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Modeling Of Defect Propagation Growth For In Line Defect Inspection Optimization In Vlsi Fabrication
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Book Synopsis Modeling of Defect Propagation/growth for In-line Defect Inspection Optimization in VLSI Fabrication by : Xiaolei Li
Download or read book Modeling of Defect Propagation/growth for In-line Defect Inspection Optimization in VLSI Fabrication written by Xiaolei Li and published by . This book was released on 1997 with total page 4 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "Particulate contamination deposited on silicon wafers is typically the dominant reason for yield loss in VLSI manufacturing. The transformation of contaminating particles into defects and then electrical faults is a very complex process which depends on the defect location, size, material and the underlying IC topography. A rigorous 2D topography simulator, METROPOLE, has been developed to allow the prediction and correlation of the critical physical parameters (material, size and location) of contamination in the manufacturing process to device defects. The results for a large number of defect samples simulated using the above approach were compared with data gathered from the AMD-Sunnyvale fabline. A good match was obtained indicating the accuracy of this method which provided a framework for developing contamination to defect propagation/growth macromodels. We have demonstrated that the understanding of defect transformation can be applied to optimizing wafer inspection sampling strategy."
Book Synopsis Modeling of Defect Propagation/growth for Early Yield Impact Prediction in VLSI Fabrication by : Xiaolei Li
Download or read book Modeling of Defect Propagation/growth for Early Yield Impact Prediction in VLSI Fabrication written by Xiaolei Li and published by . This book was released on 1997 with total page 6 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "Particulate contamination deposited on silicon wafers is typically the dominant reason for yield loss in VLSI manufacturing. The transformation of contaminating particles into defects and then electrical faults is a very complex process which depends on the defect location, size, material and the underlying IC topography. A rigorous topography simulator, METROPOLE has been developed to allow the prediction and correlation of the critical physical parameters (material, size and location) of contamination in the manufacturing process to device defects. The results for a large number of defect samples simulated using the above approach were compared with data gathered from the AMD-Sunnyvale fabline. A good match was obtained indicating the accuracy of this method which provided a framework for developing contamination to defect propagation/growth macromodels. We have demonstrated that the understanding of defect transformation can be applied to early yield impact prediction."
Book Synopsis Wafer Defect Inspection Optimization by : Zhongshun Shi
Download or read book Wafer Defect Inspection Optimization written by Zhongshun Shi and published by . This book was released on 2019 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The prevalence of electronic devices has propelled the tremendous growth of the semiconductor industry in the past half century. The manufacturing of semiconductor wafers is a long and delicate process, where defect points may occur and cause the failure of the entire circuit. As more advanced devices introduce tiny and harder-to-detect defects, improvements in wafer defect inspection technologies are highly desired by the industry. One promising direction is to optimize the positioning of inspection regions for the e-beam inspection tool, so as to cover all suspect defect points on a target area of a wafer while maximizing the throughput of the scan. To this end, we formulate this defect inspection optimization problem (DIOP) as a mixed integer linear programming (MILP) model, and enhance the formulation using variable reduction. To address the computational challenge of solving large-scale DIOP instances, we further propose three approximation methods with theoretical bounds, namely, a constant-factor approximation algorithm that provides heuristic solutions quickly, a polynomial-time approximation scheme (PTAS) that has a strong performance guarantee, and an MILP-based hybrid method that combines the PTAS framework and MILP formulation and is suitable for parallel computing by design. Numerical experiments on synthetic and industry instances show the efficiency and effectiveness of the proposed methods. Particularly, for large-scale instances, the hybrid algorithm is capable of generating near-optimal solutions with theoretical guarantees within practically acceptable computational time.
Book Synopsis Simulation of Defect Detection Schemes for Wafer Inspection in VLSI Manufacturing by : Aaron Swecker
Download or read book Simulation of Defect Detection Schemes for Wafer Inspection in VLSI Manufacturing written by Aaron Swecker and published by . This book was released on 1997 with total page 4 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "The detection of critical defects on modern VLSI wafers is a challenging and complex problem. Simulation of these critical defects allows for rapid characterization and optimization of in-line detection schemes. In this paper we introduce a 3-D electromagnetic field simulator (METRO 3-D) that calculates the scattering of light from wafer topographies. An approach that allows highly absorptive materials to be investigated is discussed for the three dimensional topography simulator. With this enhancement to the simulator, several defect studies were performed and the results of these studies illustrate the ability of the simulator to model wafer topographies and defects that occur in modern fab lines."
