Reliability Prediction for Microelectronics

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Author :
Publisher : John Wiley & Sons
ISBN 13 : 1394210930
Total Pages : 404 pages
Book Rating : 4.3/5 (942 download)

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Book Synopsis Reliability Prediction for Microelectronics by : Joseph B. Bernstein

Download or read book Reliability Prediction for Microelectronics written by Joseph B. Bernstein and published by John Wiley & Sons. This book was released on 2024-02-20 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt: RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.

Microelectronic Reliability: Reliability, test and diagnostics

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Author :
Publisher : Artech House Publishers
ISBN 13 :
Total Pages : 400 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Microelectronic Reliability: Reliability, test and diagnostics by : Edward B. Hakim

Download or read book Microelectronic Reliability: Reliability, test and diagnostics written by Edward B. Hakim and published by Artech House Publishers. This book was released on 1989 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: Text/reference spaning the theoretical concepts of reliability models and failure distributions, to GaAs microcircuit processing and test. Provides background on the development of quality assurance and verification procedures. Some of the new changes under development to cope with pressures brought

Microelectronic Reliability: Integrity assessment and assurance

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Author :
Publisher : Materials Science Library
ISBN 13 :
Total Pages : 568 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Microelectronic Reliability: Integrity assessment and assurance by : Emiliano Pollino

Download or read book Microelectronic Reliability: Integrity assessment and assurance written by Emiliano Pollino and published by Materials Science Library. This book was released on 1989 with total page 568 pages. Available in PDF, EPUB and Kindle. Book excerpt: A companion to v.1 (which covers reliability, test, and diagnostics), this volume explains the main failure mechanisms which may affect silicon devices and shows their effect on reliability characteristics. Due to the importance of VLSI devices, emphasis is given to metalizations and latch-up. Acidi

Influence of Temperature on Microelectronics and System Reliability

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Author :
Publisher : CRC Press
ISBN 13 : 0429605595
Total Pages : 332 pages
Book Rating : 4.4/5 (296 download)

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Book Synopsis Influence of Temperature on Microelectronics and System Reliability by : Pradeep Lall

Download or read book Influence of Temperature on Microelectronics and System Reliability written by Pradeep Lall and published by CRC Press. This book was released on 2020-07-09 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The

Microcircuit Reliability Bibliography

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Author :
Publisher :
ISBN 13 :
Total Pages : 888 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Microcircuit Reliability Bibliography by :

Download or read book Microcircuit Reliability Bibliography written by and published by . This book was released on 1974 with total page 888 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Reliability and Failure of Electronic Materials and Devices

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Author :
Publisher : Academic Press
ISBN 13 : 0080575528
Total Pages : 759 pages
Book Rating : 4.0/5 (85 download)

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Book Synopsis Reliability and Failure of Electronic Materials and Devices by : Milton Ohring

Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Academic Press. This book was released on 2014-10-14 with total page 759 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

Reliability Abstracts and Technical Reviews

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Author :
Publisher :
ISBN 13 :
Total Pages : 644 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Reliability Abstracts and Technical Reviews by :

Download or read book Reliability Abstracts and Technical Reviews written by and published by . This book was released on 1967 with total page 644 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Microelectronics Failure Analysis

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Author :
Publisher : ASM International
ISBN 13 : 1615037268
Total Pages : 673 pages
Book Rating : 4.6/5 (15 download)

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Book Synopsis Microelectronics Failure Analysis by : EDFAS Desk Reference Committee

Download or read book Microelectronics Failure Analysis written by EDFAS Desk Reference Committee and published by ASM International. This book was released on 2011 with total page 673 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes bibliographical references and index.

Solder Materials

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Author :
Publisher : World Scientific
ISBN 13 : 9813238216
Total Pages : 388 pages
Book Rating : 4.8/5 (132 download)

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Book Synopsis Solder Materials by : Kwang-lung Lin

Download or read book Solder Materials written by Kwang-lung Lin and published by World Scientific. This book was released on 2018-07-13 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.

Designing Capable and Reliable Products

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Author :
Publisher : Butterworth-Heinemann
ISBN 13 : 0750650761
Total Pages : 417 pages
Book Rating : 4.7/5 (56 download)

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Book Synopsis Designing Capable and Reliable Products by : J. D. Booker

Download or read book Designing Capable and Reliable Products written by J. D. Booker and published by Butterworth-Heinemann. This book was released on 2001-04-03 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: Practical methods for analysing mechanical designs with respect to their capability and reliability are combined in this volume. The book is written with postgraduate students and professional engineers in mind.

Research and Technology Program Digest

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Author :
Publisher :
ISBN 13 :
Total Pages : 792 pages
Book Rating : 4.F/5 ( download)

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Book Synopsis Research and Technology Program Digest by : United States. National Aeronautics and Space Administration

Download or read book Research and Technology Program Digest written by United States. National Aeronautics and Space Administration and published by . This book was released on with total page 792 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Capacitive and Resistive Electronic Components

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Author :
Publisher : CRC Press
ISBN 13 : 9782881249990
Total Pages : 404 pages
Book Rating : 4.2/5 (499 download)

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Book Synopsis Capacitive and Resistive Electronic Components by : D.S. Campbell

Download or read book Capacitive and Resistive Electronic Components written by D.S. Campbell and published by CRC Press. This book was released on 1994-05-01 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt: This text, though primarily concerned with the properties and structure of resistors and capacitors, also provides a comprehensive general introduction to the electronic properties of materials used in the manufacture of electronic components. Coverage includes the band theory of materials and the conduction mechanisms in metals, dielectrics and other structures. The manufacture, structure and properties of fixed and variable resistors and capacitors are discussed in detail. Also included are non-linear components such as NTC and PTC thermistors, strain gauges, pressure transducers, varistors and sensors. The text concludes with a chapter on the quality and reliability of electronic devices with practical values of field reliability performance quoted.

