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Packaging Catalog Encyclopedia Of Packaging
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Book Synopsis The Wiley Encyclopedia of Packaging Technology by : Kit L. Yam
Download or read book The Wiley Encyclopedia of Packaging Technology written by Kit L. Yam and published by John Wiley & Sons. This book was released on 2010-01-05 with total page 1368 pages. Available in PDF, EPUB and Kindle. Book excerpt: The complete and authoritative guide to modern packaging technologies —updated and expanded From A to Z, The Wiley Encyclopedia of Packaging Technology, Third Edition covers all aspects of packaging technologies essential to the food and pharmaceutical industries, among others. This edition has been thoroughly updated and expanded to include important innovations and changes in materials, processes, and technologies that have occurred over the past decade. It is an invaluable resource for packaging technologists, scientists and engineers, students and educators, packaging material suppliers, packaging converters, packaging machinery manufacturers, processors, retailers, and regulatory agencies. In addition to updating and improving articles from the previous edition, new articles are also added to cover the recent advances and developments in packaging. Content new to this edition includes: Advanced packaging materials such as antimicrobial materials, biobased materials, nanocomposite materials, ceramic-coated films, and perforated films Advanced packaging technologies such as active and intelligent packaging, radio frequency identification (RFID), controlled release packaging, smart blending, nanotechnology, biosensor technology, and package integrity inspection Various aspects important to packaging such as sustainable packaging, migration, lipid oxidation, light protection, and intellectual property Contributions from experts in all-important aspects of packaging Extensive cross-referencing and easy-to-access information on all subjects Large, double-column format for easy reference
Book Synopsis Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set) by :
Download or read book Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set) written by and published by World Scientific. This book was released on 2019-08-27 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
Book Synopsis Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set) by : Avram Bar-Cohen
Download or read book Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set) written by Avram Bar-Cohen and published by World Scientific. This book was released on 2012-02-01 with total page 1582 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.
Book Synopsis Packaging Materials and Processing for Food, Pharmaceuticals and Cosmetics by : Kata Galic
Download or read book Packaging Materials and Processing for Food, Pharmaceuticals and Cosmetics written by Kata Galic and published by John Wiley & Sons. This book was released on 2021-04-27 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides valuable information on a range of food packaging topics. It serves as a source for students, professionals and packaging engineers who need to know more about the characteristics, applications and consequences of different packaging materials in food-packaging interactions. This book is divided into 13 chapters and focuses on the agro-food, cosmetics and pharmaceutical sectors. The first four chapters cover traditional packaging materials: wood, paper and cardboard, glass and metal. The next two deal, respectively, with plastics and laminates. Biobased materials are then covered, followed by a presentation of active and smart packaging. Some chapters are also dedicated to providing information on caps and closures as well as auxiliary materials. Different food packaging methods are presented, followed by an investigation into the design and labelling of packaging. The book ends with a chapter presenting information on how the choice of packaging material is dependent on the characteristics of the food products to be packaged.
Book Synopsis Encyclopedia Of Thermal Packaging, Set 3: Thermal Packaging Applications (A 3-volume Set) by : Avram Bar-cohen
Download or read book Encyclopedia Of Thermal Packaging, Set 3: Thermal Packaging Applications (A 3-volume Set) written by Avram Bar-cohen and published by World Scientific. This book was released on 2018-10-15 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 2, please visit Set 1: Thermal Packaging Techniques and Set 2: Thermal Packaging Tools /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems — are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) provides a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written volumes presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.Set 3: Thermal Packaging ApplicationsThe third set in the Encyclopedia includes two volumes in the planned focus on Thermal Packaging Applications and a single volume on the use of Phase Change Materials (PCM), a most important Thermal Management Technique, not previously addressed in the Encyclopedia. Set 3 opens with Heat Transfer in Avionic Equipment, authored by Dr Boris Abramzon, offering a comprehensive, in-depth treatment of compact heat exchangers and cold plates for avionics cooling, as well as discussion on recent developments in these heat transfer