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Microelectronics Interconnection And Packaging
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Book Synopsis Microelectronics Packaging Handbook by : R.R. Tummala
Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Book Synopsis Microelectronics Interconnection and Packaging by : Jerry Lyman
Download or read book Microelectronics Interconnection and Packaging written by Jerry Lyman and published by McGraw-Hill Companies. This book was released on 1980 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electronic Packaging and Interconnection Handbook 4/E by : Charles A. Harper
Download or read book Electronic Packaging and Interconnection Handbook 4/E written by Charles A. Harper and published by McGraw Hill Professional. This book was released on 2005 with total page 1002 pages. Available in PDF, EPUB and Kindle. Book excerpt: Whether you're designing an electronic system from scratch or engineering the project from someone else's design, the Handbook gives you the tools you need to get the job done faster, cheaper and more reliably than ever. We guarantee it. From development and design to manufacturing and testing, the Handbook has you covered. It's the one resource to turn to first. Why not put it to the test and see for yourself?
Book Synopsis Electronic Packaging and Interconnection Handbook by : Charles A. Harper
Download or read book Electronic Packaging and Interconnection Handbook written by Charles A. Harper and published by McGraw-Hill Companies. This book was released on 1997 with total page 1020 pages. Available in PDF, EPUB and Kindle. Book excerpt: Charles A. Harper's 2nd edition on designing and manufacturing all the major types of electronic systems is now double the size of the 1st edition. It draws upon the expertise of a dozen experts to make sense of this highly interdisciplinary field
Book Synopsis Integrated Circuit Packaging, Assembly and Interconnections by : William Greig
Download or read book Integrated Circuit Packaging, Assembly and Interconnections written by William Greig and published by Springer Science & Business Media. This book was released on 2007-04-24 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Book Synopsis Microelectronic Packaging by : M. Datta
Download or read book Microelectronic Packaging written by M. Datta and published by CRC Press. This book was released on 2004-12-20 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.
Book Synopsis Microelectronics Packaging Handbook by : R.R. Tummala
Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 742 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Book Synopsis 3D Microelectronic Packaging by : Yan Li
Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer Nature. This book was released on 2020-11-23 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Book Synopsis Microelectronics Packaging Handbook by : Rao Tummala
Download or read book Microelectronics Packaging Handbook written by Rao Tummala and published by Springer Science & Business Media. This book was released on 1997-01-31 with total page 662 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Book Synopsis Microelectronic Interconnections and Assembly by : G.G. Harman
Download or read book Microelectronic Interconnections and Assembly written by G.G. Harman and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Author :F. N. Sinnadurai Publisher :State Mutual Book & Periodical Service ISBN 13 :9780901150196 Total Pages :271 pages Book Rating :4.1/5 (51 download)
Book Synopsis Handbook of Microelectronics Packaging and Interconnection Technologies by : F. N. Sinnadurai
Download or read book Handbook of Microelectronics Packaging and Interconnection Technologies written by F. N. Sinnadurai and published by State Mutual Book & Periodical Service. This book was released on 1985 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Thermal Stress and Strain in Microelectronics Packaging by : John Lau
Download or read book Thermal Stress and Strain in Microelectronics Packaging written by John Lau and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
Book Synopsis Quality Conformance and Qualification of Microelectronic Packages and Interconnects by : Michael Pecht
Download or read book Quality Conformance and Qualification of Microelectronic Packages and Interconnects written by Michael Pecht and published by John Wiley & Sons. This book was released on 1994-12-13 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.
Book Synopsis Integrated Circuit Packaging, Assembly and Interconnections by : William Greig
Download or read book Integrated Circuit Packaging, Assembly and Interconnections written by William Greig and published by Springer. This book was released on 2008-11-01 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Book Synopsis Materials for High-Density Electronic Packaging and Interconnection by : National Research Council
Download or read book Materials for High-Density Electronic Packaging and Interconnection written by National Research Council and published by National Academies Press. This book was released on 1990-02-01 with total page 154 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electronic Packaging, Microelectronics, and Interconnection Dictionary by : Charles A. Harper
Download or read book Electronic Packaging, Microelectronics, and Interconnection Dictionary written by Charles A. Harper and published by McGraw-Hill Professional Publishing. This book was released on 1993 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: From circuits and communication systems to all types of electronic subsystems and assemblies, this reference includes concise definitions for more than 6000 terms, acronyms, abbreviations and symbols that are commonly encountered by everyone working in the industry, whatever their expertise.
Book Synopsis Microelectronic Interconnects and Packages: System and process integration by : Stuart K. Tewksbury
Download or read book Microelectronic Interconnects and Packages: System and process integration written by Stuart K. Tewksbury and published by . This book was released on 1991 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt:
