectrics
Book Synopsis Design of 3D Integrated Circuits and Systems by : Rohit Sharma
Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Download or read book Spintronics written by Tomasz Blachowicz and published by Walter de Gruyter GmbH & Co KG. This book was released on 2024-10-07 with total page 308 pages. Available in PDF, EPUB and Kindle. Book excerpt: Spintronics, being a part of electronics, is under intense development for about forty years and mainly concerns transport of electronics spin in low-dimensional structures. This field, based on often difficult theoretical concepts of quantum physics, has surprisingly strong and real technological and application consequences. Thus, spintronic solutions concern memory systems, information processing devices and are used as sensors to detect variety of physical fields. The early development of this field can be associated with the names of such scientists as: E. I. Rashba, A. Fert, P. Grünberg, J. Barnaś, B. Hillebrands, G. Güntherodt, I. K. Schuller, M. Grimsditch, A. Hoffman, P. Vavassori, and S. Datta. This list is absolutely not closed and might be easily extended, however, it results rather from scientific history and contacts with people who influenced the research carriers of the authors. The authors give in this up-dated 2nd edition an insight into this emerging field providing theoretical and experimental aspects of spintronics and guide readers from a basic understanding of fundamental processes to recent applications and future possibilities opened by ongoing research. The textbook is suited for students and for interested scientists who were discouraged by the theoretical formalism only.
Book Synopsis Electromigration in Thin Films and Electronic Devices by : Choong-Un Kim
Download or read book Electromigration in Thin Films and Electronic Devices written by Choong-Un Kim and published by Elsevier. This book was released on 2011-08-28 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field. - Provides up-to-date coverage of the continued development of advanced copper interconnects for integrated circuits - Comprehensively reviews modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation, and x-ray microbeam studies of electromigration - Deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure
Book Synopsis On-Chip Communication Architectures by : Sudeep Pasricha
Download or read book On-Chip Communication Architectures written by Sudeep Pasricha and published by Morgan Kaufmann. This book was released on 2010-07-28 with total page 541 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over the past decade, system-on-chip (SoC) designs have evolved to address the ever increasing complexity of applications, fueled by the era of digital convergence. Improvements in process technology have effectively shrunk board-level components so they can be integrated on a single chip. New on-chip communication architectures have been designed to support all inter-component communication in a SoC design. These communication architecture fabrics have a critical impact on the power consumption, performance, cost and design cycle time of modern SoC designs. As application complexity strains the communication backbone of SoC designs, academic and industrial R&D efforts and dollars are increasingly focused on communication architecture design. On-Chip Communication Architecures is a comprehensive reference on concepts, research and trends in on-chip communication architecture design. It will provide readers with a comprehensive survey, not available elsewhere, of all current standards for on-chip communication architectures. - A definitive guide to on-chip communication architectures, explaining key concepts, surveying research efforts and predicting future trends - Detailed analysis of all popular standards for on-chip communication architectures - Comprehensive survey of all research on communication architectures, covering a wide range of topics relevant to this area, spanning the past several years, and up to date with the most current research efforts - Future trends that with have a significant impact on research and design of communication architectures over the next several years
Book Synopsis Three-Dimensional Integrated Circuit Design by : Vasilis F. Pavlidis
Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Download or read book Electroplating written by Darwin Sebayang and published by BoD – Books on Demand. This book was released on 2012-04-11 with total page 179 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book emphasizes on new applications of electroplating with consideration for environmental aspect and experimental design. Written by experienced expert from various countries, the authors come from academia and electroplating industrial players. Here, a very detailed explanation to the new application of the electroplating is followed by a solution of the environmental issue caused by the electroplating process and concluded by experimental design for optimization of electro deposition processes. Coverage included: 1) Preparation NiO catalyst on FeCrAl Subtrate Using Various Technique at Higher Oxidation Process 2) Electrochemical properties of carbon- supported metal nanoparticle prepared by electroplating methods 3) Fabrication of InGaN-Based Vertical Light Emitting Diodes Using Electroplating 4) Integration Of Electrografted Layers for the Metallization of Deep Through Silicon Vias 5) Biomass adsorbent for removal of toxic metal ions from electroplating industry wastewater 6) Resistant fungal biodiversity of electroplating effluent and their metal tolerance index 7) Experimental design and response surface analysis as available tools for statistical modeling and optimization of electrodeposition processes