units that are widely used in the thermal control of military and civilian airborne electronics. Along with a detailed presentation of the relevant thermofluid physics and governing equations, and the supporting mathematical design and optimization techniques, the book offers a practical guide for thermal engineers designing avionics cooling equipment, based on the author's 20+ years of experience as a thermal analyst and a practical design engineer for Avionics and related systems.The Set continues with Thermal Management of RF Systems, which addresses sequentially the history, present practice, and future thermal management strategies for electronically-steered RF systems, in the context of the RF operational requirements, as well as device-, module-, and system-level electronic, thermal, and mechanical considerations. This unique text was written by 3 authors, Dr John D Albrecht, Mr David H Altman, Dr Joseph J Maurer, with extensive US Department of Defense and aerospace industry experience in the design, development, and fielding of RF systems. Their combined efforts have resulted in a text, which is well-grounded in the relevant past, present, and future RF systems and technologies. Thus, this volume will provide the designers of advanced radars and other electronic RF systems with the tools and the knowledge to address the thermal management challenges of today's technologies, as well as of advanced technologies, such as wide bandgap semiconductors, heterogeneously integrated devices, and 3D chipsets and stacks.The third volume in Set 3, Phase Change Materials for Thermal Management of Electronic Components, co-authored by Prof Gennady Ziskind and Dr Yoram Kozak, provides a detailed description of the numerical methods used in PCM analysis and a detailed explanation of the processes that accompany and characterize solid-liquid phase-change in popular basic and advanced geometries. These provide a foundation for an in-depth exploration of specific electronics thermal management applications of Phase Change Materials. This volume is anchored in the unique PCM knowledge and experience of the senior author and placed in the context of the extensive solid-liquid phase-change literature in such diverse fields as material science, mathematical modeling, experimental and numerical methods, and thermofluid science and engineering.Related Link(s)
Download or read book Food Packaging written by Cornelia Vasile and published by MDPI. This book was released on 2019-04-18 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: Because of the increasing pressure on both food safety and packaging/food waste, the topic is important both for academics, applied research, industry and also for environment protection. Different materials, such as glass, metals, paper and paperboards, and non-degradable and degradable polymers, with versatile properties, are attractive for potential uses in food packaging. Food packaging is the largest area of application within the food sector. Only the nanotechnology-enabled products in the food sector account for ~50% of the market value, with and the annual growth rate is 11.65%. Technological developments are also of great interest. In the food sector, nanotechnology is involved in packaging materials with extremely high gas barriers, antimicrobial properties, and also in nanoencapsulants for the delivery of nutrients, flavors, or aromas, antimicrobial, and antioxidant compounds. Applications of materials, including nanomaterials in packaging and food safety, are in forms of: edible films, polymer nanocomposites, as high barrier packaging materials, nanocoatings, surface biocides, silver nanoparticles as potent antimicrobial agents, nutrition and neutraceuticals, active/bioactive packaging, intelligent packaging, nanosensors and nanomaterial-based assays for the detection of food relevant analytes (gasses, small organic molecules and food-borne pathogens) and bioplastics.
Book Synopsis Food Packaging Technology by : Richard Coles
Download or read book Food Packaging Technology written by Richard Coles and published by CRC Press. This book was released on 2003-08-15 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: The protection and preservation of a product, the launch of new products or re-launch of existing products, perception of added-value to products or services, and cost reduction in the supply chain are all objectives of food packaging. Taking into consideration the requirements specific to different products, how can one package successfully meet all of these goals? Food Packaging Technology provides a contemporary overview of food processing and packaging technologies. Covering the wide range of issues you face when developing innovative food packaging, the book includes: Food packaging strategy, design, and development Food biodeterioation and methods of preservation Packaged product quality and shelf life Logistical packaging for food marketing systems Packaging materials and processes The battle rages over which type of container should be used for which application. It is therefore necessary to consider which materials, or combination of materials and processes will best serve the market and enhance brand value. Food Packaging Technology gives you the tools to determine which form of packaging will meet your business goals without compromising the safety of your product.
