Power Integrity Modeling And Design For Semiconductors And Systems

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Power Integrity Modeling and Design for Semiconductors and Systems

Author : Madhavan Swaminathan
Publisher : Pearson Education
ISBN 13 : 0132797178
Total Pages : 597 pages
Book Rating : 4.1/5 (327 download)

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Book Synopsis Power Integrity Modeling and Design for Semiconductors and Systems by : Madhavan Swaminathan

Download or read book Power Integrity Modeling and Design for Semiconductors and Systems written by Madhavan Swaminathan and published by Pearson Education. This book was released on 2007-11-19 with total page 597 pages. Available in PDF, EPUB and Kindle. Book excerpt: The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.

Power Integrity Modeling and Design for Semiconductors and Systems

Author : Madhavan Swaminathan
Publisher :
ISBN 13 : 9788131738368
Total Pages : 496 pages
Book Rating : 4.7/5 (383 download)

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Book Synopsis Power Integrity Modeling and Design for Semiconductors and Systems by : Madhavan Swaminathan

Download or read book Power Integrity Modeling and Design for Semiconductors and Systems written by Madhavan Swaminathan and published by . This book was released on 2007 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt: The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.

Power Integrity for I/O Interfaces

Author : Vishram S. Pandit
Publisher : Pearson Education
ISBN 13 : 0132596962
Total Pages : 464 pages
Book Rating : 4.1/5 (325 download)

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Book Synopsis Power Integrity for I/O Interfaces by : Vishram S. Pandit

Download or read book Power Integrity for I/O Interfaces written by Vishram S. Pandit and published by Pearson Education. This book was released on 2010-10-13 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: Foreword by Joungho Kim The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts In this book, three industry experts introduce state-of-the-art power integrity design techniques for today’s most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability. After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB power distribution networks (PDNs) and signal networks, carefully reviewing their interactions. Next, they walk through end-to-end PDN and signal network design in frequency domain, addressing crucial parameters such as self and transfer impedance. They thoroughly address modeling and characterization of on-chip components of PDNs and signal networks, evaluation of power-to-signal coupling coefficients, analysis of Simultaneous Switching Output (SSO) noise, and many other topics. Coverage includes The exponentially growing challenge of I/O power integrity in high-speed digital systems PDN noise analysis and its timing impact for single-ended and differential interfaces Concurrent design and co-simulation techniques for evaluating all power integrity effects on signal integrity Time domain gauges for designing and optimizing components and systems Power/signal integrity interaction mechanisms, including power noise coupling onto signal trace and noise amplification through signal resonance Performance impact due to Inter Symbol Interference (ISI), crosstalk, and SSO noise, as well as their interactions Validation techniques, including low impedance VNA measurements, power noise measurements, and characterization of power-to-signal coupling effects Power Integrity for I/O Interfaces will be an indispensable resource for everyone concerned with power integrity in cutting-edge digital designs, including system design and hardware engineers, signal and power integrity engineers, graduate students, and researchers.

Signal and Power Integrity--simplified

Author : Eric Bogatin
Publisher : Pearson Education
ISBN 13 : 0132349795
Total Pages : 793 pages
Book Rating : 4.1/5 (323 download)

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Book Synopsis Signal and Power Integrity--simplified by : Eric Bogatin

Download or read book Signal and Power Integrity--simplified written by Eric Bogatin and published by Pearson Education. This book was released on 2010 with total page 793 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the inclusion of the two new hot topics in signal integrity, power integrity and high speed serial links, this book will be the most up to date complete guide to understanding and designing for signal integrity.

Power Integrity for I/O Interfaces

Author : Vishram S. Pandit
Publisher :
ISBN 13 : 9780132596947
Total Pages : 0 pages
Book Rating : 4.5/5 (969 download)

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Book Synopsis Power Integrity for I/O Interfaces by : Vishram S. Pandit

