ESD

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Publisher : John Wiley & Sons
ISBN 13 : 1119992656
Total Pages : 260 pages
Book Rating : 4.1/5 (199 download)

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Book Synopsis ESD by : Steven H. Voldman

Download or read book ESD written by Steven H. Voldman and published by John Wiley & Sons. This book was released on 2011-04-04 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electrostatic discharge (ESD) continues to impact semiconductor components and systems as technologies scale from micro- to nano-electronics. This book studies electrical overstress, ESD, and latchup from a whole-chip ESD design synthesis approach. It provides a clear insight into the integration of ESD protection networks from a generalist perspective, followed by examples in specific technologies, circuits, and chips. Uniquely both the semiconductor chip integration issues and floorplanning of ESD networks are covered from a ‘top-down' design approach. Look inside for extensive coverage on: integration of cores, power bussing, and signal pins in DRAM, SRAM, CMOS image processing chips, microprocessors, analog products, RF components and how the integration influences ESD design and integration architecturing of mixed voltage, mixed signal, to RF design for ESD analysis floorplanning for peripheral and core I/O designs, and the implications on ESD and latchup guard ring integration for both a ‘bottom-up' and ‘top-down' methodology addressing I/O guard rings, ESD guard rings, I/O to I/O, and I/O to core classification of ESD power clamps and ESD signal pin circuitry, and how to make the correct choice for a given semiconductor chip examples of ESD design for the state-of-the-art technologies discussed, including CMOS, BiCMOS, silicon on insulator (SOI), bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, and smart power practical methods for the understanding of ESD circuit power distribution, ground rule development, internal bus distribution, current path analysis, quality metrics ESD: Design and Synthesis is a continuation of the author's series of books on ESD protection. It is an essential reference for: ESD, circuit, and semiconductor engineers; design synthesis team leaders; layout design, characterisation, floorplanning, test and reliability engineers; technicians; and groundrule and test site developers in the manufacturing and design of semiconductor chips. It is also useful for graduate and undergraduate students in electrical engineering, semiconductor sciences, and manufacturing sciences, and on courses involving the design of ESD devices, chips and systems. This book offers a useful insight into the issues that confront modern technology as we enter the nano-electronic era.

The ESD Handbook

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Author :
Publisher : John Wiley & Sons
ISBN 13 : 1119233100
Total Pages : 1168 pages
Book Rating : 4.1/5 (192 download)

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Book Synopsis The ESD Handbook by : Steven H. Voldman

Download or read book The ESD Handbook written by Steven H. Voldman and published by John Wiley & Sons. This book was released on 2021-03-02 with total page 1168 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical and comprehensive reference that explores Electrostatic Discharge (ESD) in semiconductor components and electronic systems The ESD Handbook offers a comprehensive reference that explores topics relevant to ESD design in semiconductor components and explores ESD in various systems. Electrostatic discharge is a common problem in the semiconductor environment and this reference fills a gap in the literature by discussing ESD protection. Written by a noted expert on the topic, the text offers a topic-by-topic reference that includes illustrative figures, discussions, and drawings. The handbook covers a wide-range of topics including ESD in manufacturing (garments, wrist straps, and shoes); ESD Testing; ESD device physics; ESD semiconductor process effects; ESD failure mechanisms; ESD circuits in different technologies (CMOS, Bipolar, etc.); ESD circuit types (Pin, Power, Pin-to-Pin, etc.); and much more. In addition, the text includes a glossary, index, tables, illustrations, and a variety of case studies. Contains a well-organized reference that provides a quick review on a range of ESD topics Fills the gap in the current literature by providing information from purely scientific and physical aspects to practical applications Offers information in clear and accessible terms Written by the accomplished author of the popular ESD book series Written for technicians, operators, engineers, circuit designers, and failure analysis engineers, The ESD Handbook contains an accessible reference to ESD design and ESD systems.

