Proceedings Of The Ieee 2001 International Interconnect Technology Conference

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Proceedings of the IEEE 2001 International Interconnect Technology Conference

Author : IEEE Electron Devices Society
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 : 9780780366787
Total Pages : 300 pages
Book Rating : 4.3/5 (667 download)

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Book Synopsis Proceedings of the IEEE 2001 International Interconnect Technology Conference by : IEEE Electron Devices Society

Download or read book Proceedings of the IEEE 2001 International Interconnect Technology Conference written by IEEE Electron Devices Society and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2001 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: Topics covered in this volume include: silicide/salicide; dielectrics; planarization; metallization; process integration; process control/modelling; reliability; and interconnect systems.

Proceedings of the IEEE 2001 International Interconnect Technology Conference

Author :
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (612 download)

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Book Synopsis Proceedings of the IEEE 2001 International Interconnect Technology Conference by :

Download or read book Proceedings of the IEEE 2001 International Interconnect Technology Conference written by and published by . This book was released on 2001 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Proceedings of the IEEE 2000 International Interconnect Technology Conference, Hyatt Regency Hotel, San Francisco Airport, Burlingame, California, June 5-7, 2000

Download Proceedings of the IEEE 2000 International Interconnect Technology Conference, Hyatt Regency Hotel, San Francisco Airport, Burlingame, California, June 5-7, 2000 PDF Online Free

Author : IEEE Electron Devices Society
Publisher : IEEE Standards Office
ISBN 13 : 9780780363274
Total Pages : 277 pages
Book Rating : 4.3/5 (632 download)

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Book Synopsis Proceedings of the IEEE 2000 International Interconnect Technology Conference, Hyatt Regency Hotel, San Francisco Airport, Burlingame, California, June 5-7, 2000 by : IEEE Electron Devices Society

Download or read book Proceedings of the IEEE 2000 International Interconnect Technology Conference, Hyatt Regency Hotel, San Francisco Airport, Burlingame, California, June 5-7, 2000 written by IEEE Electron Devices Society and published by IEEE Standards Office. This book was released on 2000 with total page 277 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work constitutes the proceedings of the 2000 International Interconnect Technology Conference (IITC). It should be useful to process engineers, processing equipment engineers, and engineers and scientists in research and development.

Proceedings of the IEEE ... International Interconnect Technology Conferece

Author :
Publisher :
ISBN 13 :
Total Pages : 288 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Proceedings of the IEEE ... International Interconnect Technology Conferece by :

Download or read book Proceedings of the IEEE ... International Interconnect Technology Conferece written by and published by . This book was released on 2004 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Advanced Interconnects for ULSI Technology

Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 1119966868
Total Pages : 616 pages
Book Rating : 4.1/5 (199 download)

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Book Synopsis Advanced Interconnects for ULSI Technology by : Mikhail Baklanov

Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-02-17 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Proceedings of the IEEE International Interconnect Technology Conference

Author :
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 : 9781424401031
Total Pages : 232 pages
Book Rating : 4.4/5 (1 download)

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Book Synopsis Proceedings of the IEEE International Interconnect Technology Conference by :

Download or read book Proceedings of the IEEE International Interconnect Technology Conference written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2006-01-01 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

Author : Yosi Shacham-Diamand
Publisher : Springer Science & Business Media
ISBN 13 : 0387958681
Total Pages : 545 pages
Book Rating : 4.3/5 (879 download)

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Book Synopsis Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications by : Yosi Shacham-Diamand

Download or read book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

Interlayer Dielectrics for Semiconductor Technologies

Author : Shyam P Muraka
Publisher : Elsevier
ISBN 13 : 0080521959
Total Pages : 459 pages
Book Rating : 4.0/5 (85 download)

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Book Synopsis Interlayer Dielectrics for Semiconductor Technologies by : Shyam P Muraka

Download or read book Interlayer Dielectrics for Semiconductor Technologies written by Shyam P Muraka and published by Elsevier. This book was released on 2003-10-13 with total page 459 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor technologies are moving at such a fast pace that new materials are needed in all types of application. Manipulating the materials and their properties at atomic dimensions has become a must. This book presents the case of interlayer dielectrics materials whilst considering these challenges. Interlayer Dielectrics for Semiconductor Technologies cover the science, properties and applications of dielectrics, their preparation, patterning, reliability and characterisation, followed by the discussion of different materials including those with high dielctric constants and those useful for waveguide applications in optical communications on the chip and the package. * Brings together for the FIRST time the science and technology of interlayer deilectrics materials, in one volume * written by renowned experts in the field * Provides an up-to-date starting point in this young research field.

Oral history interview with Alice Haratunian

Author :
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (265 download)

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Book Synopsis Oral history interview with Alice Haratunian by :

Download or read book Oral history interview with Alice Haratunian written by and published by . This book was released on 1976 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Born in Tokav, Turkey 1899.

