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Multilevel Interconnect Technology
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Book Synopsis Multilevel Interconnect Technology by : Gopal K. Rao
Download or read book Multilevel Interconnect Technology written by Gopal K. Rao and published by McGraw-Hill Companies. This book was released on 1993 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first book on a key topic in IC technology. Table of Contents: Multilevel Interconnection Design; Multilevel Interconnect Processing; Manufacturing; Reliability; Index. 100 illustrations.
Book Synopsis Multilevel Interconnect Technology by :
Download or read book Multilevel Interconnect Technology written by and published by . This book was released on 1999 with total page 206 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Multilevel Interconnect Technology II by :
Download or read book Multilevel Interconnect Technology II written by and published by . This book was released on 1998 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Copper Interconnect Technology by : Christoph Steinbruchel
Download or read book Copper Interconnect Technology written by Christoph Steinbruchel and published by SPIE Press. This book was released on 2001 with total page 138 pages. Available in PDF, EPUB and Kindle. Book excerpt: A textbook designed to accompany The Society of Photo-Optical Instrumentation Engineers' short course on improving interconnect performance for increased speed in overall circuit performance authored by Steinbrnchel (materials science and engineering, Renselaer Polytechnic Institute) and Chin (senio
Author :Divyesh N. Patel Publisher :SPIE-International Society for Optical Engineering ISBN 13 : Total Pages :132 pages Book Rating :4.:/5 (759 download)
Book Synopsis Multilevel Interconnect Technology by : Divyesh N. Patel
Download or read book Multilevel Interconnect Technology written by Divyesh N. Patel and published by SPIE-International Society for Optical Engineering. This book was released on 1997 with total page 132 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Multilevel Interconnect Technology III by :
Download or read book Multilevel Interconnect Technology III written by and published by . This book was released on 1999 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Multilevel Interconnect Technology by : Mart Graef
Download or read book Multilevel Interconnect Technology written by Mart Graef and published by . This book was released on 1997 with total page 132 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Multilevel Interconnect Technology III by : Mart Graef
Download or read book Multilevel Interconnect Technology III written by Mart Graef and published by Society of Photo Optical. This book was released on 1999-01-01 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: A selection of 19 scientific papers addressing multilevel interconnect technology from a number of perspectives.
Book Synopsis Multilevel Interconnection Technologies by : Pei-Lin Pai
Download or read book Multilevel Interconnection Technologies written by Pei-Lin Pai and published by . This book was released on 1987 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis A Multilevel Planar Interconnect Technology Utilizing the Selective Deposition of Tungsten by : David Charles Thomas
Download or read book A Multilevel Planar Interconnect Technology Utilizing the Selective Deposition of Tungsten written by David Charles Thomas and published by . This book was released on 1990 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Interconnect Technology and Design for Gigascale Integration by : Jeffrey A. Davis
Download or read book Interconnect Technology and Design for Gigascale Integration written by Jeffrey A. Davis and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
Book Synopsis Microelectronic Device and Multilevel Interconnection Technology by :
Download or read book Microelectronic Device and Multilevel Interconnection Technology written by and published by . This book was released on 1995 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Microelectronic Device and Multilevel Interconnection Technology by :
Download or read book Microelectronic Device and Multilevel Interconnection Technology written by and published by . This book was released on 1996 with total page 414 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis A Multi-level Interconnect Technology for ULSI Fabrication by : Eric Tobias
Download or read book A Multi-level Interconnect Technology for ULSI Fabrication written by Eric Tobias and published by . This book was released on 1985 with total page 102 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Copper Interconnect Technology by : Tapan Gupta
Download or read book Copper Interconnect Technology written by Tapan Gupta and published by Springer Science & Business Media. This book was released on 2010-01-22 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Book Synopsis Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies by : L. B. Rothman
Download or read book Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies written by L. B. Rothman and published by . This book was released on 1987 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Interconnects for ULSI Technology by : Mikhail Baklanov
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-02-17 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
