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Author :
Publisher :
ISBN 13 :
Total Pages : 286 pages
Book Rating : 4.3/5 (91 download)
Download or read book Photonics Packaging, Integration, and Interconnects written by and published by . This book was released on 2007 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Ron Ho
Publisher : Springer Science & Business Media
ISBN 13 : 1441965882
Total Pages : 214 pages
Book Rating : 4.4/5 (419 download)
Download or read book Coupled Data Communication Techniques for High-Performance and Low-Power Computing written by Ron Ho and published by Springer Science & Business Media. This book was released on 2010-06-03 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed on-chip wires. Unfortunately, the best known optical systems can provide suitably ?ne resolution only over an area much smaller than a whole wafer. There is no known way to pattern a whole wafer with transistors and wires small enough for modern circuits. Statistical defects present a ?rmer barrier to wafer-scale integration. Flaws appear regularly in integrated circuits; the larger the circuit area, the more probable there is a ?aw. If such ?aws were the result only of dust one might reduce their numbers, but ?aws are also the inevitable result of small scale. Each feature on a modern integrated circuit is carved out by only a small number of photons in the lithographic process. Each transistor gets its electrical properties from only a small number of impurity atoms in its tiny area. Inevitably, the quantized nature of light and the atomic nature of matter produce statistical variations in both the number of photons de?ning each tiny shape and the number of atoms providing the electrical behavior of tiny transistors. No known way exists to eliminate such statistical variation, nor may any be possible.
Author :
Publisher :
ISBN 13 :
Total Pages : 272 pages
Book Rating : 4.3/5 (91 download)
Download or read book Photonics Packaging and Integration written by and published by . This book was released on 2003 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Andreas Heinrich
Publisher : Springer Nature
ISBN 13 : 3030589609
Total Pages : 307 pages
Book Rating : 4.0/5 (35 download)
Download or read book 3D Printing of Optical Components written by Andreas Heinrich and published by Springer Nature. This book was released on 2020-11-21 with total page 307 pages. Available in PDF, EPUB and Kindle. Book excerpt: This edited volume reviews the current state of the art in the additive manufacturing of optical componentry, exploring key principles, materials, processes and applications. A short introduction lets readers familiarize themselves with the fundamental principles of the 3D printing method. This is followed by a chapter on commonly-used and emerging materials for printing of optical components, and subsequent chapters are dedicated to specific topics and case studies. The high potential of additive manufactured optical components is presented based on different manufacturing techniques and accompanied with extensive examples – from nanooptics to large scale optics – and taking research and industrial perspectives. Readers are provided with an extensive overview of the new possibilities brought about by this alternative method for optical components manufacture. Finally, the limitations of the method with respect to manufacturing techniques, materials and optical properties of the generated objects are discussed. With contributions from experts in academia and industry, this work will appeal to a wide readership, from undergraduate students through engineers to researchers interested in modern methods of manufacturing optical components.
Author : Rainer Michalzik
Publisher : Springer
ISBN 13 : 3642249868
Total Pages : 562 pages
Book Rating : 4.6/5 (422 download)
Download or read book VCSELs written by Rainer Michalzik and published by Springer. This book was released on 2012-10-16 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: The huge progress which has been achieved in the field is covered here, in the first comprehensive monograph on vertical-cavity surface-emitting lasers (VCSELs) since eight years. Apart from chapters reviewing the research field and the laser fundamentals, there are comprehensive updates on red and blue emitting VCSELs, telecommunication VCSELs, optical transceivers, and parallel-optical links for computer interconnects. Entirely new contributions are made to the fields of vectorial three-dimensional optical modeling, single-mode VCSELs, polarization control, polarization dynamics, very-high-speed design, high-power emission, use of high-contrast gratings, GaInNAsSb long-wavelength VCSELs, optical video links, VCSELs for optical mice and sensing, as well as VCSEL-based laser printing. The book appeals to researchers, optical engineers and graduate students.