Download or read book Power Integrity for I/O Interfaces written by Vishram S. Pandit and published by . This book was released on 2010 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Foreword by Joungho Kim The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts In this book, three industry experts introduce state-of-the-art power integrity design techniques for today's most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability. After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB power distribution networks (PDNs) and signal networks, carefully reviewing their interactions. Next, they walk through end-to-end PDN and signal network design in frequency domain, addressing crucial parameters such as self and transfer impedance. They thoroughly address modeling and characterization of on-chip components of PDNs and signal networks, evaluation of power-to-signal coupling coefficients, analysis of Simultaneous Switching Output (SSO) noise, and many other topics. Coverage includes • The exponentially growing challenge of I/O power integrity in high-speed digital systems • PDN noise analysis and its timing impact for single-ended and differential interfaces • Concurrent design and co-simulation techniques for evaluating all power integrity effects on signal integrity • Time domain gauges for designing and optimizing components and systems • Power/signal integrity interaction mechanisms, including power noise coupling onto signal trace and noise amplification through signal resonance • Performance impact due to Inter Symbol Interference (ISI), crosstalk, and SSO noise, as well as their interactions • Validation techniques, including low impedance VNA measurements, power noise measurements, and characterization of power-to-signal coupling effects Power Integrity for I/O Interfaces will be an indispensable resource for everyone concerned with power integrity in cutting-edge digital designs, including system design and hardware engineers, signal and power integrity engineers, graduate students, and researchers.

Semiconductor Modeling:

Author : Roy Leventhal
Publisher : Springer Science & Business Media
ISBN 13 : 0387241604
Total Pages : 769 pages
Book Rating : 4.3/5 (872 download)

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Book Synopsis Semiconductor Modeling: by : Roy Leventhal

Download or read book Semiconductor Modeling: written by Roy Leventhal and published by Springer Science & Business Media. This book was released on 2007-01-10 with total page 769 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discusses process variation, model accuracy, design flow and many other practical engineering, reliability and manufacturing issues Gives a good overview for a person who is not an expert in modeling and simulation, enabling them to extract the necessary information to competently use modeling and simulation programs Written for engineering students and product design engineers

Principles of Power Integrity for PDN Design--Simplified

Author : Larry D. Smith
Publisher : Prentice Hall
ISBN 13 : 0132735628
Total Pages : 831 pages
Book Rating : 4.1/5 (327 download)

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Book Synopsis Principles of Power Integrity for PDN Design--Simplified by : Larry D. Smith

Download or read book Principles of Power Integrity for PDN Design--Simplified written by Larry D. Smith and published by Prentice Hall. This book was released on 2017-04-06 with total page 831 pages. Available in PDF, EPUB and Kindle. Book excerpt: Consistently Design PDNs That Deliver Reliable Performance at the Right Cost Too often, PDN designs work inconsistently, and techniques that work in some scenarios seem to fail inexplicably in others. This book explains why and presents realistic processes for getting PDN designs right in any new product. Drawing on 60+ years of signal and power integrity experience, Larry Smith and Eric Bogatin show how to manage noise and electrical performance, and complement intuition with analysis to balance cost, performance, risk, and schedule. Throughout, they distill the essence of complex real-world problems, quantify core principles via approximation, and apply them to specific examples. For easy usage, dozens of key concepts and observations are highlighted as tips and listed in quick, chapter-ending summaries. Coverage includes • A practical, start-to-finish approach to consistently meeting PDN performance goals • Understanding how signals interact with interconnects • Identifying root causes of common problems, so you can avoid them • Leveraging analysis tools to efficiently explore design space and optimize tradeoffs • Analyzing impedance-related properties of series and parallel RLC circuits • Measuring low impedance for components and entire PDN ecologies • Predicting loop inductance from physical design features • Reducing peak impedances from combinations of capacitors • Understanding power and ground plane properties in the PDN interconnect • Taming signal integrity problems when signals change return planes • Reducing peak impedance created by on-die capacitance and package lead inductance • Controlling transient current waveform interactions with PDN features • Simple spreadsheet-based analysis techniques for quickly creating first-pass designs This guide will be indispensable for all engineers involved in PDN design, including product, board, and chip designers; system, hardware, component, and package engineers; power supply designers, SI and EMI engineers, sales engineers, and their managers.

Power Integrity for I/O Interfaces

Author : Vishram S. Pandit
Publisher :
ISBN 13 :
Total Pages : 417 pages
Book Rating : 4.:/5 (12 download)

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Book Synopsis Power Integrity for I/O Interfaces by : Vishram S. Pandit

Download or read book Power Integrity for I/O Interfaces written by Vishram S. Pandit and published by . This book was released on 1900 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: Foreword by Joungho Kim The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts In this book, three industry experts introduce state-of-the-art power integrity design techniques for today's most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability. After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB p.