System Level ESD Co-Design

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Author :
Publisher : John Wiley & Sons
ISBN 13 : 1118861841
Total Pages : 442 pages
Book Rating : 4.1/5 (188 download)

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Book Synopsis System Level ESD Co-Design by : Charvaka Duvvury

Download or read book System Level ESD Co-Design written by Charvaka Duvvury and published by John Wiley & Sons. This book was released on 2015-08-04 with total page 442 pages. Available in PDF, EPUB and Kindle. Book excerpt: An effective and cost efficient protection of electronic system against ESD stress pulses specified by IEC 61000-4-2 is paramount for any system design. This pioneering book presents the collective knowledge of system designers and system testing experts and state-of-the-art techniques for achieving efficient system-level ESD protection, with minimum impact on the system performance. All categories of system failures ranging from 'hard' to 'soft' types are considered to review simulation and tool applications that can be used. The principal focus of System Level ESD Co-Design is defining and establishing the importance of co-design efforts from both IC supplier and system builder perspectives. ESD designers often face challenges in meeting customers' system-level ESD requirements and, therefore, a clear understanding of the techniques presented here will facilitate effective simulation approaches leading to better solutions without compromising system performance. With contributions from Robert Ashton, Jeffrey Dunnihoo, Micheal Hopkins, Pratik Maheshwari, David Pomerenke, Wolfgang Reinprecht, and Matti Usumaki, readers benefit from hands-on experience and in-depth knowledge in topics ranging from ESD design and the physics of system ESD phenomena to tools and techniques to address soft failures and strategies to design ESD-robust systems that include mobile and automotive applications. The first dedicated resource to system-level ESD co-design, this is an essential reference for industry ESD designers, system builders, IC suppliers and customers and also Original Equipment Manufacturers (OEMs). Key features: Clarifies the concept of system level ESD protection. Introduces a co-design approach for ESD robust systems. Details soft and hard ESD fail mechanisms. Detailed protection strategies for both mobile and automotive applications. Explains simulation tools and methodology for system level ESD co-design and overviews available test methods and standards. Highlights economic benefits of system ESD co-design.

Latchup

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Author :
Publisher : John Wiley & Sons
ISBN 13 : 9780470516164
Total Pages : 472 pages
Book Rating : 4.5/5 (161 download)

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Book Synopsis Latchup by : Steven H. Voldman

Download or read book Latchup written by Steven H. Voldman and published by John Wiley & Sons. This book was released on 2008-04-15 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Interest in latchup is being renewed with the evolution of complimentary metal-oxide semiconductor (CMOS) technology, metal-oxide-semiconductor field-effect transistor (MOSFET) scaling, and high-level system-on-chip (SOC) integration. Clear methodologies that grant protection from latchup, with insight into the physics, technology and circuit issues involved, are in increasing demand. This book describes CMOS and BiCMOS semiconductor technology and their sensitivity to present day latchup phenomena, from basic over-voltage and over-current conditions, single event latchup (SEL) and cable discharge events (CDE), to latchup domino phenomena. It contains chapters focusing on bipolar physics, latchup theory, latchup and guard ring characterization structures, characterization testing, product level test systems, product level testing and experimental results. Discussions on state-of-the-art semiconductor processes, design layout, and circuit level and system level latchup solutions are also included, as well as: latchup semiconductor process solutions for both CMOS to BiCMOS, such as shallow trench, deep trench, retrograde wells, connecting implants, sub-collectors, heavily-doped buried layers, and buried grids – from single- to triple-well CMOS; practical latchup design methods, automated and bench-level latchup testing methods and techniques, latchup theory of logarithm resistance space, generalized alpha (a) space, beta (b) space, new latchup design methods– connecting the theoretical to the practical analysis, and; examples of latchup computer aided design (CAD) methodologies, from design rule checking (DRC) and logical-to-physical design, to new latchup CAD methodologies that address latchup for internal and external latchup on a local as well as global design level. Latchup acts as a companion text to the author’s series of books on ESD (electrostatic discharge) protection, serving as an invaluable reference for the professional semiconductor chip and system-level ESD engineer. Semiconductor device, process and circuit designers, and quality, reliability and failure analysis engineers will find it informative on the issues that confront modern CMOS technology. Practitioners in the automotive and aerospace industries will also find it useful. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, computer aided design and design integration.