Book Synopsis Handbook of Paper and Paperboard Packaging Technology by : Mark J. Kirwan
Download or read book Handbook of Paper and Paperboard Packaging Technology written by Mark J. Kirwan and published by John Wiley & Sons. This book was released on 2012-11-07 with total page 449 pages. Available in PDF, EPUB and Kindle. Book excerpt: The definitive industry reference on the paper and paperboard packaging sector. Now in a fully revised and updated second edition, this book discusses all the main types of packaging based on paper and paperboard. It considers the raw materials, the manufacture of paper and paperboard, and the basic properties and features on which packaging made from these materials depends for its appearance and performance. The manufacture of twelve types of paper- and paperboard-based packaging is described, together with their end-use applications and the packaging machinery involved. The importance of pack design is stressed, as well as how these materials offer packaging designers opportunities for imaginative and innovative design solutions. Environmental factors, including resource sustainability, societal and waste management issues are addressed in a dedicated chapter. The book is directed at readers based in companies which manufacture packaging grades of paper and paperboard, companies involved in the design, printing and production of packaging, and companies which manufacture inks, coatings, adhesives and packaging machinery. It will be essential reading for students of packaging technology and technologists working in food manufacturing who are users of paper and paperboard packaging products. Praise for the First Edition ‘This book is a valuable addition to the library of any forward-looking company by providing in-depth coverage of all aspects of packaging which involve the most ecologically acceptable material, namely paper and paperboard.’—International Journal of Dairy Technology ‘...a welcome contribution to a field where coverage was previously limited to subject-specific books... or to single chapters in textbooks on broader aspects of packaging technology.’—Packaging Technology and Science
Book Synopsis The Wiley Encyclopedia of Packaging Technology by : Marilyn Bakker
Download or read book The Wiley Encyclopedia of Packaging Technology written by Marilyn Bakker and published by Wiley-Interscience. This book was released on 1986-09-22 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Wiley Encyclopedia of Packaging Technology Packaging technology is of vital importance in all manufacturing industries. The Wiley Encyclopedia of Packaging Technology is designed to provide a comprehensive reference incorporating 188 topics from "Acrylics" to "Zero-Crush Concept" for a wide audience of engineers, technologists, and scientists who seek an introduction to unfamiliar aspects of the packaging process. In addition to providing an exhaustive reference for packaging engineers, the book is also designed to serve, for example, polymer chemists developing new products. It will also meet a need in all technical libraries for an authoritative basic reference on packaging. The 188 entries have been written by 225 acknowledged experts in academia and industry, and each has been reviewed by other experts in the field for completeness and objectivity. This encyclopedia provides coverage of all stages of the packaging process from raw materials through distribution. Multiple articles are included on all major topics, such as bags, boxes, cans, cartons, coextrusion machinery, decorating, filling machinery, films, plastics, steel, and testing. A significant contribution to packaging literature, this encyclopedia brings together in a single volume expertise from many disciplines. It contains many landmark articles, such as blow molding, corrugated boxes, fabricated cans, steel cans, economics of packaging, glass container design, glass container manufacturing, indicating devices, multilayer flexible packaging, paper, specifications and quality assurance, and international standards and practices. Numerous bibliographies accompany the articles. In addition, the encyclopedia includes over 200 tables and nearly 600 figures—all prepared with the cooperation of a distinguished Advisory Board. The result is a unique, informative work that will serve the diverse interests and concerns of those in the field of packaging with authoritative, reliable, state-of-the-art information of the subject.
Download or read book Containers and Packaging written by and published by . This book was released on 1948 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Smart Packaging Technologies for Fast Moving Consumer Goods by : Joseph Kerry
Download or read book Smart Packaging Technologies for Fast Moving Consumer Goods written by Joseph Kerry and published by John Wiley & Sons. This book was released on 2008-05-23 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt: Smart Packaging Technologies for Fast Moving Consumer Goods approaches the subject of smart packaging from an innovative, thematic perspective: Part 1 looks at smart packaging technologies for food quality and safety Part 2 addresses smart packaging issues for the supply chain Part 3 focuses on smart packaging for brand protection and enhancement Part 4 centres on smart packaging for user convenience. Each chapter starts with a definition of the technology, and proceeds with an analysis of its workings and components before concluding with snapshots of potential applications of the technology. The Editors, brought together from academia and industry, provide readers with a cohesive account of the smart packaging phenomenon. Chapter authors are a mixture of industry professionals and academic researchers from the UK, USA, EU and Australasia.