Fundamentals of Power Integrity for Computer Platforms and Systems

Author : Joseph T. DiBene, II
Publisher : John Wiley & Sons
ISBN 13 : 1118826345
Total Pages : 280 pages
Book Rating : 4.1/5 (188 download)

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Book Synopsis Fundamentals of Power Integrity for Computer Platforms and Systems by : Joseph T. DiBene, II

Download or read book Fundamentals of Power Integrity for Computer Platforms and Systems written by Joseph T. DiBene, II and published by John Wiley & Sons. This book was released on 2014-05-16 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: An all-encompassing text that focuses on the fundamentals ofpower integrity Power integrity is the study of power distribution from thesource to the load and the system level issues that can occuracross it. For computer systems, these issues can range from insidethe silicon to across the board and may egress into other parts ofthe platform, including thermal, EMI, and mechanical. With a focus on computer systems and silicon level powerdelivery, this book sheds light on the fundamentals of powerintegrity, utilizing the author’s extensive background in thepower integrity industry and unique experience in silicon powerarchitecture, design, and development. Aimed at engineersinterested in learning the essential and advanced topics of thefield, this book offers important chapter coverage of fundamentalsin power distribution, power integrity analysis basics,system-level power integrity considerations, power conversion incomputer systems, chip-level power, and more. Fundamentals of Power Integrity for Computer Platforms andSystems: Introduces readers to both the field of power integrity and toplatform power conversion Provides a unique focus on computer systems and silicon levelpower delivery unavailable elsewhere Offers detailed analysis of common problems in theindustry Reviews electromagnetic field and circuit representation Includes a detailed bibliography of references at the end ofeach chapter Works out multiple example problems within each chapter Including additional appendixes of tables and formulas,Fundamentals of Power Integrity for Computer Platforms andSystems is an ideal introductory text for engineers of powerintegrity as well as those in the chip design industry,specifically physical design and packaging.

Electrical Modeling and Design for 3D System Integration

Author : Er-Ping Li
Publisher : John Wiley & Sons
ISBN 13 : 0470623462
Total Pages : 394 pages
Book Rating : 4.4/5 (76 download)

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Book Synopsis Electrical Modeling and Design for 3D System Integration by : Er-Ping Li

Download or read book Electrical Modeling and Design for 3D System Integration written by Er-Ping Li and published by John Wiley & Sons. This book was released on 2012-04-10 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

Power Integrity for Electrical and Computer Engineers

Author : J. Ted Dibene, II
Publisher : John Wiley & Sons
ISBN 13 : 1119263247
Total Pages : 560 pages
Book Rating : 4.1/5 (192 download)

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Book Synopsis Power Integrity for Electrical and Computer Engineers by : J. Ted Dibene, II

Download or read book Power Integrity for Electrical and Computer Engineers written by J. Ted Dibene, II and published by John Wiley & Sons. This book was released on 2019-09-24 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: A professional guide to the fundamentals of power integrity analysis with an emphasis on silicon level power integrity Power Integrity for Electrical and Computer Engineers embraces the most recent changes in the field, offers a comprehensive introduction to the discipline of power integrity, and provides an overview of the fundamental principles. Written by noted experts on the topic, the book goes beyond most other resources to focus on the detailed aspects of silicon and optimization techniques in order to broaden the field of study. This important book offers coverage of a wide range of topics including signal analysis, EM concepts for PI, frequency domain analysis for PI, numerical methods (overview) for PI, and silicon device PI modeling. Power Integrity for Electrical and Computer Engineers examine platform technologies, system considerations, power conversion, system level modeling, and optimization methodologies. To reinforce the material presented, the authors include example problems. This important book: • Includes coverage on convergence, accuracy, and error analysis and explains how these can be used to analyze power integrity problems • Contains information for modeling the power converter from the PDN to the load in a full system level model • Explores areas of device level modeling of silicon as related to power integrity • Contains example word problems that are related to an individual chapter’s subject Written for electrical and computer engineers and academics, Power Integrity for Electrical and Computer Engineers is an authoritative guide to the fundamentals of power integrity and explores the topics of power integrity analysis, power integrity analytics, silicon level power integrity, and optimization techniques.

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Author : Xing-Chang Wei
Publisher : CRC Press
ISBN 13 : 1315305860
Total Pages : 322 pages
Book Rating : 4.3/5 (153 download)

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Book Synopsis Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging by : Xing-Chang Wei

Download or read book Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017-09-19 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

Power Integrity Analysis and Management for Integrated Circuits

Author : Raj Nair
Publisher : Prentice-Hall PTR
ISBN 13 : 9780137011223
Total Pages : 0 pages
Book Rating : 4.0/5 (112 download)

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Book Synopsis Power Integrity Analysis and Management for Integrated Circuits by : Raj Nair