Electrical Overstress (EOS)

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Author :
Publisher : John Wiley & Sons
ISBN 13 : 1118703332
Total Pages : 368 pages
Book Rating : 4.1/5 (187 download)

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Book Synopsis Electrical Overstress (EOS) by : Steven H. Voldman

Download or read book Electrical Overstress (EOS) written by Steven H. Voldman and published by John Wiley & Sons. This book was released on 2013-08-27 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electrical Overstress (EOS) continues to impact semiconductor manufacturing, semiconductor components and systems as technologies scale from micro- to nano-electronics. This bookteaches the fundamentals of electrical overstress and how to minimize and mitigate EOS failures. The text provides a clear picture of EOS phenomena, EOS origins, EOS sources, EOS physics, EOS failure mechanisms, and EOS on-chip and system design. It provides an illuminating insight into the sources of EOS in manufacturing, integration of on-chip, and system level EOS protection networks, followed by examples in specific technologies, circuits, and chips. The book is unique in covering the EOS manufacturing issues from on-chip design and electronic design automation to factory-level EOS program management in today’s modern world. Look inside for extensive coverage on: Fundamentals of electrical overstress, from EOS physics, EOS time scales, safe operating area (SOA), to physical models for EOS phenomena EOS sources in today’s semiconductor manufacturing environment, and EOS program management, handling and EOS auditing processing to avoid EOS failures EOS failures in both semiconductor devices, circuits and system Discussion of how to distinguish between EOS events, and electrostatic discharge (ESD) events (e.g. such as human body model (HBM), charged device model (CDM), cable discharge events (CDM), charged board events (CBE), to system level IEC 61000-4-2 test events) EOS protection on-chip design practices and how they differ from ESD protection networks and solutions Discussion of EOS system level concerns in printed circuit boards (PCB), and manufacturing equipment Examples of EOS issues in state-of-the-art digital, analog and power technologies including CMOS, LDMOS, and BCD EOS design rule checking (DRC), LVS, and ERC electronic design automation (EDA) and how it is distinct from ESD EDA systems EOS testing and qualification techniques, and Practical off-chip ESD protection and system level solutions to provide more robust systems Electrical Overstress (EOS): Devices, Circuits and Systems is a continuation of the author’s series of books on ESD protection. It is an essential reference and a useful insight into the issues that confront modern technology as we enter the nano-electronic era.

Integrated Circuit Design for Radiation Environments

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Publisher : John Wiley & Sons
ISBN 13 : 1118701879
Total Pages : 392 pages
Book Rating : 4.1/5 (187 download)

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Book Synopsis Integrated Circuit Design for Radiation Environments by : Stephen J. Gaul

Download or read book Integrated Circuit Design for Radiation Environments written by Stephen J. Gaul and published by John Wiley & Sons. This book was released on 2019-12-03 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical guide to the effects of radiation on semiconductor components of electronic systems, and techniques for the designing, laying out, and testing of hardened integrated circuits This book teaches the fundamentals of radiation environments and their effects on electronic components, as well as how to design, lay out, and test cost-effective hardened semiconductor chips not only for today’s space systems but for commercial terrestrial applications as well. It provides a historical perspective, the fundamental science of radiation, and the basics of semiconductors, as well as radiation-induced failure mechanisms in semiconductor chips. Integrated Circuits Design for Radiation Environments starts by introducing readers to semiconductors and radiation environments (including space, atmospheric, and terrestrial environments) followed by circuit design and layout. The book introduces radiation effects phenomena including single-event effects, total ionizing dose damage and displacement damage) and shows how technological solutions can address both phenomena. Describes the fundamentals of radiation environments and their effects on electronic components Teaches readers how to design, lay out and test cost-effective hardened semiconductor chips for space systems and commercial terrestrial applications Covers natural and man-made radiation environments, space systems and commercial terrestrial applications Provides up-to-date coverage of state-of-the-art of radiation hardening technology in one concise volume Includes questions and answers for the reader to test their knowledge Integrated Circuits Design for Radiation Environments will appeal to researchers and product developers in the semiconductor, space, and defense industries, as well as electronic engineers in the medical field. The book is also helpful for system, layout, process, device, reliability, applications, ESD, latchup and circuit design semiconductor engineers, along with anyone involved in micro-electronics used in harsh environments.