International Interconnect Technology Conference, IEEE 2007

Author : Electron Devices Society
Publisher :
ISBN 13 : 9781424410705
Total Pages : 198 pages
Book Rating : 4.4/5 (17 download)

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Book Synopsis International Interconnect Technology Conference, IEEE 2007 by : Electron Devices Society

Download or read book International Interconnect Technology Conference, IEEE 2007 written by Electron Devices Society and published by . This book was released on 2007 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Proceedings of the IEEE 1998 International Interconnect Technology Conference, Hyatt Regency Hotel, San Francisco, CA, June 1-3, 1998

Author :
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 : 9780780342859
Total Pages : 303 pages
Book Rating : 4.3/5 (428 download)

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Book Synopsis Proceedings of the IEEE 1998 International Interconnect Technology Conference, Hyatt Regency Hotel, San Francisco, CA, June 1-3, 1998 by :

Download or read book Proceedings of the IEEE 1998 International Interconnect Technology Conference, Hyatt Regency Hotel, San Francisco, CA, June 1-3, 1998 written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1998-01-01 with total page 303 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume is based on a conference designed to provide a forum for profesionals in semiconductor processing, academia and equipment development to present new science and technology. Topics include: interconnect technology trends; interconnect reliability; and more.

Microelectronic Applications of Chemical Mechanical Planarization

Author : Yuzhuo Li
Publisher : John Wiley & Sons
ISBN 13 : 9780470180891
Total Pages : 760 pages
Book Rating : 4.1/5 (88 download)

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Book Synopsis Microelectronic Applications of Chemical Mechanical Planarization by : Yuzhuo Li

Download or read book Microelectronic Applications of Chemical Mechanical Planarization written by Yuzhuo Li and published by John Wiley & Sons. This book was released on 2007-12-04 with total page 760 pages. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

CMOS and Beyond

Author : Tsu-Jae King Liu
Publisher : Cambridge University Press
ISBN 13 : 1107043182
Total Pages : 439 pages
Book Rating : 4.1/5 (7 download)

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Book Synopsis CMOS and Beyond by : Tsu-Jae King Liu

Download or read book CMOS and Beyond written by Tsu-Jae King Liu and published by Cambridge University Press. This book was released on 2015-02-05 with total page 439 pages. Available in PDF, EPUB and Kindle. Book excerpt: Get up to speed with the future of logic switch design with this indispensable introduction to post-CMOS technologies.

Three-Dimensional Integrated Circuit Design

Author : Vasilis F. Pavlidis
Publisher : Newnes
ISBN 13 : 0124104843
Total Pages : 770 pages
Book Rating : 4.1/5 (241 download)

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Book Synopsis Three-Dimensional Integrated Circuit Design by : Vasilis F. Pavlidis

Download or read book Three-Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

ULSI Process Integration 5

Author : Cor L. Claeys
Publisher : The Electrochemical Society
ISBN 13 : 1566775728
Total Pages : 509 pages
Book Rating : 4.5/5 (667 download)

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Book Synopsis ULSI Process Integration 5 by : Cor L. Claeys

Download or read book ULSI Process Integration 5 written by Cor L. Claeys and published by The Electrochemical Society. This book was released on 2007 with total page 509 pages. Available in PDF, EPUB and Kindle. Book excerpt: The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.

Analysis and Design of Networks-on-Chip Under High Process Variation

Author : Rabab Ezz-Eldin
Publisher : Springer
ISBN 13 : 3319257668
Total Pages : 156 pages
Book Rating : 4.3/5 (192 download)

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Book Synopsis Analysis and Design of Networks-on-Chip Under High Process Variation by : Rabab Ezz-Eldin

Download or read book Analysis and Design of Networks-on-Chip Under High Process Variation written by Rabab Ezz-Eldin and published by Springer. This book was released on 2015-12-16 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes in detail the impact of process variations on Network-on-Chip (NoC) performance. The authors evaluate various NoC topologies under high process variation and explain the design of efficient NoCs, with advanced technologies. The discussion includes variation in logic and interconnect, in order to evaluate the delay and throughput variation with different NoC topologies. The authors describe an asynchronous router, as a robust design to mitigate the impact of process variation in NoCs and the performance of different routing algorithms is determined with/without process variation for various traffic patterns. Additionally, a novel Process variation Delay and Congestion aware Routing algorithm (PDCR) is described for asynchronous NoC design, which outperforms different adaptive routing algorithms in the average delay and saturation throughput for various traffic patterns.

Handbook of 3D Integration, Volume 3

Author : Philip Garrou
Publisher : John Wiley & Sons
ISBN 13 : 3527334661
Total Pages : 484 pages
Book Rating : 4.5/5 (273 download)

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Book Synopsis Handbook of 3D Integration, Volume 3 by : Philip Garrou

Download or read book Handbook of 3D Integration, Volume 3 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2014-07-21 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.