Download or read book Power Integrity Analysis and Management for Integrated Circuits written by Raj Nair and published by Prentice-Hall PTR. This book was released on 2010 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: As chips continue to scale, power integrity issues are introducing unexpected project complexity and cost. In this book, two leading industry innovators thoroughly discuss the power integrity challenges that engineers face in designing at nanoscale levels, introduce new analysis and management techniques for addressing these issues, and provide breakthrough tools for hands-on problem solving. --

Timing Analysis and Simulation for Signal Integrity Engineers

Author : Greg Edlund
Publisher : Pearson Education
ISBN 13 : 0132797186
Total Pages : 271 pages
Book Rating : 4.1/5 (327 download)

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Book Synopsis Timing Analysis and Simulation for Signal Integrity Engineers by : Greg Edlund

Download or read book Timing Analysis and Simulation for Signal Integrity Engineers written by Greg Edlund and published by Pearson Education. This book was released on 2007-10-22 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt: Every day, companies call upon their signal integrity engineers to make difficult decisions about design constraints and timing margins. Can I move these wires closer together? How many holes can I drill in this net? How far apart can I place these chips? Each design is unique: there’s no single recipe that answers all the questions. Today’s designs require ever greater precision, but design guides for specific digital interfaces are by nature conservative. Now, for the first time, there’s a complete guide to timing analysis and simulation that will help you manage the tradeoffs between signal integrity, performance, and cost. Writing from the perspective of a practicing SI engineer and team lead, Greg Edlund of IBM presents deep knowledge and quantitative techniques for making better decisions about digital interface design. Edlund shares his insights into how and why digital interfaces fail, revealing how fundamental sources of pathological effects can combine to create fault conditions. You won’t just learn Edlund’s expert techniques for avoiding failures: you’ll learn how to develop the right approach for your own projects and environment. Coverage includes • Systematically ensure that interfaces will operate with positive timing margin over the product’s lifetime–without incurring excess cost • Understand essential chip-to-chip timing concepts in the context of signal integrity • Collect the right information upfront, so you can analyze new designs more effectively • Review the circuits that store information in CMOS state machines–and how they fail • Learn how to time common-clock, source synchronous, and high-speed serial transfers • Thoroughly understand how interconnect electrical characteristics affect timing: propagation delay, impedance profile, crosstalk, resonances, and frequency-dependent loss • Model 3D discontinuities using electromagnetic field solvers • Walk through four case studies: coupled differential vias, land grid array connector, DDR2 memory data transfer, and PCI Express channel • Appendices present a refresher on SPICE modeling and a high-level conceptual framework for electromagnetic field behavior Objective, realistic, and practical, this is the signal integrity resource engineers have been searching for. Preface xiii Acknowledgments xvi About the Author xix About the Cover xx Chapter 1: Engineering Reliable Digital Interfaces 1 Chapter 2: Chip-to-Chip Timing 13 Chapter 3: Inside IO Circuits 39 Chapter 4: Modeling 3D Discontinuities 73 Chapter 5: Practical 3D Examples 101 Chapter 6: DDR2 Case Study 133 Chapter 7: PCI Express Case Study 175 Appendix A: A Short CMOS and SPICE Primer 209 Appendix B: A Stroll Through 3D Fields 219 Endnotes 233 Index 235

Jitter, Noise, and Signal Integrity at High-Speed

Author : Mike Peng Li
Publisher : Pearson Education
ISBN 13 : 0132797194
Total Pages : 443 pages
Book Rating : 4.1/5 (327 download)

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Book Synopsis Jitter, Noise, and Signal Integrity at High-Speed by : Mike Peng Li

Download or read book Jitter, Noise, and Signal Integrity at High-Speed written by Mike Peng Li and published by Pearson Education. This book was released on 2007-11-19 with total page 443 pages. Available in PDF, EPUB and Kindle. Book excerpt: State-of-the-art JNB and SI Problem-Solving: Theory, Analysis, Methods, and Applications Jitter, noise, and bit error (JNB) and signal integrity (SI) have become today‘s greatest challenges in high-speed digital design. Now, there’s a comprehensive and up-to-date guide to overcoming these challenges, direct from Dr. Mike Peng Li, cochair of the PCI Express jitter standard committee. One of the field’s most respected experts, Li has brought together the latest theory, analysis, methods, and practical applications, demonstrating how to solve difficult JNB and SI problems in both link components and complete systems. Li introduces the fundamental terminology, definitions, and concepts associated with JNB and SI, as well as their sources and root causes. He guides readers from basic math, statistics, circuit and system models all the way through final applications. Emphasizing clock and serial data communications applications, he covers JNB and SI simulation, modeling, diagnostics, debugging, compliance testing, and much more.