Research and Technology Program Digest Flash Index

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Author :
Publisher :
ISBN 13 :
Total Pages : 794 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Research and Technology Program Digest Flash Index by :

Download or read book Research and Technology Program Digest Flash Index written by and published by . This book was released on 1967 with total page 794 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Electronic Systems Effectiveness and Life Cycle Costing

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 364282014X
Total Pages : 728 pages
Book Rating : 4.6/5 (428 download)

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Book Synopsis Electronic Systems Effectiveness and Life Cycle Costing by : J. K. Skwirzynski

Download or read book Electronic Systems Effectiveness and Life Cycle Costing written by J. K. Skwirzynski and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 728 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume contains the complete proceedings of a NATO Advanced Study Institute on various aspects of the reliability of electronic and other systems. The aim of the Insti~ute was to bring together specialists in this subject. An important outcome of this Conference, as many of the delegates have pointed out to me, was complementing theoretical concepts and practical applications in both software and hardware. The reader will find papers on the mathematical background, on reliability problems in establishments where system failure may be hazardous, on reliability assessment in mechanical systems, and also on life cycle cost models and spares allocation. The proceedings contain the texts of all the lectures delivered and also verbatim accounts of panel discussions on subjects chosen from a wide range of important issues. In this introduction I will give a short account of each contribution, stressing what I feel are the most interesting topics introduced by a lecturer or a panel member. To visualise better the extent and structure. of the Institute, I present a tree-like diagram showing the subjects which my co-directors and I would have wished to include in our deliberations (Figures 1 and 2). The names of our lecturers appear underlined under suitable headings. It can be seen that we have managed to cover most of the issues which seemed important to us. VI SYSTEM EFFECTIVENESS _---~-I~--_- Performance Safety Reliability ~intenance ~istic Lethality Hazards Support S.N.R. JARDINE Max. Vel. etc.

ESD Basics

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Publisher : John Wiley & Sons
ISBN 13 : 1118443268
Total Pages : 244 pages
Book Rating : 4.1/5 (184 download)

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Book Synopsis ESD Basics by : Steven H. Voldman

Download or read book ESD Basics written by Steven H. Voldman and published by John Wiley & Sons. This book was released on 2012-08-22 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electrostatic discharge (ESD) continues to impact semiconductor manufacturing, semiconductor components and systems, as technologies scale from micro- to nano electronics. This book introduces the fundamentals of ESD, electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic compatibility (EMC), and latchup, as well as provides a coherent overview of the semiconductor manufacturing environment and the final system assembly. It provides an illuminating look into the integration of ESD protection networks followed by examples in specific technologies, circuits, and chips. The text is unique in covering semiconductor chip manufacturing issues, ESD semiconductor chip design, and system problems confronted today as well as the future of ESD phenomena and nano-technology. Look inside for extensive coverage on: The fundamentals of electrostatics, triboelectric charging, and how they relate to present day manufacturing environments of micro-electronics to nano-technology Semiconductor manufacturing handling and auditing processing to avoid ESD failures ESD, EOS, EMI, EMC, and latchup semiconductor component and system level testing to demonstrate product resilience from human body model (HBM), transmission line pulse (TLP), charged device model (CDM), human metal model (HMM), cable discharge events (CDE), to system level IEC 61000-4-2 tests ESD on-chip design and process manufacturing practices and solutions to improve ESD semiconductor chip solutions, also practical off-chip ESD protection and system level solutions to provide more robust systems System level concerns in servers, laptops, disk drives, cell phones, digital cameras, hand held devices, automobiles, and space applications Examples of ESD design for state-of-the-art technologies, including CMOS, BiCMOS, SOI, bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, smart power, magnetic recording technology, micro-machines (MEMs) to nano-structures ESD Basics: From Semiconductor Manufacturing to Product Use complements the author’s series of books on ESD protection. For those new to the field, it is an essential reference and a useful insight into the issues that confront modern technology as we enter the Nano-electronic Era.

ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis

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Author :
Publisher : ASM International
ISBN 13 : 1627082735
Total Pages : 540 pages
Book Rating : 4.6/5 (27 download)

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Book Synopsis ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis by : ASM International

Download or read book ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2019-12-01 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

Automotive Electronics Reliability

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Author :
Publisher : SAE International
ISBN 13 : 0768034922
Total Pages : 377 pages
Book Rating : 4.7/5 (68 download)

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Book Synopsis Automotive Electronics Reliability by : Ronald K Jurgen

Download or read book Automotive Electronics Reliability written by Ronald K Jurgen and published by SAE International. This book was released on 2010-08-10 with total page 377 pages. Available in PDF, EPUB and Kindle. Book excerpt: Vehicle reliability problems continue to be the news because of major vehicle recalls from several manufacturers. This book includes 40 SAE technical papers, published from 2007 through 2010, that describe the latest research on automotive electronics reliability technology. This book will help engineers and researchers focus on the design strategies being used to minimize electronics reliability problems, and how to test and verify those strategies. After an overview of durability, risk assessment, and failure mechanisms, this book focuses on state-of-the-art techniques for reliability-based design, and reliability testing and verification. Topics include: powertrain control monitoring distributed automotive embedded systems model-based design x-by-wire systems battery durability design verification fault tree analysis The book also includes editor Ronald K. Jurgen’s introduction ,“Striving for Maximum Reliability in a Highly Complex Electronic Environment”, and a concluding section on the future of electronics reliability, including networking technology, domain control units, the use of AUTOSAR, and embedded software.