Book Synopsis Packaging Digital Information for Enhanced Learning and Analysis by : Shalin Hai-Jew
Download or read book Packaging Digital Information for Enhanced Learning and Analysis written by Shalin Hai-Jew and published by Information Science Reference. This book was released on 2014 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This book brings together effective practices for the end-to-end capture and web based presentation of information for comprehension, analysis, and decision-making"--
Author :United States. Business and Defense Services Administration. Containers and Packaging Division Publisher : ISBN 13 : Total Pages :20 pages Book Rating :4.:/5 (3 download)
Book Synopsis Containers and Packaging by : United States. Business and Defense Services Administration. Containers and Packaging Division
Download or read book Containers and Packaging written by United States. Business and Defense Services Administration. Containers and Packaging Division and published by . This book was released on 1955 with total page 20 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Kirk-Othmer Food and Feed Technology, 2 Volume Set by : Wiley
Download or read book Kirk-Othmer Food and Feed Technology, 2 Volume Set written by Wiley and published by John Wiley & Sons. This book was released on 2007-12-14 with total page 1786 pages. Available in PDF, EPUB and Kindle. Book excerpt: This two-volume set features selected articles from the Fifth Edition of Wiley's prestigious Kirk-Othmer Encyclopedia of Chemical Technology. This compact reference features the same breadth and quality of coverage found in the original, but with a focus on topics of particular interest to food technologists, chemists, chemical and process engineers, consultants, and researchers and educators in food and agricultural businesses, alcohol and beverage industries, and related fields.
Download or read book Simply Packaging written by Victor Cheung and published by Gingko Press. This book was released on 2008 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Creating high impact packaging is a critical element in the merchandising of any product. Not only must packaging grab the attention of consumers, it must help to establish brand identity and make a lasting impression. Not only must shape, graphics and color choices convey the right feeling, they must also be compatible with retail spaces where they will be displayed. Simply Packaging provides examples of the hottest packaging design from around the world employing both sophisticated technology and traditional handicraft for cosmetics, food and beverages, CD and album covers, POP displays and more.
Book Synopsis Food Packaging by : Gordon L. Robertson
Download or read book Food Packaging written by Gordon L. Robertson and published by CRC Press. This book was released on 2016-04-19 with total page 719 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents an integrated approach to understanding the principles underlying food packaging and their applications. This edition includes new and expanded coverage of biobased packaging and bionanocomposites; nanotechnology applications, including nanoclays; metallization and atomic layer deposition; shelf life design, analysis, and estimation; safety and legislative aspects of packaging including public interest in food contact materials such as BPA and phthalates; life cycle assessment and sustainability. A new chapter addresses food packaging closures and sealing systems, including closures for plastic and composite containers and peelable seals.
Book Synopsis Packaging for Nonthermal Processing of Food by : Melvin A. Pascall
Download or read book Packaging for Nonthermal Processing of Food written by Melvin A. Pascall and published by John Wiley & Sons. This book was released on 2018-02-20 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive review of the many new developments in the growing food processing and packaging field Revised and updated for the first time in a decade, this book discusses packaging implications for recent nonthermal processing technologies and mild food preservation such as high pressure processing, irradiation, pulsed electric fields, microwave sterilization, and other hurdle technologies. It reviews typical nonthermal processes, the characteristics of food products after nonthermal treatments, and packaging parameters to preserve the quality and enhance the safety of the products. In addition, the critical role played by packaging materials during the development of a new nonthermal processed product, and how the package is used to make the product attractive to consumers, is discussed. Packaging for Nonthermal Processing of Food, Second Edition provides up to date assessments of consumer attitudes to nonthermal processes and novel packaging (both in the U.S. and Europe). It offers a brand new chapter covering smart packaging, including thermal, microbial, chemical, and light sensing biosensors, radio frequency identification systems, and self-heating and cooling packaging. There is also a new chapter providing an overview of packaging laws and regulations in the United States and Europe. Covers the packaging types required for all major nonthermal technologies, including high pressure processing, pulsed electric field, irradiation, ohmic heating, and others Features a brand new chapter on smart packaging, including biosensors (thermal-, microbial-, chemical- and light-sensing), radio frequency identification systems, and self-heating and cooling packaging Additional chapters look at the current regulatory scene in the U.S. and Europe, as well as consumer attitudes to these novel technologies Editors and contributors bring a valuable mix of industry and research experience Packaging for Nonthermal Processing of Food, Second Edition offers many benefits to the food industry by providing practical information on the relationship between new processes and packaging materials, to academia as a source of fundamental knowledge about packaging science, and to regulatory agencies as an avenue for acquiring a deeper understanding of the packaging requirements for new processes.