Signal and Power Integrity in Digital Systems

Author : James Edgar Buchanan
Publisher :
ISBN 13 :
Total Pages : 408 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Signal and Power Integrity in Digital Systems by : James Edgar Buchanan

Download or read book Signal and Power Integrity in Digital Systems written by James Edgar Buchanan and published by . This book was released on 1996 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This book shows designers how to ensure signal integrity and control noise in high-speed digital systems - particularly important in a Pentium-paced environment where functional logic design is no longer separable from electrical and mechanical design." "Highlighting TTL, CMOS, and BiCMOS logic applications in a single source, Signal and Power Integrity in Digital Systems provides a practical solutions-oriented approach to a wide variety of relevant interconnection and timing issues." "Special features include noise tolerant logic architectures; power distribution techniques that reduce noise; clock distribution techniques that ensure clock signal quality; signal interconnection techniques that reduce crosstalk, signal loading, and transmission-line effects; how to get optimum performance from high-speed memory devices; and system application tips for high-speed PALs, PLAs, FIFOs, and ASICs." "Designers will also appreciate the practical engineering approximations provided for the calculation of design parameters along with illustrations and numerous tables usable for quick reference and comparison of characteristics." "It's a book every digital designer should have - engineers involved in the design of computers, peripherals, signal processors, and control and communications equipment, as well as young engineers facing their first designs using high-speed logic devices."--BOOK JACKET.Title Summary field provided by Blackwell North America, Inc. All Rights Reserved

A Signal Integrity Engineer's Companion

Author : Geoff Lawday
Publisher : Pearson Education
ISBN 13 : 0132797232
Total Pages : 650 pages
Book Rating : 4.1/5 (327 download)

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Book Synopsis A Signal Integrity Engineer's Companion by : Geoff Lawday

Download or read book A Signal Integrity Engineer's Companion written by Geoff Lawday and published by Pearson Education. This book was released on 2008-06-12 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: A Signal Integrity Engineer’s Companion Real-Time Test and Measurement and Design Simulation Geoff Lawday David Ireland Greg Edlund Foreword by Chris Edwards, Editor, IET Electronics Systems and Software magazine Prentice Hall Modern Semiconductor Design Series Prentice Hall Signal Integrity Library Use Real-World Test and Measurement Techniques to Systematically Eliminate Signal Integrity Problems This is the industry’s most comprehensive, authoritative, and practical guide to modern Signal Integrity (SI) test and measurement for high-speed digital designs. Three of the field’s leading experts guide you through systematically detecting, observing, analyzing, and rectifying both modern logic signal defects and embedded system malfunctions. The authors cover the entire life cycle of embedded system design from specification and simulation onward, illuminating key techniques and concepts with easy-to-understand illustrations. Writing for all electrical engineers, signal integrity engineers, and chip designers, the authors show how to use real-time test and measurement to address today’s increasingly difficult interoperability and compliance requirements. They also present detailed, start-to-finish case studies that walk you through commonly encountered design challenges, including ensuring that interfaces consistently operate with positive timing margins without incurring excessive cost; calculating total jitter budgets; and managing complex tradeoffs in high-speed serial interface design. Coverage includes Understanding the complex signal integrity issues that arise in today’s high-speed designs Learning how eye diagrams, automated compliance tests, and signal analysis measurements can help you identify and solve SI problems Reviewing the electrical characteristics of today’s most widely used CMOS IO circuits Performing signal path analyses based on intuitive Time-Domain Reflectometry (TDR) techniques Achieving more accurate real-time signal measurements and avoiding probe problems and artifacts Utilizing digital oscilloscopes and logic analyzers to make accurate measurements in high-frequency environments Simulating real-world signals that stress digital circuits and expose SI faults Accurately measuring jitter and other RF parameters in wireless applications About the Authors: Dr. Geoff Lawday is Tektronix Professor in Measurement at Buckinghamshire New University, England. He delivers courses in signal integrity engineering and high performance bus systems at the University Tektronix laboratory, and presents signal integrity seminars throughout Europe on behalf of Tektronix. David Ireland, European and Asian design and manufacturing marketing manager for Tektronix, has more than 30 years of experience in test and measurement. He writes regularly on signal integrity for leading technical journals. Greg Edlund, Senior Engineer, IBM Global Engineering Solutions division, has participated in development and testing for ten high-performance computing platforms. He authored Timing Analysis and Simulation for Signal Integrity Engineers (Prentice Hall).