Op Amps for Everyone

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Author :
Publisher : Newnes
ISBN 13 : 0750677015
Total Pages : 470 pages
Book Rating : 4.7/5 (56 download)

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Book Synopsis Op Amps for Everyone by : Ron Mancini

Download or read book Op Amps for Everyone written by Ron Mancini and published by Newnes. This book was released on 2003 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt: The operational amplifier ("op amp") is the most versatile and widely used type of analog IC, used in audio and voltage amplifiers, signal conditioners, signal converters, oscillators, and analog computing systems. Almost every electronic device uses at least one op amp. This book is Texas Instruments' complete professional-level tutorial and reference to operational amplifier theory and applications. Among the topics covered are basic op amp physics (including reviews of current and voltage division, Thevenin's theorem, and transistor models), idealized op amp operation and configuration, feedback theory and methods, single and dual supply operation, understanding op amp parameters, minimizing noise in op amp circuits, and practical applications such as instrumentation amplifiers, signal conditioning, oscillators, active filters, load and level conversions, and analog computing. There is also extensive coverage of circuit construction techniques, including circuit board design, grounding, input and output isolation, using decoupling capacitors, and frequency characteristics of passive components. The material in this book is applicable to all op amp ICs from all manufacturers, not just TI. Unlike textbook treatments of op amp theory that tend to focus on idealized op amp models and configuration, this title uses idealized models only when necessary to explain op amp theory. The bulk of this book is on real-world op amps and their applications; considerations such as thermal effects, circuit noise, circuit buffering, selection of appropriate op amps for a given application, and unexpected effects in passive components are all discussed in detail. *Published in conjunction with Texas Instruments *A single volume, professional-level guide to op amp theory and applications *Covers circuit board layout techniques for manufacturing op amp circuits.

Hardware/Software Co-Design

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 147572649X
Total Pages : 406 pages
Book Rating : 4.4/5 (757 download)

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Book Synopsis Hardware/Software Co-Design by : Jørgen Staunstrup

Download or read book Hardware/Software Co-Design written by Jørgen Staunstrup and published by Springer Science & Business Media. This book was released on 2013-04-17 with total page 406 pages. Available in PDF, EPUB and Kindle. Book excerpt: Introduction to Hardware-Software Co-Design presents a number of issues of fundamental importance for the design of integrated hardware software products such as embedded, communication, and multimedia systems. This book is a comprehensive introduction to the fundamentals of hardware/software co-design. Co-design is still a new field but one which has substantially matured over the past few years. This book, written by leading international experts, covers all the major topics including: fundamental issues in co-design; hardware/software co-synthesis algorithms; prototyping and emulation; target architectures; compiler techniques; specification and verification; system-level specification. Special chapters describe in detail several leading-edge co-design systems including Cosyma, LYCOS, and Cosmos. Introduction to Hardware-Software Co-Design contains sufficient material for use by teachers and students in an advanced course of hardware/software co-design. It also contains extensive explanation of the fundamental concepts of the subject and the necessary background to bring practitioners up-to-date on this increasingly important topic.