Book Synopsis Modeling of Defect Propagation/growth for Yield Impact Prediction in VLSI Manufacturing by : Xiaolei Li
Download or read book Modeling of Defect Propagation/growth for Yield Impact Prediction in VLSI Manufacturing written by Xiaolei Li and published by . This book was released on 1997 with total page 12 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "Particulate contamination deposited on silicon wafers is typically the dominant reason for yield loss in VLSI manufacturing. The transformation of contaminating particles into defects and then electrical faults is a very complex process which depends on the defect location, size, material and the underlying IC topography. A rigorous topography simulator, METROPOLE, has been developed to allow the prediction and correlation of the critical physical parameters (material, size and location) of contamination in the manufacturing process to device defects. The results for a large number of defect samples simulated using the above approach were compared with data gathered from the AMD-Sunnyvale fabline. A good match was obtained indicating the accuracy of this method which provided a framework for developing contamination to defect propagation/growth macromodels. We have demonstrated that the understanding of defect transformation can be applied to early yield impact prediction."
Book Synopsis Efficient Macromodeling of Defect Propagation/growth Mechanisms in VLSI Fabrication by : Xiaolei Li
Download or read book Efficient Macromodeling of Defect Propagation/growth Mechanisms in VLSI Fabrication written by Xiaolei Li and published by . This book was released on 1999* with total page 38 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "Particulate contamination deposited on silicon wafers is typically the dominant reason for yield loss in VLSI manufacturing. The transformation of contaminating particles into defects and then electrical faults is a very complex process which depends on the defect location, size, material and the underlying IC topography. An efficient defect macromodeling methodology based on the rigorous 2D topography simulator METROPOLE, has been developed to allow the prediction and correlation of the critical physical parameters (material, size and location) of contamination in the manufacturing process to device defects. The results for a large number of defect samples simulated using the above approach were compared with the data gathered from the AMD-Sunnyvale fabline. A good match was obtained indicating the accuracy for our method of developing contamination to defect propagation/growth macromodels."
Book Synopsis Application of Rigorous Topography Simulation for Modeling of Defect Propagation/growth in VLSI Fabrication by : Xiaolei Li
Download or read book Application of Rigorous Topography Simulation for Modeling of Defect Propagation/growth in VLSI Fabrication written by Xiaolei Li and published by . This book was released on 1997 with total page 10 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "Particulate contamination deposited on silicon wafers is typically the dominant reason for yield loss in VLSI manufacturing. The transformation of contaminating particles into defects and then electrical faults is a very complex process which depends on the defect location, size, material and the underlying IC topography. A rigorous 2D topography simulator based on the photolithography simulator METROPOLE, has been developed to allow the prediction and correlation of the critical physical parameters (material, size and location) of contamination in the manufacturing process to device defects. The results of a large number of defect samples simulated using the above approach were compared with data gathered from the AMD-Sunnyvale fabline. A good match was obtained indicating the accuracy of this method which provided a framework for developing contamination to defect propagation/growth macromodels."
Book Synopsis Optimization of Defect Detection Schemes Using Three Dimensional Modeling by : Aaron Swecker
Download or read book Optimization of Defect Detection Schemes Using Three Dimensional Modeling written by Aaron Swecker and published by . This book was released on 1999 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "The objective of this thesis is to develop rigorous models to simulate optical images of 3-D semiconductor structures detected by various in-line defect detection and alignment schemes. The usefulness of 3-D simulation will be shown for the cases of defect detection in post chemical mechanical polishing and lithography inspection. The results will illustrate that with the use of simulation along with experimentation the time needed to characterize in-line defect detection schemes has been greatly reduced. Additionally, optical schemes will be developed that allow for simulation of 3-D alignment of modern integrated circuits and examples of this will be shown."
