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Proceedings Of The 1992 International Conference On Multichip Modules
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Author :International Conference and Exhibition on Multichip Modules Publisher : ISBN 13 :9780930815325 Total Pages :498 pages Book Rating :4.8/5 (153 download)
Book Synopsis Proceedings of the 1992 International Conference on Multichip Modules by : International Conference and Exhibition on Multichip Modules
Download or read book Proceedings of the 1992 International Conference on Multichip Modules written by International Conference and Exhibition on Multichip Modules and published by . This book was released on 1992 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the 1992 International Symposium on Microelectronics, October 19-21, 1992, Moscone Center, San Francisco, California by : International Society for Hybrid Microelectronics
Download or read book Proceedings of the 1992 International Symposium on Microelectronics, October 19-21, 1992, Moscone Center, San Francisco, California written by International Society for Hybrid Microelectronics and published by . This book was released on 1992 with total page 776 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chip On Board written by John H. Lau and published by Springer Science & Business Media. This book was released on 1994-06-30 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Book Synopsis Conceptual Design of Multichip Modules and Systems by : Peter A. Sandborn
Download or read book Conceptual Design of Multichip Modules and Systems written by Peter A. Sandborn and published by Springer Science & Business Media. This book was released on 2013-03-14 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt: Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.
Book Synopsis Handbook of Adhesives and Sealants by : Phillipe Cognard
Download or read book Handbook of Adhesives and Sealants written by Phillipe Cognard and published by Elsevier. This book was released on 2005-07-14 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Adhesives and Sealants is the most comprehensive Adhesives and Sealants Handbook ever published, with the cooperation of around 35 authors from all over the world – each one a specialist in their field. It will include 80 chapters dealing with general information, theory of bonding and sealing, design of bonding parts, technical characteristics, chemistry, types of adhesives, application, equipment, controls, standards etc. Industrial applications such as automotive, aeronautics, building and civil engineering, electronics, packaging, wood, furniture, metals, plastics and composites, textiles, footwear etc. Over 1,000 real-life examples illustrate the do's and don'ts of using adhesives Every scientific and technical issue concerning every chemical type in every industry Designed to help solve problems quickly, the content is structured to allow readers to navigate this comprehensive resource in 4 different ways
Book Synopsis Proceedings, 1992 IEEE Multi-Chip Module Conference, MCMC-92 by :
Download or read book Proceedings, 1992 IEEE Multi-Chip Module Conference, MCMC-92 written by and published by . This book was released on 1992 with total page 181 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings, 1996 International Conference on Multichip Modules by :
Download or read book Proceedings, 1996 International Conference on Multichip Modules written by and published by . This book was released on 1996 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Multi-Chip Module Test Strategies by : Yervant Zorian
Download or read book Multi-Chip Module Test Strategies written by Yervant Zorian and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt: MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
Book Synopsis Management of Design by : Sriram Dasu
Download or read book Management of Design written by Sriram Dasu and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: Product design significantly influences product cost and quality, as well as market share and profitability of a firm. Design projects often involve many people belonging to different functional areas and in many organizations several design projects may be under way at the same time. Due to this complexity, management of design has given rise to a rich set of research problems in management and engineering. In this volume, design is considered as the planning and specification activity prior to fabrication. Design determines what products will be produced, how they will be produced, and when they will be introduced into the market. The quality of the products and the speed with which they are developed are significantly affected by the design process. The design process by which a product is developed is determined by the managerial and engineering practices, tools and techniques. This book presents engineering and management perspectives on design. Topics covered include: Decomposition of product development projects; Tools and techniques for preliminary evaluation of designs; Interface between design and manufacturing, assembly and distribution; Design information flows, and Determination of the scope, timing and duration of projects, and the allocation of resources.
Book Synopsis Integrated Circuit Manufacturability by : José Pineda de Gyvez
Download or read book Integrated Circuit Manufacturability written by José Pineda de Gyvez and published by John Wiley & Sons. This book was released on 1998-10-30 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: "INTEGRATED CIRCUIT MANUFACTURABILITY provides comprehensive coverage of the process and design variables that determine the ease and feasibility of fabrication (or manufacturability) of contemporary VLSI systems and circuits. This book progresses from semiconductor processing to electrical design to system architecture. The material provides a theoretical background as well as case studies, examining the entire design for the manufacturing path from circuit to silicon. Each chapter includes tutorial and practical applications coverage. INTEGRATED CIRCUIT MANUFACTURABILITY illustrates the implications of manufacturability at every level of abstraction, including the effects of defects on the layout, their mapping to electrical faults, and the corresponding approaches to detect such faults. The reader will be introduced to key practical issues normally applied in industry and usually required by quality, product, and design engineering departments in today's design practices: * Yield management strategies * Effects of spot defects * Inductive fault analysis and testing * Fault-tolerant architectures and MCM testing strategies. This book will serve design and product engineers both from academia and industry. It can also be used as a reference or textbook for introductory graduate-level courses on manufacturing."
Download or read book Proceedings written by and published by . This book was released on 1995 with total page 592 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Microelectronics Packaging Handbook by : R.R. Tummala
Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Book Synopsis Proceedings of the ... International Symposium on Microelectronics by :
Download or read book Proceedings of the ... International Symposium on Microelectronics written by and published by . This book was released on 2001 with total page 816 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Microelectronics Packaging Handbook by : Rao Tummala
Download or read book Microelectronics Packaging Handbook written by Rao Tummala and published by Springer Science & Business Media. This book was released on 1997-01-31 with total page 662 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Book Synopsis Handbook of 3D Integration, Volume 3 by : Philip Garrou
Download or read book Handbook of 3D Integration, Volume 3 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2014-07-21 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
Book Synopsis Proceedings of the 1995 International Conference on Parallel Processing by : Dharma P. Agrawal
Download or read book Proceedings of the 1995 International Conference on Parallel Processing written by Dharma P. Agrawal and published by CRC Press. This book was released on 1995-08-08 with total page 174 pages. Available in PDF, EPUB and Kindle. Book excerpt: This set of technical books contains all the information presented at the 1995 International Conference on Parallel Processing. This conference, held August 14 - 18, featured over 100 lectures from more than 300 contributors, and included three panel sessions and three keynote addresses. The international authorship includes experts from around the globe, from Texas to Tokyo, from Leiden to London. Compiled by faculty at the University of Illinois and sponsored by Penn State University, these Proceedings are a comprehensive look at all that's new in the field of parallel processing.
Book Synopsis Fan-Out Wafer-Level Packaging by : John H. Lau
Download or read book Fan-Out Wafer-Level Packaging written by John H. Lau and published by Springer. This book was released on 2018-04-05 with total page 303 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.