Author : Ivan Kaminow
Publisher : Academic Press
ISBN 13 : 0123972353
Total Pages : 795 pages
Book Rating : 4.1/5 (239 download)
Download or read book Optical Fiber Telecommunications Volume VIA written by Ivan Kaminow and published by Academic Press. This book was released on 2013-05-03 with total page 795 pages. Available in PDF, EPUB and Kindle. Book excerpt: Optical Fiber Telecommunications VI (A&B) is the sixth in a series that has chronicled the progress in the R&D of lightwave communications since the early 1970s. Written by active authorities from academia and industry, this edition brings a fresh look to many essential topics, including devices, subsystems, systems and networks. A central theme is the enabling of high-bandwidth communications in a cost-effective manner for the development of customer applications. These volumes are an ideal reference for R&D engineers and managers, optical systems implementers, university researchers and students, network operators, and investors. Volume A is devoted to components and subsystems, including photonic integrated circuits, multicore and few-mode fibers, photonic crystals, silicon photonics, signal processing, and optical interconnections.
Author : Michael R. Feldman
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 :
Total Pages : 440 pages
Book Rating : 4.F/5 ( download)
Download or read book Optoelectronic Interconnects VII ; Photonics Packaging and Integration II written by Michael R. Feldman and published by SPIE-International Society for Optical Engineering. This book was released on 2000 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Ahmed Al-Samaneh
Publisher : BoD – Books on Demand
ISBN 13 : 3738613668
Total Pages : 218 pages
Book Rating : 4.7/5 (386 download)
Download or read book VCSELs for Cesium-Based Miniaturized Atomic Clocks written by Ahmed Al-Samaneh and published by BoD – Books on Demand. This book was released on 2015-09-23 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt: Frequency standards or clocks provide time references for a wide range of applications such as synchronization of communication networks, remote sensing and global positioning. Over the last couple of decades, demands on the data rates of many communication systems have substantially increased, imposing more restricted requirements on the stability of their timing devices. At the same time applications have become more mobile, increasing the demand for small and low-power clocks. Atomic clocks have provided the most stable frequency references for more than 50 years. However, the size and power requirements of microwave-cavity-based atomic clocks prohibit them from being portable and battery-operated. Hence, research on miniaturized atomic clocks (MACs) has been initiated by various research groups. A European research project on MACs, funded by the European commission started in 2008. This dissertation reports on the achievements within the European research project in the development of suitable lasers for such atomic clocks. Vertical-cavity surface-emitting lasers (VCSELs) are compelling light sources for MACs because of their low power consumption, high modulation bandwidth, and favorable beam characteristics. VCSELs must feature polarization-stable single-mode emission. Additionally, they must provide narrow linewidth emission at a center wavelength of about 894.6nm and be well suited for harmonic modulation at about 4.6GHz in order to employ coherent population trapping effect at the cesium D1 line. The polarization orientation of the emitted light of a standard VCSEL is a priori unknown. Polarization control is achieved by etching a shallow surface grating in the top Bragg mirror. For the purpose of integration with the clock microsystem, flip-chip-bondable VCSEL designs are realized. Such designs facilitate a straightforward mounting and make the electrical contacts high-frequency compatible.
Author : Keren Bergman
Publisher : Springer Science & Business Media
ISBN 13 : 1441993355
Total Pages : 220 pages
Book Rating : 4.4/5 (419 download)
Download or read book Photonic Network-on-Chip Design written by Keren Bergman and published by Springer Science & Business Media. This book was released on 2013-08-13 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive synthesis of the theory and practice of photonic devices for networks-on-chip. It outlines the issues in designing photonic network-on-chip architectures for future many-core high performance chip multiprocessors. The discussion is built from the bottom up: starting with the design and implementation of key photonic devices and building blocks, reviewing networking and network-on-chip theory and existing research, and finishing with describing various architectures, their characteristics, and the impact they will have on a computing system. After acquainting the reader with all the issues in the design space, the discussion concludes with design automation techniques, supplemented by provided software.
Author : Alexei L. Glebov
Publisher : Society of Photo Optical
ISBN 13 : 9780819474674
Total Pages : 312 pages
Book Rating : 4.4/5 (746 download)
Download or read book Photonics Packaging, Integration, and Interconnects IX written by Alexei L. Glebov and published by Society of Photo Optical. This book was released on 2009 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes Proceedings Vol. 7821
Author : John H. Lau
Publisher : Springer
ISBN 13 : 9811372241
Total Pages : 381 pages
Book Rating : 4.8/5 (113 download)
Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Author : Jeffrey A. Davis
Publisher : Springer Science & Business Media
ISBN 13 : 1461504619
Total Pages : 417 pages
Book Rating : 4.4/5 (615 download)
Download or read book Interconnect Technology and Design for Gigascale Integration written by Jeffrey A. Davis and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
Author : D. W. Faulkner
Publisher : IOS Press
ISBN 13 : 9789051993417
Total Pages : 316 pages
Book Rating : 4.9/5 (934 download)
Download or read book Photonic Networks, Optical Technology and Infrastructure written by D. W. Faulkner and published by IOS Press. This book was released on 1997 with total page 316 pages. Available in PDF, EPUB and Kindle. Book excerpt: All optical networks offer new possibilities for high bandwidth applications. New techniques are demonstrated for optical switching and network management for complex optical networks. WDM systems allow upgrading of the backbone optical network. This work explores the current state of research and future developments of optical network technology and applications. Photonic networks are discussed from a variety of viewpoints, including network analysis, modelling and simulation, active and passive devices, as well as packaging.