IC Layout Basics

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Author :
Publisher : McGraw Hill Professional
ISBN 13 : 0071414819
Total Pages : 319 pages
Book Rating : 4.0/5 (714 download)

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Book Synopsis IC Layout Basics by : Christopher Saint

Download or read book IC Layout Basics written by Christopher Saint and published by McGraw Hill Professional. This book was released on 2001-11-26 with total page 319 pages. Available in PDF, EPUB and Kindle. Book excerpt: MASTER IC LAYOUT WITHOUT AN ENGINEERING BACKGROUND! Tto new chip applications such as cell phones, personal digital assistants, and consumer electronics, electronic semiconductor usage has exploded, creating an unprecedented demand for technicians skilled in CMOS and bipolar design and layout. In IC LAYOUT BASICS, you get the same top-notch material utilized in IBM’s successful training courses. This essential primerbrings you up to speed on: * Integrated circuit processes * Layout techniques * Fundamental device concepts * Wafer processes Writing for technicians without an engineering degree , the authors present concepts from the ground up, building on the simple until the complex becomes crystal clear. Examples, self-tests, and sidebars reinforce the material and make it all quick and painless. For maximum retention, each chapter includes preview points, "motivation" boxes, and executive summaries.

CMOS

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Publisher : John Wiley & Sons
ISBN 13 : 0470229411
Total Pages : 1074 pages
Book Rating : 4.4/5 (72 download)

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Book Synopsis CMOS by : R. Jacob Baker

Download or read book CMOS written by R. Jacob Baker and published by John Wiley & Sons. This book was released on 2008 with total page 1074 pages. Available in PDF, EPUB and Kindle. Book excerpt: This edition provides an important contemporary view of a wide range of analog/digital circuit blocks, the BSIM model, data converter architectures, and more. The authors develop design techniques for both long- and short-channel CMOS technologies and then compare the two.

Design and Modeling for 3D ICs and Interposers

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Author :
Publisher : World Scientific
ISBN 13 : 9814508608
Total Pages : 379 pages
Book Rating : 4.8/5 (145 download)

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Book Synopsis Design and Modeling for 3D ICs and Interposers by : Madhavan Swaminathan

Download or read book Design and Modeling for 3D ICs and Interposers written by Madhavan Swaminathan and published by World Scientific. This book was released on 2013-11-05 with total page 379 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Reliability Engineering

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Author :
Publisher : Springer
ISBN 13 : 3662542099
Total Pages : 666 pages
Book Rating : 4.6/5 (625 download)

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Book Synopsis Reliability Engineering by : Alessandro Birolini

Download or read book Reliability Engineering written by Alessandro Birolini and published by Springer. This book was released on 2017-05-19 with total page 666 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book shows how to build in and assess reliability, availability, maintainability, and safety (RAMS) of components, equipment, and systems. It presents the state of the art of reliability (RAMS) engineering, in theory & practice, and is based on over 30 years author's experience in this field, half in industry and half as Professor of Reliability Engineering at the ETH, Zurich. The book structure allows rapid access to practical results. Methods & tools are given in a way that they can be tailored to cover different RAMS requirement levels. Thanks to Appendices A6 - A8 the book is mathematically self-contained, and can be used as a textbook or as a desktop reference with a large number of tables (60), figures (210), and examples / exercises^ 10,000 per year since 2013) were the motivation for this final edition, the 13th since 1985, including German editions. Extended and carefully reviewed to improve accuracy, it represents the continuous improvement effort to satisfy reader's needs and confidence. New are an introduction to risk management with structurally new models based on semi-Markov processes & to the concept of mean time to accident, reliability & availability of a k-out-of-n redundancy with arbitrary repair rate for n - k=2, 10 new homework problems, and refinements, in particular, on multiple failure mechanisms, approximate expressions, incomplete coverage, data analysis, and comments on ë, MTBF, MTTF, MTTR, R, PA.

Computational Intelligence in Analog and Mixed-Signal (AMS) and Radio-Frequency (RF) Circuit Design

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Author :
Publisher : Springer
ISBN 13 : 3319198726
Total Pages : 500 pages
Book Rating : 4.3/5 (191 download)

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Book Synopsis Computational Intelligence in Analog and Mixed-Signal (AMS) and Radio-Frequency (RF) Circuit Design by : Mourad Fakhfakh

Download or read book Computational Intelligence in Analog and Mixed-Signal (AMS) and Radio-Frequency (RF) Circuit Design written by Mourad Fakhfakh and published by Springer. This book was released on 2015-07-14 with total page 500 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains the application of recent advances in computational intelligence – algorithms, design methodologies, and synthesis techniques – to the design of integrated circuits and systems. It highlights new biasing and sizing approaches and optimization techniques and their application to the design of high-performance digital, VLSI, radio-frequency, and mixed-signal circuits and systems. This first of two related volumes addresses the design of analog and mixed-signal (AMS) and radio-frequency (RF) circuits, with 17 chapters grouped into parts on analog and mixed-signal applications, and radio-frequency design. It will be of interest to practitioners and researchers in computer science and electronics engineering engaged with the design of electronic circuits.