Book Synopsis Three Dimensional Modeling of Defect Detection Schemes in VLSI Manufacturing by : Aaron Swecker
Download or read book Three Dimensional Modeling of Defect Detection Schemes in VLSI Manufacturing written by Aaron Swecker and published by . This book was released on 1996 with total page 36 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "This report presents the extension and use of the three dimensional metrology simulation tool, METRO, used for characterizing in-line defect detection schemes. It describes modifications made to the previous three dimensional model to include 3-D substrate scattering, which allows the simulation of metrology tools. It then describes the investigation of various topographies containing defects known to affect the yield of IC processes. These topographies are simulated using METRO to determine the effectiveness of various schemes and to illustrate the use of simulation in characterizing configurations for in-line defect detection schemes."
Book Synopsis A Study of Defect Propagation/growth for VLSI Manufacturing Yield Impact Prediction by : Xiaolei Li
Download or read book A Study of Defect Propagation/growth for VLSI Manufacturing Yield Impact Prediction written by Xiaolei Li and published by . This book was released on 1997 with total page 4 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "The transformation of contaminating particles into defects and then electrical faults is a very complex process which depends on the defect location, size, material and the underlying IC topography. A rigorous topography simulator, METROPOLE has been developed to allow the prediction and correlation of the critical physical parameters (material, size and location) of contamination in the manufacturing process to device defects. The results for a large number of defect samples simulated using the above approach were compared with data gathered from the AMD-Sunnyvale fabline. A good match was obtained indicating the accuracy of this method which provided a framework for developing contamination to defect propagation/growth macromodels. We have demonstrated that the understanding of the defect transformation can be applied to early yield impact prediction."
Book Synopsis Modeling of Contamination to Defect Transformation for Yield Impact Prediction in VLSI Manufacturing by : Mahesh Reddy
Download or read book Modeling of Contamination to Defect Transformation for Yield Impact Prediction in VLSI Manufacturing written by Mahesh Reddy and published by . This book was released on 1996 with total page 33 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "This report presents a new methodology to develop macromodels for yield limiting defects that propagate from one process step to the next. This methodology includes the measurement and analyses of in-line inspection data, use of a topography simulator to simulate the defects, design of simulator experiments and the extraction of results in the form of macromodels. The methodology is then applied to numerous examples for which macromodels are developed as a function of critical particle attributes."
Book Synopsis Springer Handbook of Engineering Statistics by : Hoang Pham
Download or read book Springer Handbook of Engineering Statistics written by Hoang Pham and published by Springer Science & Business Media. This book was released on 2006 with total page 1135 pages. Available in PDF, EPUB and Kindle. Book excerpt: In today’s global and highly competitive environment, continuous improvement in the processes and products of any field of engineering is essential for survival. This book gathers together the full range of statistical techniques required by engineers from all fields. It will assist them to gain sensible statistical feedback on how their processes or products are functioning and to give them realistic predictions of how these could be improved. The handbook will be essential reading for all engineers and engineering-connected managers who are serious about keeping their methods and products at the cutting edge of quality and competitiveness.
Download or read book Physics Briefs written by and published by . This book was released on 1986 with total page 838 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Scientific and Technical Aerospace Reports by :
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1994 with total page 804 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Book Synopsis Electrical & Electronics Abstracts by :
Download or read book Electrical & Electronics Abstracts written by and published by . This book was released on 1997 with total page 1948 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Generic Approaches to Risk Based Inspection Planning for Steel Structures by : Daniel Straub
Download or read book Generic Approaches to Risk Based Inspection Planning for Steel Structures written by Daniel Straub and published by vdf Hochschulverlag AG. This book was released on 2004 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of Texture Analysis by : Majid Mirmehdi
Download or read book Handbook of Texture Analysis written by Majid Mirmehdi and published by World Scientific. This book was released on 2008 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt: Texture analysis is one of the fundamental aspects of human vision by which we discriminate between surfaces and objects. In a similar manner, computer vision can take advantage of the cues provided by surface texture to distinguish and recognize objects. In computer vision, texture analysis may be used alone or in combination with other sensed features (e.g. color, shape, or motion) to perform the task of recognition. Either way, it is a feature of paramount importance and boasts a tremendous body of work in terms of both research and applications.Currently, the main approaches to texture analysis must be sought out through a variety of research papers. This collection of chapters brings together in one handy volume the major topics of importance, and categorizes the various techniques into comprehensible concepts. The methods covered will not only be relevant to those working in computer vision, but will also be of benefit to the computer graphics, psychophysics, and pattern recognition communities, academic or industrial.