Author : Frank Chang
Publisher : CRC Press
ISBN 13 : 1000794938
Total Pages : 758 pages
Book Rating : 4.0/5 (7 download)
Download or read book Datacenter Connectivity Technologies written by Frank Chang and published by CRC Press. This book was released on 2022-09-01 with total page 758 pages. Available in PDF, EPUB and Kindle. Book excerpt: In recent years, investments by cloud companies in mega data centers and associated network infrastructure has created a very active and dynamic segment in the optical components and modules market. Optical interconnect technologies at high speed play a critical role for the growth of mega data centers, which flood the networks with unprecedented amount of data traffic. Datacenter Connectivity Technologies: Principles and Practice provides a comprehensive and in-depth look at the development of various optical connectivity technologies which are making an impact on the building of data centers. The technologies span from short range connectivity, as low as 100 meters with multi-mode fiber (MMF) links inside data centers, to long distances of hundreds of kilometers with single-mode fiber (SMF) links between data centers.This book is the first of its kind to address various advanced technologies connecting data centers. It represents a collection of achievements and the latest developments from well-known industry experts and academic researchers active in this field.
Author : Lorenzo Pavesi
Publisher : Springer Science & Business Media
ISBN 13 : 9783540210221
Total Pages : 424 pages
Book Rating : 4.2/5 (12 download)
Download or read book Silicon Photonics written by Lorenzo Pavesi and published by Springer Science & Business Media. This book was released on 2004-03-04 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gives a fascinating picture of the state-of-the-art in silicon photonics and a perspective on what can be expected in the near future. It is composed of a selected number of reviews authored by world leaders in the field and is written from both academic and industrial viewpoints. An in-depth discussion of the route towards fully integrated silicon photonics is presented. This book will be useful not only to physicists, chemists, materials scientists, and engineers but also to graduate students who are interested in the fields of microphotonics and optoelectronics.
Author : Beth Keser
Publisher : John Wiley & Sons
ISBN 13 : 1119793890
Total Pages : 324 pages
Book Rating : 4.1/5 (197 download)
Download or read book Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces written by Beth Keser and published by John Wiley & Sons. This book was released on 2021-12-06 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Author : Robert A. Boudreau
Publisher : CRC Press
ISBN 13 : 1420027727
Total Pages : 417 pages
Book Rating : 4.4/5 (2 download)
Download or read book Passive Micro-Optical Alignment Methods written by Robert A. Boudreau and published by CRC Press. This book was released on 2018-10-03 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: The most expensive phase in the manufacture of micro-optical components and fiber optics is also one of the most performance-critical: optical alignment of the components. The increasing degree of miniaturization makes this an especially challenging task. Active alignment methods result in higher costs and awkward processes, and for some applications, they simply are not possible. Passive Micro-Optical Alignment Methods introduces the passive alignment methods that are currently available and illustrates them with many examples, references, and critiques. The first book dedicated to passive alignment, it begins with an overview of the current activities, requirements, and general results of passive optical alignments, followed by three sections of in-depth analysis. The first of these discusses mechanical passive alignment, highlighting silicon waferboard, solder, and "Jitney" technologies as well as application of mechanical alignment to 3D free-space interconnects. The next section describes the various visual alignment techniques applied to Planar Lightwave Circuits (PLCs) and low-cost plastic and surface mount packaging. The final section details various utilities that aid passive alignment and their resulting tradeoffs and demonstrates Monte Carlo analysis to evaluate the potential of a given method. Passive Micro-Optical Alignment Methods provides the tools necessary to meet the challenge of precision and low-cost alignment for applications that require micron or sub-micron tolerance.