Book Synopsis Three-Dimensional Design Methodologies for Tree-based FPGA Architecture by : Vinod Pangracious
Download or read book Three-Dimensional Design Methodologies for Tree-based FPGA Architecture written by Vinod Pangracious and published by Springer. This book was released on 2015-06-25 with total page 239 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
Book Synopsis Handbook of 3D Integration, Volume 1 by : Philip Garrou
Download or read book Handbook of 3D Integration, Volume 1 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2011-09-22 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Book Synopsis Microelectronic Applications of Chemical Mechanical Planarization by : Yuzhuo Li
Download or read book Microelectronic Applications of Chemical Mechanical Planarization written by Yuzhuo Li and published by John Wiley & Sons. This book was released on 2007-10-19 with total page 764 pages. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Book Synopsis Proceedings of the IEEE ... International Interconnect Technology Conferece by :
Download or read book Proceedings of the IEEE ... International Interconnect Technology Conferece written by and published by . This book was released on 2005 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Protecting Chips Against Hold Time Violations Due to Variability by : Gustavo Neuberger
Download or read book Protecting Chips Against Hold Time Violations Due to Variability written by Gustavo Neuberger and published by Springer Science & Business Media. This book was released on 2013-10-01 with total page 114 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the development of Very-Deep Sub-Micron technologies, process variability is becoming increasingly important and is a very important issue in the design of complex circuits. Process variability is the statistical variation of process parameters, meaning that these parameters do not have always the same value, but become a random variable, with a given mean value and standard deviation. This effect can lead to several issues in digital circuit design. The logical consequence of this parameter variation is that circuit characteristics, as delay and power, also become random variables. Because of the delay variability, not all circuits will now have the same performance, but some will be faster and some slower. However, the slowest circuits may be so slow that they will not be appropriate for sale. On the other hand, the fastest circuits that could be sold for a higher price can be very leaky, and also not very appropriate for sale. A main consequence of power variability is that the power consumption of some circuits will be different than expected, reducing reliability, average life expectancy and warranty of products. Sometimes the circuits will not work at all, due to reasons associated with process variations. At the end, these effects result in lower yield and lower profitability. To understand these effects, it is necessary to study the consequences of variability in several aspects of circuit design, like logic gates, storage elements, clock distribution, and any other that can be affected by process variations. The main focus of this book will be storage elements.
Book Synopsis THz Communications by : Thomas Kürner
Download or read book THz Communications written by Thomas Kürner and published by Springer Nature. This book was released on 2021-12-07 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the fundamentals of THz communications, spanning the whole range of applications, propagation and channel models, RF transceiver technology, antennas, baseband techniques, and networking interfaces. The requested data rate in wireless communications will soon reach from 100 Gbit/s up to 1 Tbps necessitating systems with ultra-high bandwidths of several 10s of GHz which are available only above 200 GHz. In the last decade, research at these frequency bands has made significant progress, enabling mature experimental demonstrations of so-called THz communications, which are thus expected to play a vital role in future wireless networks. In addition to chapters by leading experts on the theory, modeling, and implementation of THz communication technology, the book also features the latest experimental results and addresses standardization and regulatory aspects. This book will be of interest to both academic researchers and engineers in the telecommunications industry.
Book Synopsis Noble and Precious Metals by : Mohindar Seehra
Download or read book Noble and Precious Metals written by Mohindar Seehra and published by BoD – Books on Demand. This book was released on 2018-07-04 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: The use of copper, silver, gold and platinum in jewelry as a measure of wealth is well known. This book contains 19 chapters written by international authors on other uses and applications of noble and precious metals (copper, silver, gold, platinum, palladium, iridium, osmium, rhodium, ruthenium, and rhenium). The topics covered include surface-enhanced Raman scattering, quantum dots, synthesis and properties of nanostructures, and its applications in the diverse fields such as high-tech engineering, nanotechnology, catalysis, and biomedical applications. The basis for these applications is their high-free electron concentrations combined with high-temperature stability and corrosion resistance and methods developed for synthesizing nanostructures. Recent developments in all these areas with up-to-date references are emphasized.