Semiconductor Packaging

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Publisher : CRC Press
ISBN 13 : 1439862079
Total Pages : 216 pages
Book Rating : 4.4/5 (398 download)

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Book Synopsis Semiconductor Packaging by : Andrea Chen

Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

3D Stacked Chips

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Author :
Publisher : Springer
ISBN 13 : 3319204815
Total Pages : 354 pages
Book Rating : 4.3/5 (192 download)

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Book Synopsis 3D Stacked Chips by : Ibrahim (Abe) M. Elfadel

Download or read book 3D Stacked Chips written by Ibrahim (Abe) M. Elfadel and published by Springer. This book was released on 2016-05-11 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

Learning from Megadisasters

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Author :
Publisher : World Bank Publications
ISBN 13 : 1464801541
Total Pages : 391 pages
Book Rating : 4.4/5 (648 download)

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Book Synopsis Learning from Megadisasters by : Federica Ranghieri

Download or read book Learning from Megadisasters written by Federica Ranghieri and published by World Bank Publications. This book was released on 2014-06-26 with total page 391 pages. Available in PDF, EPUB and Kindle. Book excerpt: While not all natural disasters can be avoided, their impact on a population can be mitigated through effective planning and preparedness. These are the lessons to be learned from Japan's own megadisaster: the Great East Japan Earthquake of 2011, the fi rst disaster ever recorded that included an earthquake, a tsunami, a nuclear power plant accident, a power supply failure, and a large-scale disruption of supply chains. It is a sad fact that poor communities are often hardest hit and take the longest to recover from disaster. Disaster risk management (DRM) should therefore be taken into account as a major development challenge, and countries must shift from a tradition of response to a culture of prevention and resilience. Learning from Megadisasters: Lessons from the Great East Japan Earthquake consolidates a set of 36 Knowledge Notes, research results of a joint study undertaken by the Government of Japan and the World Bank. These notes highlight key lessons learned in seven DRM thematic clusters—structural measures; nonstructural measures; emergency response; reconstruction planning; hazard and risk information and decision making; the economics of disaster risk, risk management, and risk fi nancing; and recovery and relocation. Aimed at sharing Japanese cutting-edge knowledge with practitioners and decision makers, this book provides valuable guidance to other disaster-prone countries for mainstreaming DRM in their development policies and weathering their own natural disasters.

Education for Sustainable Development in the Early Years

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Author :
Publisher : Routledge
ISBN 13 : 9780415630429
Total Pages : 160 pages
Book Rating : 4.6/5 (34 download)

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Book Synopsis Education for Sustainable Development in the Early Years by : John Siraj-Blatchford

Download or read book Education for Sustainable Development in the Early Years written by John Siraj-Blatchford and published by Routledge. This book was released on 2015-01-12 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt: It is in early childhood that the foundations of many of our fundamental attitudes and values are first put into place. Education for Sustainable Development (ESD) is all about the future and it is young children who have the greatest stake as citizens in the future. This book provides an introduction to education for sustainability in the field of early childhood. Written by leading experts and including the very latest international thinking on the subject, it clearly describes how the idea of ESD emerged, and shows how today it includes an integration of social, environmental and economic aspects of life and society. The authors look at what is already being done in early years settings and provides practical support for practitioners to develop this further drawing on best practice from around the world. Presenting a wide range of examples of projects carried out with young children, this timely book aims to offer practitioners inspiration for further development of Education for Sustainable Development in the early years. It will also be a rich source of information for those concerned with policy development.